Global Semiconductor Industry Updates

1. SanDisk has canceled its plans to build a factory in Monti Town, abandoning its $55 billion semiconductor manufacturing project investment.

2. Japanese chip manufacturer Kioxia issued a $2.2 billion bond, becoming the first Japanese company to impact the overseas credit market.

3. Automaker Stellantis has halted its hydrogen fuel cell project and the production of hydrogen-powered vehicles.

4. Coreweave will invest $6 billion in Pennsylvania to build an AI data center.

5. SK Keyfoundry, in partnership with LB Semicon, has successfully co-developed a critical packaging technology based on 8-inch wafers, Direct RDL (re-Distribution Layer), and completed reliability testing.

6. Oracle plans to invest $3 billion over the next five years in Germany and the Netherlands to strengthen its AI and cloud computing services infrastructure in the European market.

China Semiconductor Industry Updates

1. The "Pinyuan AI All-in-One" series (PYD10-MIN/PRO/MAX) was released in Shenzhen. The product features China’s first mass-produced high-performance AI chip.

2. BYD has launched its car models with hand-held car connectivity, fully compatible with OPPO, Vivo, Xiaomi, Honor, Realme, OnePlus, and iQOO phone brands.

3. Kinghelm Electronics (www.kinghelm.com.cn) has updated its slogan font to "Kinghelm: Connecting the World," which will be fully implemented on the newly upgraded official website.

4. Geely and Zeekr have announced their merger, with Geely set to acquire the shares it does not already hold in Zeekr.5. According to CCTV News, the world’s first international standard for silicon-based anode materials for lithium-ion batteries, led by China, has been officially released.

6. Chinese power semiconductor manufacturers CR Micro, Silan Microelectronics, BYD, and CRRC have entered the global TOP 20 for 2024.