Global Semiconductor Industry Updates

1. Intel has discontinued support for its Deep Link technology suite and stated that no further updates will be provided in the future. Its customer service channels will also no longer offer official support.

2. OKI Circuit Technology has launched a 124-layer printed circuit board, surpassing the long-standing industry limit of 108 layers.

3. Infineon’s smart power plant in Germany has received €1 billion in funding support from the German Federal Ministry for Economic Affairs.

4. Samsung’s semiconductor division has introduced Google and Microsoft models as internal AI tools for work assistance, following Meta’s lead.

5. Panasonic, a Japanese electronics group, has announced plans to lay off 10,000 employees globally.

6. South Korean equipment manufacturer Hanmi Semiconductor has reportedly notified Chinese manufacturers that it will soon stop supplying thermal compression bonding machines.

China Semiconductor Industry Updates

1. Lenovo’s upcoming Yoga Pad Pro is expected to feature an in-house developed SoC chip code-named "SS1101."

2. Changchuan Technology, together with the Shanghai Equipment Phase II Fund and Benjian Xinchian, has jointly invested in establishing Hangzhou Changyue Technology Co., Ltd. (tentative name), with plans to engage in the domestic production of high-end packaging and testing equipment.

3. On May 10, 2025, Slkor (www.slkoric.com) and Jin Hangbiao jointly held a one-day training event focusing on "Master-Apprentice Development Process" and "Standardization of Corporate VIS Systems."

4. Hua Xin Crystal Semiconductor has successfully developed a 2-inch gallium oxide single crystal.

5. Yangjie Technology held a groundbreaking ceremony for its SiC automotive-grade power semiconductor module packaging project, with a total investment of 1 billion yuan, in the Weiyang Economic Development Zone.

6. Nan Zhi Optoelectronics has launched a specialized large model in the field of photonic chips—OptoChat AI.