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Foxconn Expands in France with €250M Facility Focused on FOWLP

release time:2025-05-22Author source:SlkorBrowse:878

Global Semiconductor Industry Updates

1. After news broke that Wolfspeed is planning to file for bankruptcy, the company's stock price dropped by more than 57% in after-hours trading.

2. Intel has publicly unveiled its next-generation Panther Lake processors, expected to be called the Core Ultra 300 series, with a large-scale release planned for next year.

3. In Q1 2025, the global NAND Flash market size was just $13.01 billion, marking the lowest level in the past five quarters.

4. Elon Musk stated that XAI plans to build a factory in the outskirts of Memphis with one million GPUs.

5. Malaysia plans to introduce incentives for the semiconductor industry in July.

6. SK hynix has launched a mobile solution for 4D NAND flash memory, the UFS 4.1.

 

China Semiconductor Industry Updates

1. Shanghai Silicon Industry intends to acquire stakes in three companies—Xinsheng Jingtou, Xinsheng Jingke, and Xinsheng Jingrui—for 7 billion yuan.

2. Foxconn Technology Group is investing 250 million euros to build an assembly and testing facility in France, primarily using Fan-Out Wafer-Level Packaging (FOWLP) technology.

3. This Saturday morning, Slkor (www.slkormicro.com) and Kinghelm will invite former senior executives from major companies to conduct specialized training on organizational entropy management and building dissipative organizations, empowering wolf-like team building.

4. MediaTek’s first 2nm chip is expected to complete tape-out in September this year.

5. The Longgang District of Shenzhen has launched a government-affiliated agency focused on artificial intelligence (AI) and robotics—the Longgang AI (Robotics) Bureau.

6. BOE’s Chengdu 8.6-generation AMOLED display production line has begun the equipment installation phase four months ahead of schedule, setting a new global benchmark for production line construction speed.

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