Global Semiconductor Industry Updates

1. According to reports, India will release domestically developed [sensitive content] semiconductor chips (using a 28nm process) in 2025, while six semiconductor factories are currently under construction.

2. Nikon has launched the “DSP-100” digital lithography machine for semiconductor back-end processes, which is expected to be available in 2026.

3. German company Wacker has officially started using its new next-generation production line, which is designed to manufacture ultra-high purity polysilicon.

4. OpenAI CEO Sam Altman revealed that OpenAI is expected to “deploy over 1 million GPUs” by the end of this year.

5. Japan's Kioxia has launched the LC9 series solid-state drives, with a storage capacity of 245.76TB, making it the largest storage device available to date.

6. Japan’s Proterial has developed electric vehicle motor magnets that do not require the use of heavy rare-earth metals, a breakthrough that is expected to alleviate supply chain concerns stemming from China’s restrictions on such materials.

China Semiconductor Industry Updates

1. Zhongke Semiconductor has launched four GaN (Gallium Nitride) ASIC smart fast-charging chips designed specifically for robotics scenarios: CT-3602, CT-1020, CT-1007, and CT-1901.

2. The first domestic 100-ton-level semiconductor KrF photoresist resin high-automation flexible/mass production dual production line, funded by Bayi Shikong, has been completed. Once at full capacity, the project is expected to generate over 100 million yuan in revenue.

3. The Beijing Tongxin Technology Operations Center has moved into Huaqiang Plaza in Shenzhen. Guests attending the event include Zhou Shengming from the Shenzhen Semiconductor Association, Professor Wang Xinan from Peking University, Zhu Liguo from the Shandong Chamber of Commerce, Wu Bo from Lichuang Mall, Song Shiqiang from Sako Micro Semiconductor (www.slkormicro.com), He Junju, and others, who gathered to witness and support the rise of domestic semiconductors.

4. A research team composed of scientists from Peking University and Renmin University has pioneered the “steaming basket” method, successfully achieving wafer-level integrated manufacturing of high-quality indium selenide materials internationally.

5. Jinghe Integration’s revenue exceeded 5 billion yuan in the first half of 2025, with net profits [sensitive content] seeing double-digit growth.

6. The National Dairy Technology Innovation Center's R&D team has successfully developed a genetic evaluation chip for dairy cow breeding embryos, as well as a “high yield, disease-resistant, long production period” functional genome prediction chip.