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release time:2025-05-23Author source:SlkorBrowse:1092
Global Semiconductor Industry Updates
1. The Agency for Science, Technology and Research (A*STAR) in Singapore has announced the launch of an industrial-grade 200mm Silicon Carbide (SiC) open R&D production line.
2. The Bluetooth Special Interest Group (SIG) forecasts that global Bluetooth device shipments will exceed 5.3 billion units by 2025 and reach nearly 8 billion units by 2029.
3. In Q1 2025, the global smartphone market grew by 2% year-on-year, with Samsung maintaining a 20% market share, leading the global market.
4. Google has released several AI models, including Gemini 2.5 Pro, the Gemini Diffusion language model, the Veo 3+ Flow video generation model, and the Imagen 4 image generation model.
5. Kinghelm (www.kinghelm.com.cn) and Slkor's Song Shiqiang have published a new article titled "Sako Micro's Song Shiqiang: Trials and Reflections on AI Large Model Text Writing!" which has been widely shared by major domestic media outlets, such as With You Network, Changsha Information Base Network, Sichuan Focus News Network, Shenzhen News Network, and Toutiao, with total views surpassing two million!
6. The impact of Bluetooth technology is expanding, with increasing usage in applications for smart devices, wireless audio, connected cars, and industrial IoT.
China Semiconductor Industry Updates
1. The third-phase Silicon Carbide production line in Zhuzhou has successfully completed the main building’s roofing by May 2025. This project uses 8-inch SiC wafers.
2. The Hongsheng Semiconductor project has completed 70% of its overall progress and, once in production, will have the capacity to produce 5 billion semiconductor plastic-encapsulated devices annually.
3. The 6th China MEMS Manufacturing Conference and Micro-Nano Manufacturing and Sensor Exhibition will be held at the Suzhou International Expo Center from October 22 to 24, 2025.
4. Hulin Tong Industrial (Shanghai) Co., Ltd. has been established with Wei Lingyun as the legal representative and a registered capital of 8 million USD (approximately 57.7 million CNY).
5. Zhaoyi Innovation plans to issue H-shares for overseas listing and will be listed on the main board of the Hong Kong Stock Exchange.
6. The Phase II project of the third-generation and advanced semiconductor standardized factory is progressing at full speed and is expected to be completed by the end of July this year.
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