Global Semiconductor Industry Updates

1. The global robotics landscape is undergoing a massive shift. The dominant position of traditional industrial robot giants—ABB, Fanuc, Yaskawa, and KUKA—is no longer as unchallenged, with collaborative robots and embodied intelligence robots emerging as new faces in the market.

2. From 2025 to 2030, GMSL/LVDS will continue to dominate sensor links, while in-vehicle Ethernet will dominate the backbone network.

3. GlobalFoundries (GF) plans to invest $16 billion (approximately 114.86 billion RMB) to expand its semiconductor manufacturing and advanced packaging capabilities at its factories.

4. Global Bluetooth device shipments are expected to surge from 5 billion units in 2023 to 7.5 billion units by 2028, with a compound annual growth rate (CAGR) of 8%.

5. On June 7, Kinghelm/Slkor training will become a regular activity: at 9:30 AM, Yang Bo, Business Director of Kinghelm (www.kinghelm.com.cn), will deliver an insightful talk on "Connector Sales Techniques and Strategies"; at 2:00 PM, Qiu Huilin, Director of the Overseas Division at Slkor, will provide training on "From Mindset to Methodology Leap."

6. Microsoft has become a leader in the commercialization of Artificial Intelligence (AI) due to its $13.75 billion investment in OpenAI and support for its cloud infrastructure.

China Semiconductor Industry Updates

1. The advanced wafer-level semiconductor packaging project, with a total investment of 1.05 billion RMB, has officially landed in Zhejiang.

2. Chinese car manufacturers ramped up their efforts to enter the UK market in May, with their market share approaching 10%.

3. Jinglue Semiconductor has completed several hundred million RMB in financing, primarily to support the accelerated research, innovation, and mass production of automotive connectivity and switching chips.

4. The fourth-generation diamond semiconductor project, with a total investment of 265 million RMB, has officially settled in the Ganquanpu Economic Development Zone in Urumqi.

5. The 2025 Matter China Developer Conference will be grandly held at the Langham Hotel in Guangzhou on June 13.

6. Baiwei Tech has launched the TDP200 series industrial-grade M.2 PCIe SSD specifically designed for industrial big data transmission.