Global Semiconductor Industry Updates

1. Micron has delivered samples of its 12-layer stacked 36GB HBM4 to several major customers. The new HBM4 is built using the advanced 1β (1-beta) DRAM process.

2. Samsung's Exynos 2600 prototype chip has entered mass production, utilizing Samsung's 2nm GAA process.

3. Samsung Electronics and Nvidia will invest in the startup robotics software development company Skild AI to strengthen their presence in the emerging consumer robotics sector.

4. ChatGPT developer OpenAI is in talks with Saudi Arabia’s Public Investment Fund (PIF), India's Reliance Industries, and existing shareholder UAE's MGX for its $40 billion funding round.

5. Kinghelm (www.kinghelm.com.cn) will soon release an exclusive interview with Dr. Zhu Junshan from Huaqiangbei, praised by Mr. Song Shiqiang: "Dr. Zhu has maintained the traditional scholarly elegance of Chinese culture while succeeding in business, becoming a stabilizing force in this restless society!"

6. Silicon Intellectual Property (Silicon IP) is increasingly becoming a key driving force in System-on-Chip (SoC) design, product development, and shortening time-to-market (TTM).

China Semiconductor Industry Updates

1. Sucos Semiconductor has successfully completed the factory acceptance of its high-performance TGV electroplating equipment designed for Triassic.

2. Semiconductor giant Shengmei Shanghai plans to raise up to 4.482 billion yuan, primarily for R&D and the construction of process testing platforms, as well as high-end equipment iterative R&D.

3. Xindonglai will establish a photolithography machine refurbishment assembly base and technology reform R&D center in Changshu Economic Development Zone, with a total investment of 45 million yuan. The facility is expected to achieve an annual output value of over 150 million yuan upon full production.

4. Botao has launched a new APCVD equipment series capable of depositing a variety of thin-film materials, including SiO₂, Si₃N₄, and BPSG, and is widely applicable to power devices, MEMS, advanced packaging, and other diversified applications.

5. The "Youming Innovative Industrial Manufacturing Base Project," with a total investment of 500 million yuan, is expected to be accepted in September this year and begin production within the year.

6. FabX, a project under Zonghui Xinguang, has successfully achieved circuit connection. The project, with an investment of 550 million yuan, aims to build a semiconductor laser chip production line with an annual capacity of 50 million chips.