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Electronics Basics
Technical Information for semiconductors and electronics.
  • Updated: 2023-10-12
  • Views: 14032
Recently, the SSMB-EUV light source technology proposed by Tsinghua University has attracted great public interest. One claim is that China can build accelerators to generate EUV light sources, and different frequencies of light sources can be used for various chip processes such as 28nm, 14nm, 7nm, and 5nm. Instead of……
  • Updated: 2023-10-12
  • Views: 11657
Completing a semiconductor chip involves many steps, and it is important to screen out defective chips through testing. Many tests are conducted during the semiconductor manufacturing process.
  • Updated: 2023-10-12
  • Views: 10999
Semiconductors possess both "conductor" properties, allowing electric currents to pass through, and "insulator" properties, which do not allow electric currents to pass. The ion implantation process adds impurities to pure silicon to give it conductivity. We can make the semiconductor conductive or insulating depending……
  • Updated: 2023-10-12
  • Views: 11530
Semiconductor chips are composed of many microscale layers that are smaller than a fingernail and thinner than paper. The semiconductor is stacked high and dense, forming complex structures similar to high-rise buildings. To create such structures, the following steps need to be repeated multiple times: lithography ……
  • Updated: 2023-10-11
  • Views: 12382
In the previous article, we introduced the photolithography process, which uses a photomask to project the designed circuit patterns onto the surface of the wafer coated with photoresist. The next step is to perform the etching process on the wafer to remove unwanted material and retain only the desired pattern.
  • Updated: 2023-10-11
  • Views: 11497
In previous articles, we introduced wafer fabrication, oxidation processes, and a partial history of integrated circuits. Now, let's continue to explore the photolithography process, which transfers the electronic circuit patterns onto the wafer. Photolithography is similar to taking photographs with a film camera, but……
  • Updated: 2023-10-11
  • Views: 11760
During the "oxidation" step, an oxide layer (SiO₂) is formed on the surface of the wafer. The wafer is the most important material in semiconductor processing. The oxide layer protects the surface of the wafer from impurities, and the next step is to design the semiconductor circuit. What does the circuit in a semic……
  • Updated: 2023-10-11
  • Views: 11153
Semiconductors have become an essential part of our lives. Today, we return to the "Eight Basic Semiconductor Processes" series to continue exploring semiconductor manufacturing processes. In the previous article, we learned about the wafer manufacturing process. In this article, we will introduce the oxidation process……
  • Updated: 2023-10-11
  • Views: 12733
Could our lives last a day without semiconductors? Many aspects of our daily lives, including smartphones, laptops, cars, televisions, and credit cards, are inseparable from semiconductors. These semiconductors have a profound impact on our lives. So, how are they made?
  • Updated: 2023-10-10
  • Views: 12801
If you are interested in the semiconductor industry, it is crucial to have a solid understanding of the "eight basic semiconductor manufacturing processes." We have prepared a series of articles about semiconductor manufacturing processes for those who need to review or improve their knowledge on this topic. We will in……
  • Updated: 2023-10-09
  • Views: 12326
In the current IGBT surface structure, planar and trench types can be said to be evenly matched. When many readers first encounter these two terms, they may mistakenly think that the current of the planar IGBT flows horizontally, while the current of the trench-gate IGBT flows vertically. In fact, this is a misundersta……
  • Updated: 2023-10-08
  • Views: 11863
VII. Future Development Trends 7.1 Smaller process nodes One of the main trends in future lithography is towards smaller process nodes. Semiconductor manufacturers have been pursuing smaller and more compact electronic components for improved perfor

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