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Electronics Basics
Technical Information for semiconductors and electronics.
  • Updated: 2024-03-22
  • Views: 15893
In modern industrial production, especially in automated processes, sensors are almost indispensable. Specifically, industrial producers need to use various sensors to monitor and control various parameters in the production process, ensuring that equipment operates normally and any faults can be promptly detected.
  • Updated: 2024-03-21
  • Views: 19220
Flip chip technology originated from IBM, which developed the process of creating bumps on chips for flip chip soldering in 1960. The process involved surrounding the bumps with 95Pb5Sn encasing electroplated NiAu bumps. Later, PbSn bumps were used, employing Controlled Collapse Component Connection (C4) technology, in……
  • Updated: 2024-03-21
  • Views: 18363
The bipolar junction transistor was invented by a research team at Bell Laboratories in 1947. The first transistor consisted of two metal wires with sharp endpoints making point contact with a germanium substrate. While primitive by today's standards, this first transistor significantly transformed the entire electroni……
  • Updated: 2024-03-20
  • Views: 14928
In daily life, all objects can be roughly classified by their electrical conductivity into three categories: conductors, semiconductors, and insulators. This is easy to understand; objects either conduct electricity, do not conduct electricity, or conduct a little bit. It is precisely these materials that are ambiguou……
  • Updated: 2024-03-14
  • Views: 16041
Explanation of Common Semiconductor Defect Terminology
  • Updated: 2024-03-13
  • Views: 18884
Photolithography technology, as a precision microfabrication process, involves transferring meticulously designed micro-patterns onto photosensitive materials. At its core, it utilizes photolithography machines to accurately project patterns onto substrates, enabling the precise manufacturing of microstructures.
  • Updated: 2024-03-13
  • Views: 15865
Parasitic Capacitance and Temperature Characteristics of MOSFET
  • Updated: 2024-03-12
  • Views: 15297
​Semiconductor materials are at the core of the semiconductor industry, serving as the foundation for manufacturing electronic and computer chips. There is a wi……
  • Updated: 2024-03-11
  • Views: 19228
Introduction: Electronic devices are a very complicated system. The defects and failures of the packaging process are also very complicated. Therefore, the research packaging defect and failure need to have a systematic understanding of the packaging process, so as to analyze the causes of defects from multiple angles.……
  • Updated: 2024-03-11
  • Views: 22140
GD32 is a single chip microcomputer developed in China. It is said that the developer is from ST Company, and GD32 is also made with STM32 as a template. Therefore, GD32 and STM32 are the same in many places.However, GD32 is a different product after all, and it is impossible to follow STM32 for everything. Some self-d……
  • Updated: 2024-03-11
  • Views: 22276
Vehicle-mounted radar is one of the core sensors of Advanced Assisted Driving (ADAS) and unmanned driving, and the vehicle-mounted radar chip is the core of vehicle-mounted radar. Nowadays, the highly integrated (MMIC+DSP/MCU) vehicle-level chip provides a key way for miniaturization, high reliability, stability and lo……
  • Updated: 2024-03-11
  • Views: 16367
The difference between the IGBT discrete and the IGBT module IGBT module can be regarded as the functional improvement and upgrade of the IGBT discrete. Their application fields are basically the same. However, due to the integration of various drivers and protection circuits, the installation of the IGBT module is gre……

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