Global Semiconductor Industry Updates

1. The global semiconductor industry is continuously expanding under the influence of emerging applications such as AI, high-performance computing (HPC), 5G, and automotive electronics, driving advanced packaging technology to become a key focus.

2. The 2026 China Semiconductor Advanced Packaging Conference and Exhibition will be held in Shanghai Pudong, China, from March 22-23, 2026.

3. Siemens' Electronic Design Automation (EDA) division may suspend its support and services for mainland China.

4. As a global leader in high-quality semiconductor packaging substrates and printed circuit board manufacturing, AT&S (Austria Technologie & Systemtechnik AG) has officially commenced production at its new factory in the Kulim Hi-Tech Park, Malaysia, and is now capable of full-scale mass production.

5. Kinghelm (www.kinghelm.com.cn), a national high-tech enterprise, is currently recruiting 8 sales engineers for Beidou GPS antennas and connectors, and 3 engineers for high-speed connector product development. Referrals are welcome.

6. Intel and SoftBank have established Saimemory to develop stacked DRAM as an alternative to HBM.

China Semiconductor Industry Updates

1. Huike Co., Ltd. plans to invest in the construction of the Huike Full-Spectrum M-LED New Display Chip Base Project in Shunqing District, with a total investment of approximately 10 billion yuan.

2. Zhuhai has released a policy offering up to 30 million yuan in support for AI and robotics technology research and development, with the introduction of "computing power coupons" and "model coupons" to assist businesses.

3. Guangdong Yuefang Technology has launched the LeapAIET, an integrated development platform for RISC-V edge AI, addressing industry pain points.

4. Horizon Robotics-W (9660.HK) subsidiary Digua Robotics has completed a $100 million Series A funding round.

5. Baidu (Shandong) Artificial Intelligence Co., Ltd. has been established, with Wang Sheng as the legal representative and a registered capital of 10 million RMB.

6. Saimu Technology and Autonavi Software Co., Ltd. officially signed a three-year strategic cooperation agreement in Hong Kong. The two parties will collaborate deeply in the fields of smart equipment, intelligent transportation, and smart cities to jointly promote the development of the low-altitude economy and smart mobility industry.