SLKOR I-SL-W-TRS-5.5Dx izixazululo zohlelo lokusebenza lwe-infrared thermopile chip yedijithali

Ukusiza amakhasimende ukuthi asebenzise ngokugcwele SLKORImikhiqizo, inkampani isanda kwethula i-SL-W-TRS-5.5Dx digital infrared thermopile chip kanye nezisombululo zayo zohlelo lokusebenza ezihambisana nayo, ihlinzeka ngosekelo oluphelele lwezobuchwepheshe. Ithimba lezobuchwepheshe e Shenzhen SLKOR Inkampani Micro Semicon Co., Ltd. uvela eNyuvesi yaseTsinghua kanye neNyuvesi yaseYonsei eNingizimu Korea, ehola inkampani ngezinto ezintsha, izinqubo, nemikhiqizo. Bafunde ubuchwepheshe bedivaysi yamandla ye-silicon carbide esezingeni eliphezulu emhlabeni jikelele kusenesikhathi. SLKOR iyibhizinisi lobuchwepheshe obuphezulu elihlanganisa ukwakheka komkhiqizo we-elekthronikhi, ukuthuthukiswa, ukukhiqiza, nokuthengisa, ukuhlinzeka ngemikhiqizo ethembekile kanye nezinsizakalo zobuchwepheshe kumakhasimende ayo. Ngokuthuthuka okusheshayo, inkampani yethula imikhiqizo emisha eyengeziwe ukuze ikhonze amakhasimende futhi ibe negalelo elihle embonini ye-semiconductor, ilwela ukuba "umholi we-semiconductor."

U-Sun Gaofei (kwesokunxele), U-Zhang Junjun(maphakathi) kanye noSolwazi uLi Jianxiong waseTsinghua University

SLKORUmqondisi Wezokukhangisa, u-Sun Gaofei, wethula ukuthi "SLKOR"I-thermopile yedijithali ye-infrared ye-brand yakhelwe ukulinganisa izinga lokushisa okungathinteki muntu emikhakheni efana nemishini yezokwelapha, izinto ezigqokwa ngobuhlakani, izinto zikagesi ezihlakaniphile zasendlini, ukuqapha izinga lokushisa kwezimboni, ukukalwa kwezinga lokushisa komzimba okungathinteki, amathemometha asebunzini, amakhadi omazisi womfundi, nabalindi be-electronic.

I-SL-W-TRS-5.5Dx chip ifaka i-thermopile yedijithali ye-infrared edizayinelwe ukukala izinga lokushisa elingathinteki. Ihlanganisa inzwa ehlanganisiwe ye-thermopile kanye ne-chip yokucubungula ezinikele, evumela ukuxhumana nokufunda idatha ngebhasi le-I2C ngaphandle kwezingxenye zangaphandle ezengeziwe. I-chip iza nezinketho ezijwayelekile zamashubhu ensimbi angu-5mm no-8mm futhi ingasebenza ezindaweni zokushisa ezisukela ku -40°C kuya ku-130°C. Ikala amazinga okushisa oketshezi, izinto (amazinga okushisa angaphezulu), namazinga okushisa omzimba, ngebanga lokulinganisa lika -40°C kuya ku-530°C.

Amamodeli ochungechunge lwe-SL-W-TRS-5.5Dx yilawa:

I-SL-W-TRS-5.5D1 — Inzwa engenalutho, iphakheji ye-TO-46, indawo yokubuka (FOV) = 90°

SL-W-TRS-5.5D2 — TO-46 iphakheji eneshubhu lensimbi elingu-5mm, i-FOV = 75°

SL-W-TRS-5.5D3 — TO-46 iphakheji eneshubhu lensimbi elingu-8mm, i-FOV = 60°

SL-W-TRS-5.5D4 — TO-46 iphakheji eneshubhu lensimbi ngokwezifiso elingu-5mm, i-FOV = 75°

SL-W-TRS-5.5D5 — TO-46 iphakheji eneshubhu lensimbi ngokwezifiso elingu-5mm, i-FOV = 75°

SL-W-TRS-5.5D6 — TO-46 iphakheji eneshubhu lensimbi ngokwezifiso elingu-3.5mm, i-FOV = 75°


2. TUmdwebo wesifunda sohlelo lokusebenza olujwayelekile

2.1 Umgomo wokujikeleza we-SL-W-TRS-5.5Dx

Idivayisi ye-SL-W-TRS-5.5Dx inamaphini amane, okuhlanganisa amandla kanye noxhumo lwebhasi le-I2C, olunobubanzi obuvumelekile bokunikezwa kwamandla kagesi obungu-2.3 ukuya ku-3.6V. Inzwa ngokwayo inokusetshenziswa kwamandla okuphansi, futhi i-capacitor engu-0.1uF yanele phakathi kwamandla nomhlabathi. Uma inzwa itholakala kude namandla kagesi, i-capacitor engu-10uF ingangezwa ukuze kuqinisekiswe amandla azinzile nokunciphisa umsindo.

2.2 Idivayisi ye-SL-W-TRS-5.5Dx isekela iphrothokholi yokuxhumana ye-I2C yokuxhumana kwe-serial. Ukukhethwa kwephrothokholi yokuxhumana kususelwa kusimo sephinikhodi ye-CSB. Ibhasi le-I2C lisebenzisa i-SCL ne-SDA njengemigqa yesignali, yomibili exhunywe ku-VDDIO ngokusebenzisa izinqamuleli zokudonsa ukuze kugcinwe izinga eliphezulu lapho ibhasi lingenzi lutho. Ikheli ledivayisi ye-I2C ledivayisi yedijithali lingalungiswa nge-Chip_Address kurejista 0x92, ngekheli elijwayelekile elingu-7-bit elingu-0x7F lokuxhumana kwe-I2C (njengoba kuboniswe esithombeni esingezansi).

I-I 2C Ikheli elijwayelekile ledivayisi

I 2C Izici zomugqa webhasi we-SDA nemigqa ye-SCL ebhasini le-I2C

I 2C Umdwebo wesikhathi

Iphrothokholi yokuxhumana ye-I 2C

2.3 Uma i-SCL iphakeme futhi i-SDA ishintsha isuka phezulu iye phansi, ikhombisa ukuqala kokuxhumana kwedatha ye-I2C. I-I2C master device ithumela ngokulandelana ikheli le-7-bit lensiza yesigqila, ilandelwe i-R/W control bit ukukhetha imisebenzi yokufunda/ukubhala. Lapho ibona ikheli, isigqila sikhiqiza isignali yokuvuma ngokudonsa i-SDA ephansi phakathi nomjikelezo wesishiyagalolunye we-SCL (ACK). Uma i-SCL iphakeme futhi i-SDA ishintsha ukusuka phansi ukuya phezulu, iphawula ukuphela kokuxhumana kwedatha ye-I2C. Idatha ku-SDA kufanele ihlale izinzile ngenkathi i-SCL iphezulu, futhi ingashintsha kuphela uma i-SCL iphansi.

3.TO-46 Metal tube iphakethe nobukhulu

3.1 Phina izincazelo

3.2 Izidingo zokuklama kwesakhiwo

Kumamodeli anenkomishi yensimbi yokubona, uma kuvunyelwa ngokwesakhiwo, ilensi yenzwa ingase inwebe ngaphezu kwendawo engaphezulu yendlu yedivayisi. Uma kunemikhawulo yobuhle edinga ukuthi ingxenye ihlehliswe, idizayini kufanele iqinisekise ukuthi isakhiwo sigwema ukuphazamisa indawo yokubuka yedivayisi.

Emikhiqizweni edinga ukusetshenziswa kwe-TO46 chip yenzwa engenalutho ngenxa yezidingo ezithile, indawo yokubuka yenzwa (FOV) icishe ibe ngamadigri angu-90. Ngenxa yokuthi izinzwa ze-infrared thermopile zizwela kakhulu ukukhanya nokushisa, izinga lokushisa le-ambient elizinzile linciphisa ukuphazamiseka kokukhanya okunhlanhlathayo, okuholela emiphumeleni yokulinganisa enembe kakhudlwana. Ngokuvamile, ukulinganisa okuqondile ngenzwa akukhuthazwa; ukuhlanganiswa kwesakhiwo kuyadingeka ekusetshenzisweni komkhiqizo. Inzwa ngokwayo iza nesihlungi se-silicon optical, esinciphisa amasignali we-infrared futhi singaholela emiphumeleni yokulinganisa ephansi. Ngaphandle uma kunesidingo, izihlungi ezengeziwe akufanele zengezwe.

4.1 Izidingo zokuklama ezishisayo

Izinga lokushisa le-ambient lithinta kakhulu ukunemba kokulinganisa, ngakho-ke kubalulekile ukugcina inzwa isendaweni ezinzile ukuze ugweme ukuphazamiseka okuvela emithonjeni yokushisa. Ngakho-ke, kufanele ibekwe kude nezingxenye ezikhiqiza ukushisa okuphezulu. Ku-PCB, kuyancomeka ukuthi udizayine izikhala ezizungeze inzwa, uyibeke endaweni engayodwa.

4.2 Ibanga lokulinganisa

Izici zokuphuma kwenzwa zithonywa kakhulu ibanga lapho ikalwa ebangeni eliseduze (ngokuvamile ngaphakathi kuka-20mm welensi yenzwa). Ngakho-ke, ukulinganisa izinga lokushisa lomzimba womuntu, ibanga elinconywayo elingaba ngu-2-5 cm liyelulekwa. Ukuze kukale ezinye izinto, ibanga linganwetshwa inqobo nje uma izidingo zenkundla yokubuka zifinyelelwa.

5. Umklamo wohlelo

5.1 Imodi ejwayelekile: Kule modi, ukucushwa kwe-I2C kwenziwa ngezilungiselelo zerejista, okuvumela ukufundwa kwedatha ye-I2C okuqondile.

5.2 Imodi yokulala:

Kumodi yokulala, ulayini we-SDA uhlehliswa kabusha njengokuphuma kwe-INT, futhi i-I2C ivaliwe kuyilapho i-SCL ihlala iphezulu. Kuqhathaniswa isiteshi senzwa kuphela, hhayi okukhiphayo kwenzwa yangaphakathi yokushisa. Kumodi ye-I2C IDLE, setha okuthi sleep_en = 1 kanye ne-mode_en = 1 ukuze ungene ebuthongweni, obuhlala kusukela ku-100 ms ukuya ku-25.6 s (8-bit). Lapho uvuka, ukuguqulwa kuyenziwa ukuze kutholwe okukhiphayo kokulinganisa kwe-ADC. Ukuhlolwa kwenhlanganisela yesiteshi kwenziwa kusetshenziswa idatha eluhlaza ye-ADC elinganiselwe emngceleni ukuze kuqalise ukuphazamiseka uma izimo zifinyelelwa. Amarejista angalungiswa ukuze aqalise ukuphazamiseka lapho amanani eqa noma ewela ngaphansi komkhawulo omisiwe. Ngemva kokuqhathanisa, idivayisi ibuyela ekulaleni. Ngokuzenzakalelayo, i-SDA ihlala iphezulu; uma kwenzeka ukuphazamiseka, idonswa phansi futhi ibuyiselwe phezulu ngemva kuka-50 ms. Lesi siginali yokuphazamisa ingavusa i-MCU. Uma i-MCU ithola isignali ye-INT, idonsa i-SCL phansi ngaphezu kuka-10 ms, ibuyela kumodi ye-I2C IDLE nge-sleep_en = 0.

6. Ukucatshangelwa kobunjiniyela

Ekwakhiweni kohlelo lokusebenza, kubalulekile ukuqonda izici zento yokulinganisa (uketshezi, okuqinile, noma umzimba womuntu), ibanga lokulinganisa, nebanga lokushisa. Ngokusekelwe endaweni yohlelo lokusebenza, ukulungiselelwa kwe-algorithm kubalulekile ukuze kuthuthukiswe ukunemba kokulinganisa.

Ama-algorithms we-chip wangempela aklanyelwe ukuqinisekisa ukunemba okucacisiwe kuphela ngaphansi kokulinganisa okushisayo nezimo ze-isothermal (lapho ungekho khona umehluko wezinga lokushisa kuyo yonke iphakheji yenzwa). Noma iyiphi i-gradient yezinga lokushisa ngaphakathi kwephakheji yenzwa ingaba nomthelela omubi ekunembeni kokulinganisa. Izimo ezingabangela ukuhluka kwezinga lokushisa zihlanganisa izingxenye ezikhiqiza ukushisa ezitholakala phansi noma eduze naphansi noma emaceleni enzwa, noma lapho inzwa ibekwe eduze kakhulu nento elinganiswayo, okungaholela ekushiseni kwendawo kwenzwa.

Uma unemibuzo noma izidingo ezihlobene nemikhiqizo kanye nezixazululo zohlelo lokusebenza kusuka SLKOR, sicela ukhululeke ukuxhumana nathi. Silapha ukuze sinikeze ukwesekwa nosizo oluzinikele!