Isekhethi ehlanganisiwe: Ukuhlanganiswa kwezingxenye ze-elekthronikhi eziningi ku-substrate ukuze kuqedelwe isekethe ethile noma umsebenzi wesistimu.

I-IC Chip/Component Number Industry Cycle

Akukho ukuhlanganiswa 1 ngaphambi kuka-1960

Isikali Esincane (SSI) 2 kuya ku-50 Ekuqaleni kwawo-1960

I-Medium Scale (MSI) 50 kuya ku-5000 1960 kuya ekuqaleni kwawo-1970

I-Large-scale (LSI) 5000 kuya ekuqaleni kuya ngasekupheleni kuka-100,020 1970 s

Isilinganiso esikhulu kakhulu (VLSI) 100000 kuya ku-1,000,020 ngasekupheleni kwawo-1970 kuya ngasekupheleni kwawo-1980

Isikali esikhulu kakhulu (ULSI) sikhulu kuno-1,000,020 ngasekupheleni kwawo-1990 kuze kube manje

Ukulungiswa kwe-wafer (ukulungiswa kwe-wafer)

Ukwenziwa kwe-wafer (Ukukhiqiza i-Silicon Wafer)

Ukuhlolwa kwe-wafer / uhlobo

Ukuhlanganisa nokupakisha (ukuhlanganisa nokupakisha)

Isivivinyo sokugcina

Isiqondiso sokuthuthukiswa: thuthukisa ukusebenza kwe-chip-thuthukisa isivinini (nciphisa usayizi oyinhloko, thuthukisa ukuhlanganiswa, ucwaningo nokuthuthukiswa usebenzisa izinto ezintsha), yehlisa ukusetshenziswa kwamandla.

Thuthukisa ukwethembeka kwe-chip-ukulawula okuqinile kokunukubezeka.

Ububanzi bomugqa obuncishisiwe obuncishisiwe, ukwanda kobubanzi bewafa.

Umthetho kaMoore uthi ukuhlanganiswa kwama-IC kuzophindeka kabili njalo ngemva konyaka.

1975 yabuyekezwa ukuze: Ukuhlanganiswa kwe-IC kuzophindeka kabili njalo ngonyaka nesigamu.

Isendlalelo se-oxidation yemvelo: Uma sichayeke emoyeni ekamelweni lokushisa noma emanzini akhishwe enziwe nge-oxygen aqukethe umoya-mpilo oncibilikisiwe, ingaphezulu lewafa ye-silicon lizokwenziwa i-oxidized. Lolu ngqimba oluncane lwe-oxide lubizwa ngokuthi ungqimba lwe-oxide lwendabuko. Ukukhula kwengqimba yemvelo ye-oxide yokuqala ku-silicon wafer kuqala ngomswakama. Lapho ingaphezulu le-silicon wafer livezwa emoyeni, inqwaba yezingqimba zama-molecule wamanzi akhangiswa ku-silicon wafer bese ingena endaweni ye-silicon phakathi nomzuzwana owodwa, okubangela ukuthi ingaphezulu le-silicon likhiphe ngisho nasezingeni lokushisa elilingana negumbi.

Izinkinga ezibangelwa ungqimba lwe-oxide yemvelo yilezi:

① Izovimbela ezinye izinyathelo zenqubo, ezifana nokukhula kwamafilimu amancane ekristalu eyodwa kanye nokukhula kwezingqimba ze-ultra-thin oxide kumawafa e-silicon.

Enye inkinga ukuthi indawo yokuxhumana ye-conductor yensimbi, uma kukhona ungqimba lwe-oxide, izokwandisa ukumelana nokuxhumana, ukunciphisa noma ngisho nokuvimbela ukugeleza kwamanje.

③ inethonya elikhulu ekusebenzeni kwesemiconductor nokuthembeka

1. Uchwepheshe wokukhiqiza i-silicon wafer: unesibopho sokusebenzisa imishini yokukhiqiza i-silicon wafer. Okunye ukugcinwa kwemishini kanye nophenyo lwamaphutha oluyisisekelo lwenqubo nemishini.

2. Uchwepheshe wezinto zokusebenza: Buza mayelana namaphutha futhi ugcine izinhlelo zemishini ethuthukisiwe ukuze uqinisekise ukusebenza kahle kwemishini ngesikhathi sokukhiqiza ama-wafer.

3. Unjiniyela Wezisetshenziswa: Ubambe iqhaza ekunqumeni amapharamitha wokuklama okokusebenza kanye nokuthuthukisa ukusebenza kwemishini yokukhiqiza isicwecwana se-silicon.

4. Unjiniyela wezinqubo: Hlaziya ukusebenza kwezinqubo zokukhiqiza kanye nemishini ukuze unqume izilungiselelo ezifanele zepharamitha.

5. Uchwepheshe weLabhorethri: uhlanganyele ekuthuthukiseni umsebenzi welabhorethri, ukusungulwa nokuhlolwa.

6: Uchwepheshe Wokuhlaziya Isivuno/Ukwehluleka: Uhlanganyela emsebenzini ohlobene nokuhlaziywa kwesici, njengokulungisa izinto ezizohlaziywa kanye nemishini yokuhlaziya yokusebenza ukuze kutholwe umsuka wezinkinga enqubweni yokukhiqiza i-silicon wafer.

7. Unjiniyela Wokuthuthukisa Isivuno: Qoqa futhi uhlaziye idatha yesivuno neyokuhlola ukuze uthuthukise ukusebenza kokukhiqiza ama-wafer.

Unjiniyela Wezinsiza: Nikeza usekelo lobunjiniyela lwengqalasizinda yezinto zamakhemikhali, ukuhlanzwa komoya kanye nemishini evamile ezimbonini zokukhiqiza i-silicon wafer.

I-"More Moore" ibhekisela ekuncipheni okuqhubekayo kosayizi besici se-chip.

I-geometrically ibhekisela ekuncipheni okuqhubekayo kosayizi besici kuzikhombisi-ndlela ezivundlile neziqondile ze-wafer ukuze kuthuthukiswe ukuminyana, ukusebenza, nokwethembeka.

Lokhu kuhlotshaniswa nokuthuthukiswa kwesakhiwo se-3D nobunye ubuchwepheshe benqubo obungeyona eyejiyomethri kanye nokusetshenziswa kwezinto ezintsha ukuze kuthinte izakhiwo zikagesi zewafa.

I-"More Than Moore" ibhekisela ekunikezeni inani elingeziwe kubasebenzisi bokugcina ngezindlela ezihlukahlukene, hhayi ukwehlisa usayizi wesici, njengokusuka kuleveli yengxenye yesistimu ukuya ekuhlanganisweni kwe-3D noma ileveli yephakheji yokunemba (SiP) noma ileveli ye-chip (SoC).

Usayizi omncane wesici, owaziwa ngokuthi ubukhulu obubucayi (I-Critical Dimension, CD)CD ivamise ukusetshenziswa njengesilinganiso sobunzima benqubo.