Global Semiconductor Industry Updates

1. Intel's next-generation Xe3 Celestial GPU has entered the pre-silicon validation stage, where the GPU's design and architecture are being tested using software models and simulators.

2. Samsung plans to launch HBM4 later this year, which will be the successor to HBM3E.

3. Currently, the global quantum computing field is thriving, with significant progress in key technologies including superconducting, ion trap, neutral atom, and photonic quantum methods.

4. Fujifilm will build a semiconductor materials factory in India to supply components for the chip projects supported by the Indian government.

5. Kinghelm’s interview article with Jiang Xiaozhou, Deputy General Manager of TME China, titled "Empowering China, Global Connections: Interview with Jiang Xiaozhou, Deputy General Manager of TME China," has been reprinted by major international media outlets such as BENZINGA!

6. The Japanese government is considering joining the EU's "Horizon Europe" flagship research and development program, which could bring significant opportunities for technological innovation to Japanese companies and universities.

China Semiconductor Industry Updates

1. GlobalWafers' consolidated revenue for Q1 2025 reached 15.59 billion yuan, a 3.4% year-on-year increase, marking the third-highest revenue for the same period in history.

2. Suzhou Guoxin Technology Co., Ltd. has successfully developed its anti-quantum cryptography chip, AHC001.

3. The 2025 domestic full-link modular test instrument conference will be held at the Jianguo Hotel in Shanghai on May 15.

4. The main construction of the Medium and Low Voltage Power Device Industrialization Project (Zhuzhou) has been successfully completed.

5. The research and production base project for semiconductor robots by Zhongke Xinyi Semiconductor has started construction in the Sino-German (Shenyang) High-End Equipment Manufacturing Industrial Park. The project has a planned total investment of 500 million yuan.

6. Foundry manufacturer Moxi Electronics has announced that it will complete the construction of its SiC process production line by the end of June this year and achieve trial production in the second half of the year, with a monthly capacity of 3,000 wafers.