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Electronics Basics
Technical Information for semiconductors and electronics.
  • Updated: 2024-03-13
  • Views: 13490
Parasitic Capacitance and Temperature Characteristics of MOSFET
  • Updated: 2024-03-12
  • Views: 12649
​Semiconductor materials are at the core of the semiconductor industry, serving as the foundation for manufacturing electronic and computer chips. There is a wi……
  • Updated: 2024-03-11
  • Views: 16841
Introduction: Electronic devices are a very complicated system. The defects and failures of the packaging process are also very complicated. Therefore, the research packaging defect and failure need to have a systematic understanding of the packaging process, so as to analyze the causes of defects from multiple angles.……
  • Updated: 2024-03-11
  • Views: 19252
GD32 is a single chip microcomputer developed in China. It is said that the developer is from ST Company, and GD32 is also made with STM32 as a template. Therefore, GD32 and STM32 are the same in many places.However, GD32 is a different product after all, and it is impossible to follow STM32 for everything. Some self-d……
  • Updated: 2024-03-11
  • Views: 19396
Vehicle-mounted radar is one of the core sensors of Advanced Assisted Driving (ADAS) and unmanned driving, and the vehicle-mounted radar chip is the core of vehicle-mounted radar. Nowadays, the highly integrated (MMIC+DSP/MCU) vehicle-level chip provides a key way for miniaturization, high reliability, stability and lo……
  • Updated: 2024-03-11
  • Views: 14272
The difference between the IGBT discrete and the IGBT module IGBT module can be regarded as the functional improvement and upgrade of the IGBT discrete. Their application fields are basically the same. However, due to the integration of various drivers and protection circuits, the installation of the IGBT module is gre……
  • Updated: 2024-03-11
  • Views: 17467
How much do you know about chip packaging? Why should the chip be encapsulated? What are the types of chip packaging? Chip packaging: In simple terms, it is to put the integrated circuit nude (DIE) produced by Foundry on a substrate with a bearing effect, then lead the tube foot, and then fix the packaging into a whole……
  • Updated: 2024-03-11
  • Views: 15235
Now "end-to-end" is popular. Let's take cell phone call as an example and observe the whole process of signal from cell phone to base station to see what baseband and RF are for.
  • Updated: 2024-02-24
  • Views: 11842
Let's take an abacus as an example to calculate an arithmetic problem. For instance, 36 + 163 × 156 - 166 ÷ 34. To carry out this calculation manually, we would need an abacus, paper, and a pen. We would record the problem to be solved and then step by step, first calculate 163 × 156 and add it to 36, then calculate 16……
  • Updated: 2023-12-19
  • Views: 14144
This article focuses on the design considerations of the drive circuit for silicon carbide (SiC) MOSFETs. It covers topics such as isolation requirements for SiC MOSFET drive, calculation of drive current and drive losses for SiC MOSFETs, basic principles of PCB layout for SiC MOSFET drive current, considerations for p……
  • Updated: 2023-12-19
  • Views: 12488
This article focuses on the design considerations of the drive circuit for silicon carbide (SiC) MOSFETs. It covers topics such as isolation requirements for SiC MOSFET drive, calculation of drive current and drive losses for SiC MOSFETs, basic principles of PCB layout for SiC MOSFET drive current, considerations for p……
  • Updated: 2023-11-03
  • Views: 14640
How far can DUV lithography technology go with multiple exposure methods?

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