Service hotline
+86 0755-83044319
release time:2025-05-09Author source:SlkorBrowse:1037
Global Semiconductor Industry Updates
1. Samsung Electronics' subsidiary Harman International will acquire the audio division of US-based Masimo for $350 million.
2. Semiconductor packaging substrate manufacturer Atos has officially launched its new factory in the Kulim High-Tech Park, Malaysia.
3. LG Electronics has begun construction on its third manufacturing plant in India and plans to invest approximately $600 million in Andhra Pradesh over the next four years to establish a white goods manufacturing ecosystem.
4. AMD's Q1 2025 profit reached $709 million, setting a new historical record!
5. Tesla announced on Weibo that over 95% of the parts for Model 3 and the refreshed Model Y are produced in China.
6. Texas Instruments has dismantled its MCU team in China and moved the entire MCU product line to India.
China Semiconductor Industry Updates
1. Domestic chipmaker Kangxi Communication announced it has terminated its previous restructuring plan and will instead make a strategic investment in Shenzhen Xinzhongxin Technology Co., Ltd.
2. Guoxin Technology has partnered with Xinda Yimi to jointly launch the anti-quantum cryptography chip, AHC001.
3. Kinghelm (www.kinghelm.com.cn) has joined the ChipChain AI platform developed by Longwei Business Software, to co-build and share the digital internet ecosystem, driving the development of the electronics industry chain together.
4. Tianma Microelectronics will invest 1.08 billion RMB to establish a factory in Thailand, with plans to engage in the production and manufacturing of display modules and other businesses.
5. [敏感词]’s wafer foundry, Mosic Electronics, announced that it will complete the SiC production line setup by the end of June this year, with a monthly production capacity of 3,000 wafers, entering the pilot production phase in the second half of the year.
6. Lishuan Technology has been reported to have delayed salaries for all employees for two consecutive months during the critical phase of G100 chip tape-out verification.
Site Map | 萨科微 | 金航标 | Slkor | Kinghelm
RU | FR | DE | IT | ES | PT | JA | KO | AR | TR | TH | MS | VI | MG | FA | ZH-TW | HR | BG | SD| GD | SN | SM | PS | LB | KY | KU | HAW | CO | AM | UZ | TG | SU | ST | ML | KK | NY | ZU | YO | TE | TA | SO| PA| NE | MN | MI | LA | LO | KM | KN
| JW | IG | HMN | HA | EO | CEB | BS | BN | UR | HT | KA | EU | AZ | HY | YI |MK | IS | BE | CY | GA | SW | SV | AF | FA | TR | TH | MT | HU | GL | ET | NL | DA | CS | FI | EL | HI | NO | PL | RO | CA | TL | IW | LV | ID | LT | SR | SQ | SL | UK
Copyright ©2015-2025 Shenzhen Slkor Micro Semicon Co., Ltd