Global Semiconductor Industry Updates

1. Intel's next-generation Xe3 Celestial GPU has entered the pre-silicon validation phase, where its design and architecture are being tested through software models and simulators.

2. Samsung plans to launch HBM4 later this year, which will succeed HBM3E.

3. The global quantum computing field is currently thriving, with significant progress in major technological paths, including superconducting, ion trap, neutral atoms, and photonic qubits.

4. Fujifilm will build a semiconductor materials factory in India to supply components for the Indian government's supported chip projects.

5. Kinghelm's (www.kinghelm.net) interview article, "Empowering China, Global Connections: Interview with Jiang Xiaozhou, Deputy General Manager of TME China," has been republished by major international media outlets, including BENZINGA!

6. The Japanese government is considering joining the European Union’s Horizon Europe flagship R&D program, which could present significant opportunities for technological innovation in Japanese companies and universities.

China Semiconductor Industry Updates

1. GlobalWafers reported consolidated revenue of NT$15.59 billion in Q1 2025, marking a 3.4% year-on-year increase, the third-highest for the same period in history.

2. Suzhou Guoxin Technology Co., Ltd. has successfully developed the AHC001 anti-quantum encryption chip.

3. The 2025 Domestic Full-Link Modular Test Instrument Conference will be held at the Jianguo Hotel in Shanghai on May 15.

4. The main structure of the Medium and Low Voltage Power Device Industrialization (Zhuzhou) Project has been successfully topped out.

5. The Zhongke Ximi Semiconductor Robotics R&D and Manufacturing Base Project has broken ground in the Sino-German (Shenyang) High-end Equipment Manufacturing Industrial Park, with a total planned investment of 500 million yuan.

6. Wafer foundry Mosi Electronics announced that it will complete the SiC process production line by the end of June this year and enter the trial production phase in the second half of the year, with a monthly capacity of 3,000 wafers.