Electronics Basics | Slkor Semiconductor

When it comes to SiC taken to the extreme, what are the options and future prospects?(I)

Updated: 2023-09-15
Views: 13648

The remarkable rise of the global silicon carbide (SiC) market has undoubtedly attracted attention. As early as 2017, the transition from silicon to SiC in power semiconductor applications began with the installation of SiC in Tesla's Model 3. In 2019, chip manufacturer Wolfspeed chose the Nanocenter facility near Utic……

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Selectivity and Cost Control in Etching Processes (III)

Updated: 2023-09-12
Views: 13141

Plasma etching may be the most critical process in semiconductor manufacturing, and it can also be one of the most complex operations in all wafer fabrication processes, second only to lithography. Nearly half of the wafer manufacturing steps rely on plasma, a high-energy ionized gas, to perform their tasks.

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Selectivity and Cost Control in Etching Processes (II)

Updated: 2023-09-12
Views: 11875

Plasma etching may be the most critical process in semiconductor manufacturing, and it can also be one of the most complex operations in all wafer fabrication processes, second only to lithography. Nearly half of the wafer manufacturing steps rely on plasma, a high-energy ionized gas, to perform their tasks.

see details >>

Selectivity and Cost Control in Etching Processes (I)

Updated: 2023-09-12
Views: 12642

Plasma etching may be the most critical process in semiconductor manufacturing, and it can also be one of the most complex operations in all wafer fabrication processes, second only to lithography. Nearly half of the wafer manufacturing steps rely on plasma, a high-energy ionized gas, to perform their tasks.

see details >>

Everything about IGBT (II)

Updated: 2023-09-11
Views: 12796

Today, most news and discussions in the semiconductor industry revolve around devices based on new wide-bandgap (WBG) materials such as silicon carbide (SiC) and gallium nitride (GaN). However, just a few years ago, the preferred solution for many applications was the Insulated Gate Bipolar Transistor (IGBT). There is……

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Everything about IGBT (I)

Updated: 2023-09-11
Views: 12396

Although some may consider IGBT as "conventional" technology, it still plays a significant role in high-power applications. Today, most news and discussions in the semiconductor industry revolve around devices based on new wide-bandgap (WBG) materials such as silicon carbide (SiC) and gallium nitride (GaN). However, j……

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Power Module (IPM), IGBT, and Automotive Power Devices (III)

Updated: 2023-09-11
Views: 11660

Power semiconductor devices play a significant role in modern power control and drive systems. IGBT modules and IPM modules are two of the most common types of devices used in these systems. They can be utilized for controlling high-power loads and driving motors, among other applications. However, they have different ……

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Power Module (IPM), IGBT, and Automotive Power Devices (II)

Updated: 2023-09-11
Views: 12276

Power semiconductor devices play a significant role in modern power control and drive systems. IGBT modules and IPM modules are two of the most common types of devices used in these systems. They can be utilized for controlling high-power loads and driving motors, among other applications. However, they have different ……

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Power Module (IPM), IGBT, and Automotive Power Devices (I)

Updated: 2023-09-11
Views: 15492

Power semiconductor devices play a significant role in modern power control and drive systems. IGBT modules and IPM modules are two of the most common types of devices used in these systems. They can be utilized for controlling high-power loads and driving motors, among other applications. However, they have different ……

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The structure and manufacturing process of Gallium Nitride (GaN) devices (III)

Updated: 2023-09-09
Views: 12463

The characteristics of Gallium Nitride (GaN) power devices and silicon-based power devices are fundamentally different due to the difference in epitaxial structures. This article provides a thorough comparison between GaN HEMT (High Electron Mobility Transistor) and silicon-based MOS (Metal-Oxide-Semiconductor) transis……

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The structure and manufacturing process of Gallium Nitride (GaN) devices (II)

Updated: 2023-09-09
Views: 16183

The characteristics of Gallium Nitride (GaN) power devices and silicon-based power devices are fundamentally different due to the difference in epitaxial structures. This article provides a thorough comparison between GaN HEMT (High Electron Mobility Transistor) and silicon-based MOS (Metal-Oxide-Semiconductor) transis……

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The structure and manufacturing process of Gallium Nitride (GaN) devices (I)

Updated: 2023-09-09
Views: 16173

The characteristics of Gallium Nitride (GaN) power devices and silicon-based power devices are fundamentally different due to the difference in epitaxial structures. This article provides a thorough comparison between GaN HEMT (High Electron Mobility Transistor) and silicon-based MOS (Metal-Oxide-Semiconductor) transis……

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