Lisebelisoa tsa elektroniki le tsa motlakase, li-sensor li sebelisoa ho fumana mats'oao a mantlha ho tsoa lefats'eng le kantle, ho kenyeletsoa molumo, setšoantšo, mocheso, mongobo, khatello le mats'oao a khanya, joalo-joalo, le ho fetolela matšoao ana ho ba mats'oao a motlakase, hangata ka sebopeho. ea motlakase / ea hona joale. Li-sensor tsa setso tsa 'mele le tsa lik'hemik'hale li fumana feela matšoao a kantle mme ha li na bokhoni ba komporo le ho sebetsa. Li-sensor tsa MEMS tse ipapisitseng le lits'ebetso tsa microelectromechanical system (MEMS) li ntse li tsebahala haholo ha theknoloji ea ts'ebetso ea tlhahiso, boholo le litlhoko tsa litšenyehelo li ntse li eketseha.

Har'a lits'ebetso tse fapaneng tsa li-sensor, li-smartphone li hloka tlhokomelo e khethehileng. Ka bobeli li-sensor tsa setšoantšo sa CMOS (CIS) le baetsi ba li-chip tsa ho tseba ho ama / menoana ba fumane menyetla e meholo ea nts'etsopele. Har'a bona, baetsi ba baemeli ba malapeng ba kenyelletsa OmniVision, Grid Kewei, Huiding Technology. Ntle le moo, li-sensor tse ling tse qalang tse ipapisitseng le lipatlisiso tsa mahlale le katleho ea thuto le tsona li lokeloa ke tlhokomelo. Katleho ea bona ea theknoloji ho lidar, optoelectronics le kutlo ea batho le tsona li hapile kamohelo ea capital capital.

Sensor ea MEMS

MEMS ke khutsufatso ea Micro-Electro-Mechanical System, e leng mokhoa o kopanyang li-micro-circuits le micro-machine ho chip ho latela litlhoko tsa ts'ebetso. MEMS e ipapisitse le litheknoloji tsa setso tsa semiconductor tse kang lithography le corrosion, tse kopantsoeng le machining a ultra-precision, a kopantsoeng le tsebo le metheo ea tekheniki ea mechanics, k'hemistri, optics le lithuto tse ling, e le hore MEMS ea millimeter kapa micron-scale e be e nepahetseng le e felletseng. sebopeho sa motjhini, sa dikhemikhale, sa optical, jj. Lisebelisoa tsa MEMS li ka aroloa haholo-holo ka li-sensor tsa MEMS le li-actuator tsa MEMS, moo li-sensor e leng lisebelisoa tse sebelisetsoang ho lemoha le ho lemoha liketsahalo tsa 'mele, lik'hemik'hale, tsa likokoana-hloko le tse ling, ha li-actuator li sebelisetsoa ho lemoha motsamao oa mechine, matla le torque le mekhoa e meng ea boitšoaro.

Setšoantšo sa 1: Molao-motheo o sebetsang oa sensor ea MEMS

Sensor ea MEMS ke sensor e nyane e entsoeng ke theknoloji ea microelectronics le micromechanical. E fetola lets'oao la ho kenya le ho fumana lets'oao le leng le hlokomelehang ka karolo ea micro sensor le yuniti ea phetisetso. Ha e bapisoa le sensor e entsoeng ka mokhoa oa setso, e na le litšobotsi tsa boholo bo nyane, boima bo bobebe, theko e tlaase, tšebeliso e tlaase ea matla, ho tšepahala ho phahameng, e loketseng tlhahiso ea bongata, ho kopanya habonolo le ho phethahala ha bohlale. Ka kakaretso, boholo ba sensor e le 'ngoe ea MEMS e lekantsoe ka limilimithara kapa esita le li-micrometer. Ka nako e ts'oanang, likaroloana tsa mechine e nyenyane li na le melemo ea inertia e nyenyane, maqhubu a phahameng a resonance, le nako e khutšoanyane ea karabo.

Setšoantšo sa 2: Sebopeho sa 'maraka oa MEMS oa Chaena ka 2019 ka kopo

Ho latela lipalo-palo le likhakanyo tsa esale pele tsa Yole, boholo ba mmaraka oa lefats'e oa MEMS ka 2019 e tla ba lidolara tse limilione tse likete tse 11.5. Ka 2020, kholo ea 'maraka e tla fokotseha ka lebaka la seoa sa lefats'e se secha sa moqhaka. Ho tloha ka 2021, 'maraka o tla qala kholo hape. Ho lebelletsoe hore 'maraka o tla fihla ho hoo e ka bang limilione tse likete tse 17.7 ka 2025. USD, ka CAGR ea 7.4% ho tloha 2019 ho isa 2025.

Mabapi le sebopeho sa sehlahisoa, likarolo tse hlano tse ka sehloohong tsa sensor ea MEMS ke maqhubu a seea-le-moea, khatello, microphone, accelerometer le gyroscope, tse etsang hoo e ka bang 65%. Ho latela ponelopele ea Yole, likarolo tsa sensor tsa MEMS tse boholo ba mmaraka tse fetang $ 1 bilione ka 2024 li kenyelletsa maqhubu a seea-le-moea, motsoako oa inertial, menoana ea ultrasonic, khatello, maekrofono le khatiso ea inkjet.

Ho ea ka pono ea li-terminals tsa kopo, tse tsamaisoang ke Marang-rang a Lintho le ho nkela sebaka sa 5G mohala oa thekeng, 'maraka oa lefats'e oa bareki oa MEMS o lebelletsoe ho hola ho tloha ho US $ 6.87 bilione ka 2019 ho isa ho US $ 11.14 billion ka 2025; ka lebaka la keketseho ea sekhahla sa ho kenella ha likoloi tse bohlale, boholo ba mmaraka oa likoloi tsa MEMS bo lebelletsoe ho hola ho tloha ho $2.18 bilione ka 2019 ho isa ho $2.6 billion ka 2025, le CAGR ea 3% nakong eo. Ntle le moo, tlhokeho ea 'maraka libakeng tsa indasteri, tsa bongaka, tsa likhokahano, ts'ireletso le tsa sefofane le tsona lia eketseha.

China e bile mmaraka o holang ka potlako ho MEMS lilemong tse hlano tse fetileng. Ho latela lipalo-palo tse tsoang ho CCID Think Tank, boholo ba mmaraka oa China ka selemo sa 2019 bo ka ba li-yuan tse limilione tse likete tse 60, tse etsang karolo ea 54% ea mmaraka oa lefats'e; mmaraka oa lapeng o ntse o hola ka potlako ho feta lefats'e, mme ho lebelletsoe hore 'maraka oa MEMS oa China o tla feta li-yuan tse limilione tse likete tse 100 ka 2022.

Setšoantšo sa 3: Chaena ke 'maraka oa MEMS o hōlang ka potlako lilemong tse hlano tse fetileng

Ka selemo sa 2019, baetsi ba leshome ba holimo 'marakeng oa MEMS oa China e ne e le Broadcom, Bosch, STMicroelectronics, Texas Instruments, QORVO, Hewlett-Packard, Knowles, NXP, Goertek le TDK, tseo lik'hamphani tsa US li ikarabellang bakeng sa 54%. Khampani ea Machaena Goertek e ile ea ipetetsa ho ba leshome ba ka holimo-limo, ’me AAC Technology e boemong ba bo22. Hajoale, tekanyo e akaretsang ea baetsi ba sensor ea malapeng ba MEMS ha e kholo. Ntle le Goertek le AAC, bao chelete ea bona ea selemo le selemo e fetang liranta tse limilione tse 100 tsa US, chelete ea selemo le selemo ea bahlahisi ba li-sensor tsa MEMS tse kang MEMSIC, Mattel Technology, le Xinao Microelectronics kaofela li ka tlase ho liranta tse limilione tse 60 tsa US, 'me tekanyo ea kakaretso e nyenyane.

matla a phepelo ya ka hare ho naha ya heso ha a lekana, haholoholo dihlahiswa tsa maemo a hodimo di batla di fepeloa ke thepa e tswang kantle ho naha, mme 80% ya ditshipisi di itshetlehile ho dinaha tsa kantle; karolo e setseng e tsepamisitsoe feela matsohong a lik'hamphani tse seng kae tse thathamisitsoeng, tse kang Goertek, Crystal Optoelectronics, Hanwei Electronics, Silan Five lik'hamphani tse kenyeletsang Micro le Jinlong Electromechanical li nka ho feta 40% ea 'maraka oa lehae oa MEMS; 70% ea lik'hamphani tsa malapeng tsa MEMS ke likhoebo tse nyenyane le tse mahareng, 'me lihlahisoa tsa tsona li tsepamisitsoe haholo lihlahisoa tse tlaase le tse bohareng. Ka kakaretso, boemo ba hona joale ba lik'hamphani tsa MEMS tsa naha ea heso ke hore tlhōlisano ea lihlahisoa tse tlaase e bohale, empa ha ho na tlhōlisano tlhōlisanong ea lihlahisoa tse phahameng.

Kaha indasteri ea MEMS ke motheo oa nts'etsopele ea mahlale le thekenoloji mehleng e ncha, 'me tšehetso ea maano e matla, matsete a indasteri ea MEMS ea Chaena le linyeoe tsa lichelete li ntse li eketseha selemo le selemo, ka bobeli mabapi le bongata le palo. Ho latela palo, chelete ea matsete ka 2019 e ka ba habeli ho feta ea 2018. Le hoja matsete a kakaretso a marakeng a mantlha a bata, matsete a indasteri ea MEMS e ntse e tsoela pele ho hōla.

Ho latela pono ea likarohano, masimo a mane a MEMS + AI, RF MEMS, optoelectronic MEMS, le MEMS ea baeloji a na le palo e kholo le palo ea linyeoe tsa matsete. Keketseho e kholo ea palo le palo ea matsete e bontša hore 'maraka oa lichelete o ela hloko indasteri ea MEMS. Mabapi le kabo ea libaka, Beijing, Guangdong, Shanghai, Zhejiang le Jiangsu li etelletse pele lethathamong ho latela palo ea linyeoe tsa matsete.

Lipalopalo tsa Motheo tsa Baetsi ba Sensor Chip ea Lehae

Sehlopha sa bahlahlobisisi ba "Electronic Engineering Album" sa Aspencore se ile sa etsa lipatlisiso tsa pele le ho bokella marang-rang a baetsi ba li-sensor tsa sebakeng sa Chaena, 'me ba khetha lik'hamphani tse 40 ho tsoa lik'hamphaning tse ngata, ho kenyeletsoa theknoloji ea mantlha, lihlahisoa tsa baemeli, tharollo ea kopo le limmaraka tse reretsoeng. tekanyo e ile ea hlahlojoa.

Ena ke karolo ea letoto la litlaleho tsa lipatlisiso le tlhahlobo ea China Fabless. Metsoalle e nang le thahasello e ka sheba mefuta e meng ea litlaleho tsa lipatlisiso, kapa ikopanye le rona ka kotloloho. Litlaleho tsa lipatlisiso tse hatisitsoeng li kenyelletsa:

1. Boemo ba lik'hamphani tse 30 tse thathamisitsoeng indastering ea meralo ea IC ea China ka matla a felletseng

Sebokeng se tlang sa China IC Leaders Summit, re tla khetha Top 10 ho tsoa sehlopheng ka seng ho theha lenane la China Fabless 100. Har'a baetsi bana ba 40 ba li-sensor chip, lik'hamphani tse 13 tse qalang li kenyelelitsoe "Patlisong ea Likhamphani tse 50 tsa IC Design Start-up Companies le Statistical Compilation", ho kenyelletsa: Qipuwei Semiconductor, Ruisizhixin, Hainawei, Baiweishen Technology, Titanium Technology, Zhongke Fusion, Luowei Technology, Yijian Technology, Sidian Micro, Juxin Microelectronics, General Micro Technology (GMEMS), Titanium Technology, Zhongke Galaxy Core. Ka hona, ke lik'hamphani tse setseng tse 27 feela tse baloang le ho hlahlojoa tlalehong ena.

Lethathamo la 1: Lethathamo la lintlha tsa mantlha tsa baetsi ba li-sensor chip ba 40 ba malapeng

Har'a baetsi ba li-sensor chip ba 40, ho na le lik'hamphani tsa 3 tsa sensor ea setšoantšo (CIS); Lik'hamphani tse 7 tse lemohang ho ama / menoana / li-tactile sensor; Lik'hamphani tse 2 tsa RF MEMS; Lik'hamphani tse 19 tsa sensor tsa MEMS; Lik'hamphani tse 4 tsa optical / LiDAR; le lik'hamphani tse ling tse bohlale tsa sensor.

Mabapi le kabo ea libaka, ntle le Beijing, Shenzhen le Shanghai, ho boetse ho na le baetsi ba li-sensor ba MEMS ba bangata Suzhou le Wuxi. Suzhou Industrial Park e se e le sebaka se nang le indasteri e ngata ka ho fetesisa ea li-nano le litalenta naheng ea China, 'me e maemong a har'a lihlopha tse robeli tse kholo ka ho fetisisa tsa indasteri ea nano lefatšeng. Lekala la MEMS la Mokhatlo oa China oa Semiconductor Industry Association le lona le ile la tšoara "China MEMS Manufacturing Conference" e Suzhou ho bokella lisebelisoa tsa indasteri ea tlhahiso ea MEMS ea lefats'e, ho matlafatsa khokahano ea ketane eohle ea indasteri joalo ka moralo oa MEMS, R&D, ts'ebetso le tlhahiso, ho paka le liteko. , le ho khothaletsa lisebelisoa tsa indasteri ka tlhahiso ea MEMS e le eona mohala o ka sehloohong. Khokahano e otlolohileng e potlakisa likhatelopele molemong oa nts'etsopele ea sebaka sa naha sa heso sa tlhahiso ea MEMS.

Ho feta moo, boholo ba bahlahisi ba li-sensor ba kenyellelitsoeng tlalehong ena ke likhoebo tse nyane le tse mahareng, tseo tse 7 tsa tsona li thathamisitsoeng kapa li ntseng li le mothating oa ho etsa kopo ea Boto ea Boqapi ba Saense le Theknoloji. Har'a bahlahisi ba MEMS, ha re kenyelle lik'hamphani tse shebaneng le ts'ebetso le tlhahiso, tse kang Goertek, AAC, Crystal Optoelectronics, Hanwei Electronics, Silan Microelectronics le Jinlong Electromechanical.

Lintlha tse mabapi le baetsi ba li-sensor chip ba 27 ba malapeng

Ka tlase re tla bonts'a lik'hamphani tsena tse 27 ka bonngoe ho ea ka mahlale a mantlha, lihlahisoa tsa mantlha, mebaraka e reriloeng le melemo ea tlholisano.

Sehlopha sa Howe

Theknoloji ea mantlha: theknoloji ea sensor ea setšoantšo sa CMOS, theknoloji ea Pure Cel le Pure Cel Plus, theknoloji ea High Dynamic Range (HDR), theknoloji ea Camera Cube Chip

Lihlahisoa tse ka sehloohong: Sensor ea setšoantšo sa CMOS, sephutheloana sa mojule oa litšoantšo tse nyane (CameraCubeChip), kristale ea metsi ho silicon projection display (LCOS), dynamic vision sensor, le ASIC chips bakeng sa lits'ebetso tse ikhethileng.

Lisebelisoa: Li-smartphone, li-tablet, li-laptops, li-webcams, lisebelisoa tsa ho shebella ts'ireletso, lik'hamera tsa digital, lisebelisoa tsa litšoantšo tsa likoloi le tsa bongaka.

Mmaraka o reriloeng: mohala oa thekeng, koloi, ts'ireletso, bongaka le likarolo tse ling.

Theknoloji ea Goodix

Theknoloji ea mantlha: thekenoloji ea ho lemoha menoana e tlas'a skrine (IN-DISPLAY FINGERPRINT SENSOR), thekenoloji ya screen touch, smart touch, thekenoloji ya sensor ya lebelo la pelo.

Lihlahisoa tse ka sehloohong: lihlahisoa tse lemohang menoana, lihlahisoa tse sebelisanang le batho le k'homphieutha, li-sensor tsa lebelo la pelo, li-audio decoding le amplifiers, BLE Bluetooth chips, li-driver haptic tse bohlale.

Sekema sa kopo: sekema sa boitsebahatso ba menoana e phelang, leano la IFS la ho tsebahatsa menoana le sekema sa ho kopanya ha mothapo, sekema sa boitsebahatso ba menoana, sekema sa boitsebahatso ba menoana, leano la ho lemoha ka tsebeng, leano la lentsoe le molumo.

Limmaraka tse reriloeng: li-smartphone, matlapa, lilaptop, Home Touch, Likoloi, jj.

Zhaoyi Innovation

Theknoloji ea mantlha: theknoloji ea li-multi-touch chip, sensor ea mofuta oa khatiso ea menoana, theknoloji ea ho lemoha menoana ka tlas'a skrini, theknoloji ea ho lemoha ha ultrasonic

Lihlahisoa tse ka sehloohong: sensor ea biometric SoC chip; capacitive, ultrasonic, optical mode monoana oa ho lemoha chip; sensor e kentsoeng ea biometric; "Chip" ea ho laola skrineng sa ho ama 'me e kopanetse bokhoni

Sekema sa kopo: leano la ho lemoha menoana ea optical tlas'a skrine, morero oa ultrasonic

Mmaraka o reriloeng: Li-smartphone, Matlapa, Lilaptop, Matlo a Bohlale, joalo-joalo.

Lilemo tse makholo tsa Bophirimela

Theknoloji ea mantlha: MEMS smart sensor chip line line le MEMS sesebelisoa sa ho sebetsa sethaleng

Lihlahisoa tse ka sehloohong: MEMS, ASIC le li-chips tsa bongaka tsa microfluidic; letoto la khatello ea li-chip, li-chips tsa infrared thermopile, li-chips tsa amplifier tsa tefiso, lichifi tsa laser diode; li-acceleration sensors, li-sensor tsa khatello, li-sensor tsa oli tse tlotsang

Sekema sa kopo: Sistimi ea tlhahlobo ea liphoso tsa mochini, sistimi e bohlale ea matla a moea, sistimi e bohlale ea matla, jj.

Limmaraka tse reriloeng: Taolo le tlhokomelo ea lifofane tsa sechaba, matla, bongaka, lipalangoang le lisebelisoa tsa indasteri.

Minxinwei

Theknoloji ea mantlha: MEMS / ASIC chip, MEMS khatello ea maikutlo

Lihlahisoa tse ka sehloohong: li-microphone tsa silicon tsa MEMS, li-sensor tsa khatello le li-accelerometers

Mmaraka o reriloeng: lisebelisoa tse ka roaloang, mehala ea cellular/tablet, lisebelisoa tsa elektroniki tsa koloi, li-headsets tsa Bluetooth, jj.

Nano Core Micro

Theknoloji ea Motheo: MEMS, Ho itšehla thajana ha Motlakase o Phahameng, Ts'ebetso e Kopantsoeng ea Chain ea Matshwao le Tekanyo ea Sensor

Lihlahisoa tse ka sehloohong: sensor ea mocheso, sensor e bohlale ea khatello, chip ea boemo ba sensor, mokhanni oa matla le chip ea interface

Litharollo tsa Kopo: Sensor Signal Conditioning Solutions bakeng sa Likopo tsa Likoloi; Sensor Signal Conditioning Solutions for Industrial Applications; Sensor Signal Conditioning Solutions for White Goods; MEMS Sensor Solutions bakeng sa Consumer Electronics

Mmaraka o reriloeng: lisebelisoa tsa elektroniki tsa bareki, ntlo e bohlale, taolo ea indasteri, lisebelisoa tsa elektroniki tsa likoloi, jj.

Gekewei

Theknoloji ea mantlha: Theknoloji ea ho paka ea CIS e sebetsang hantle ea moloko oa boraro e thehiloeng ho solder COB

Lihlahisoa tse ka sehloohong: Sensor ea setšoantšo sa CMOS, chip e bonts'ang ea DDI

Sekema sa kopo: kh'amera e kholo, kh'amera e ka pele le khamera e nyane ea likhamera tse ngata tsa fono e bohlale; mokhanni oa ponts'o ea selefouno, mokhanni oa ponts'o ea sesebelisoa se ka roaloang, mokhanni oa pontšo ea taolo ea indasteri; sehatisi sa ho khanna, kh'amera e ka koloing, pono e potolohileng ea likhato tse 360, pono e khutlisetsang morao le mokhathala oa mokhanni Litharollo tsa kopo ea likoloi joalo ka ho lemoha; tharollo ea k'hamera bakeng sa bukana ea ho ngolla lintlha / USC / lithelevishene tsa skrine tse bohlale.

Mmaraka o reriloeng: mehala ea selefouno, ho roala ka bohlale, tefo ea mohala, letlapa, bukana ea ho ngolla, kh'amera le lisebelisoa tsa elektroniki tsa likoloi le likarolo tse ling tsa sehlahisoa.

Smartway

Theknoloji ea mantlha: theknoloji ea pono ea bosiu ka mebala e felletseng, theknoloji e nang le tokelo ea SFCPixel, thekenoloji ea lefats'e ea Stack BSI, theknoloji e tsepamisitsoeng ea litšoantšo tsa HDR, theknoloji ea QCell TM + LFS, theknoloji ea AI Sensor, theknoloji ea Smart AECTM, ntlafatso e haufi le infrared.

Lihlahisoa tse ka sehloohong: Letoto la AI, letoto la AT, letoto la GS, letoto la IoT, li-sensor tsa litšoantšo tsa CS

Sekema sa kopo: ts'ebeliso ea ts'ebeliso ea ts'ireletso ea ts'ebeliso ea ts'ireletso ea ts'ireletso, sekema sa ts'ebeliso ea pono ea mochini, ts'ebeliso ea sistimi ea lipalangoang e bohlale, leano la ts'ebeliso ea boemo ba mokhanni DMS, sekhahla se phahameng sa sensor ea setšoantšo sa CMOS + kananelo ea 3D.

Mmaraka o reriloeng: ho lekola ts'ireletso, litšoantšo tsa koloi, pono ea mochini le lisebelisoa tsa elektroniki tsa bareki; likarolo tse ntseng li hlaha tsa ts'ebeliso joalo ka bohlale ba maiketsetso, litšoantšo tsa mehala, lisebelisoa tsa elektroniki tsa koloi, jj.

North Microsystems

Theknoloji ea mantlha: Theknoloji ea ho etsa filimi ea Bulk Acoustic Resonator (FBAR), Micro-Electro-Mechanical Systems (MEMS) e sebelisa lisebelisoa tsa silicon.

Lihlahisoa tse ka sehloohong: FBAR RF filter, RF front-end MEMS filter chip

Litharollo tsa Kopo: Li-Filters tsa Wireless RF, Duplexer le Multiplexer Solutions, BAW RF Solutions

Mmaraka o reriloeng: puisano e se nang mohala, terminal ea mohala le setsi sa motheo.

Ximewei Nano

Theknoloji ea mantlha: Theknoloji ea meralo ea maemo a holimo le e kopaneng ea li-switch tsa RF MEMS le li-filters tse thehiloeng ho RF MEMS, li-antenna tse bohlale, le li-phase shifters.

Lihlahisoa tse ka sehloohong: Li-switch tsa RF MEMS, li-mothamo shifters, attenuators

Mmaraka o reriloeng: likhokahano tse se nang mohala.

Shendi Semiconductor

Theknoloji ea mantlha: yuniti ea ho lekanya ha inertial ea li-axis tse tšeletseng (IMU), gyroscope ea MEMS

Lihlahisoa tse ka sehloohong: li-six-axis inertial measurement unit (IMU) series products

Mmaraka o reriloeng: Lisebelisoa tsa IOT joalo ka li-smartphones le malapa a bohlale.

Mizuki Zhixin

Theknoloji ea mantlha: MEMS gyroscope le accelerometer

Lihlahisoa tse ka sehloohong: MEMS gyroscope, MEMS accelerometer

Mmaraka o reriloeng: Mmaraka oa Consumer Electronics.

Minghao Sensing

Theknoloji ea mantlha: Theknoloji ea ts'ebetso ea 3D CMOS-MEMS,

Lihlahisoa tse ka sehloohong: kutlo ea ho potlakisa, chip e bohlale ea pedometer, maekerofounu ea silicon, gyroscope, sensor ea khatello le sensor ea makenete.

Litharollo tsa kopo: litharollo tsa ts'ebeliso ea sesebelisoa se ts'oaroang ka letsoho, sensing ea motsamao, ntlo e bohlale, lisebelisoa tsa elektroniki tsa likoloi, li-automation tsa indasteri, bongaka bo bohlale.

Mmaraka o reriloeng: lisebelisoa tsa elektroniki tsa bareki, lisebelisoa tsa elektroniki tsa likoloi, li-automation tsa indasteri le lifofane le likarolo tse ling.

Lerato la Core Micro

Theknoloji ea mantlha: sensor e bohlale ea menoana, ho lemoha sefahleho le ho lemoha methapo

Lihlahisoa tse ka sehloohong: chip ea sensor ea menoana, chip ea mokhanni

Sekema sa kopo: merero e kang ho lemoha sefahleho le ho lemoha methapo

Mmaraka o reriloeng: Limmaraka tsa IoT joalo ka linotlolo tsa mamati tse bohlale.

Mehopolo

Theknoloji ea mantlha: theknoloji ea sensor ea menoana ea moloko oa bone

Lihlahisoa tse ka sehloohong: chip ea sensor ea menoana le chip ea ts'ireletso ea tlhahisoleseling

Sekema sa kopo: senotlolo sa mamati se bohlale

Mmaraka o reriloeng: Mmaraka oa Ts'ireletso

Gnawell

Theknoloji ea mantlha: thekenoloji ea micro-inertial navigation ea ho beha maemo ka tlung, sistimi ea micro-inertial navigation le fusion ea li-multi-sensor

Lihlahisoa tse ka sehloohong: MEMS-IMU e nepahetseng ka ho fetisisa, micro-inertial navigation staff positioning module

Sekema sa kopo: mokhoa oa ho batla le oa pholoso oa mollo / ts'ohanyetso, "micro inertial navigation + UWB" robot/AGV positioning system, workshop/basebetsi ba limela le lisebelisoa tse nepahetseng tsa ho beha maemo, sebaka sa kaho/boema-kepe/sisteme ea ho beha basebetsi ba matla, boemo ba liroboto tsa laser SLAM le tsamaiso ea ho tsamaea

Mmaraka o reriloeng: ho tima mollo, li-drones, ho khanna ka boithaopo, boemo ba ka tlung, jj.

Microelectronics ea mantlha

Theknoloji ea mantlha: Theknoloji ea ho paka ea MEMS

Lihlahisoa tse ka sehloohong: li-microphone tse thehiloeng ka silicon, li-sensor tsa khatello ea MEMS, li-accelerometers tsa MEMS, li-switch optical tsa MEMS, li-valve tsa moea tsa MEMS, li-microfluidic chips tsa MEMS, li-microphone tsa MEMS, le lisebelisoa tsa MEMS tse kang li-gyroscope tsa MEMS.

Sekema sa kopo: mohala oa thekeng, komporo, e-book, media player

Mmaraka o reriloeng: lisebelisoa tsa elektroniki tsa bareki, bongaka, taolo ea indasteri le lisebelisoa tsa elektroniki tsa likoloi le likarolo tse ling.

MEMSIC

Theknoloji ea mantlha: thekenoloji ea single-chip capacitive accelerometer, theknoloji ea sensor ea AMR

Lihlahisoa tse ka sehloohong: accelerometer ea mocheso, sensor ea AMR geomagnetic, capacitive accelerometer, micro-power Hall switch le lihlahisoa tse ling.

Lisebelisoa: Li-smartphone, li-laptops/li-tablet, lioache/libanta tse bohlale, likoloi, lithuthuthu, li-drones, li-headset tsa TWS, lisebelisoa tsa motlakase/li-toys, liloko tse bohlale tsa mamati.

Limmaraka tse Lebeletsoeng: Likoloi, Liindasteri, Lintho Tse Ruoang, Lehae le Bohlale le Lisebelisoa tsa Elektronike tsa Bareki.

Mattel Technology

Theknoloji ea mantlha: 6-inch MEMS process line

Lihlahisoa tse ka sehloohong: Lisebelisoa le lisebelisoa tse sa sebetseng tsa MEMS, li-sensor tsa MEMS, li-sensor tsa likoloi, lisebelisoa tsa khatello, lisebelisoa tsa radio frequency (RF) MEMS, joalo-joalo.

Limmaraka tse reriloeng: sepakapaka, seporo sa lebelo le holimo, likoloi, ho khanna motho a le mong, likhokahano, tlhahlobo ea tšisinyeho ea lefatše, Marang-rang a Lintho, litoropo tse bohlale, lisebelisoa tsa lapeng tse bohlale, jj.

Huajing Sensing

Theknoloji ea mantlha: filimi e tšesaane ea piezoelectric e sebetsang hantle haholo le theknoloji e tsoetseng pele ea silicon semiconductor microelectromechanical system (MEMS) micromachining

Lihlahisoa tse ka sehloohong: maekerofounu ea silicon, sensor ea ultrasonic, sensor ea ho potlakisa

Mmaraka o reriloeng: IoT, temohisiso ea indasteri, lisebelisoa tsa elektroniki tsa bareki, jj.

Dragon Micro Technology

Theknoloji ea mantlha: Moralo o ikhethileng oa MEMS

Lihlahisoa tse ka sehloohong: Khatello ea MEMS, mocheso, lisebelisoa tsa mongobo

Mmaraka o reriloeng: lisebelisoa tsa elektroniki tsa likoloi, lisebelisoa tsa elektroniki tsa bongaka, tlhahiso ea lisebelisoa tsa maemo a holimo le likarolo tse ling.

Fein Microelectronics

Theknoloji ea mantlha: theknoloji ea ho paka mohlala oa khatello ea maikutlo, algorithm e sebetsang ea tlhahlobo ea batch,

Lihlahisoa tse ka sehloohong: likhatello tse fapaneng tsa likoloi le li-sensor tsa khatello e fapaneng, li-cores tse tletseng oli tse laolang indasteri, mocheso oa mitha ea khase le lisebelisoa tsa khatello, lisebelisoa tsa khatello ea metsi le lisebelisoa tse ling tsa MEMS le lihlahisoa tsa tsamaiso.

Mmaraka o reriloeng: liindasteri tsa likoloi, IoT, matlo a bohlale le liindasteri tsa taolo ea indasteri.

nako ea micro yuan

Theknoloji ea mantlha: Theknoloji ea ts'ebetso ea sebopeho sa SOG MEMS e hlokolosi

Lihlahisoa tse ka sehloohong: silicon-based MEMS accelerometer MUA100, MUG series gyroscope, silicon-based MEMS inertial measurement unit MUS600

Mmaraka o reriloeng: koloi ea sefofane e se nang motho, e sa tsamaisoang ke motho, sesupa-tsela sa elektroniki, boithuto ba jeoloji, jj.

Core Microsystem

Theknoloji ea mantlha: li-sensor chips tse kang li-sensor tsa khatello ea silicon tse pharalletseng le theknoloji ea tsona ea ho paka

Lihlahisoa tse ka sehloohong: li-sensor tsa khatello ea likoloi le lisebelisoa tsa khatello ea meriana

Mmaraka o reriloeng: liindasteri tse kang tsa likoloi le tsa bongaka.

Dual Bridge Sensing

Theknoloji ea mantlha: Theknoloji ea MEMS piezoresistive khatello ea maikutlo

Sehlahisoa se seholo: Sensor ea khatello ea MEMS

Mmaraka o reriloeng: lebala la ho phatloha, ts'ebeliso ea likoloi, tlhahlobo ea enjene, lisebelisoa tsa maemo a holimo, jj.

Ho tseba Micro Sensing

Theknoloji ea mantlha: theknoloji ea MEMS micro-galvanometer

Lihlahisoa tse ka sehloohong: MEMS micro-galvanometer chip, MEMS solid-state lidar

Sekema sa kopo: Dram letoto la tharollo ea khamera ea 3D

Mmaraka o reriloeng: tlhahlobo ea 3D, tlhahlobo ea indasteri, ho hlopha thepa, tekanyo ea boholo, kananelo ea sefahleho sa 3D, pono ea mochini le likarolo tse ling.

Fushi Technology

Theknoloji ea mantlha: Theknoloji ea 3D e hlophisitsoeng ea ho lemoha sefahleho, theknoloji ea ho lemoha menoana tlas'a skrine ea LCD, AI le pono ea mochine.

Lihlahisoa tse ka sehloohong: chip ea sensor ea pono, chip ea menoana tlas'a skrine ea LCD

Sekema sa ts'ebeliso: menoana ea optical tlasa skrineng sa mohala oa thekeng, senotlolo sa ho lemoha sefahleho, taolo ea phihlello e bohlale, tefo ea sefahleho, mohlala oa sebaka, jj.

Mmaraka o reriloeng: mohala oa thekeng, senotlolo sa mamati se bohlale, tefo ea lichelete, taolo ea indasteri, ntlo e bohlale, toropo e bohlale.

Epilogue

Leha ho na le bahlahisi ba bangata ba li-sensor tsa lapeng le bahlahisi ba li-chip tsa MEMS, boholo ba bona ba qothisana lehlokoa le 'maraka o tlase. Ntle le baetsi ba li-sensor ba tsepamisitsoeng haholo ba li-sensor tsa litšoantšo le kananelo ea menoana bakeng sa mmaraka oa li-smartphone, bahlahisi ba bang ba li-sensor bakeng sa taolo ea indasteri le ho beha leihlo, lipalangoang tsa likoloi le matla li batla li hasane, 'me matla a bona a felletseng le boemo ba bona ba mmaraka ha bo hlahelle haholo. Lefapheng la lisebelisoa tsa elektronike tsa likoloi le 'maraka o hlahang oa Lintho tsa Marang-rang, li-startups tse shebaneng le li-sensor tse bohlale le theknoloji ea lidar li tla tlisa sebaka se seholo sa nts'etsopele ka tšehetso ea lichelete tsa khoebo le mebuso ea libaka.

Tlhokomeliso: Sengoliloeng sena se hlahisitsoe ho "Electronic Engineering Album" ea Gu Zhengshu, e ts'ehetsang ts'ireletso ea litokelo tsa thepa ea mahlale. Ka kopo, bontša mohloli oa pele le mongoli oa khatiso e ncha. Haeba ho na le tlolo ea molao, ka kopo ikopanye le rona ho e hlakola.