Machaba1. Micron Technology e tla qala tlhahiso ea DDR4 le LPDDR4 hape, ka keketseho e lebelletsoeng makhetlo a mane ea phepelo ea wafer ea DDR4. 2. Ho ea ka litlaleho, Samsung Electronics e atlehile ho kenya tšebetsong theknoloji ea pele ea prototype ea NAND ea lera la 900 V-level NAND lefatšeng. 3. Amkor e ntse e atolosa moralo oa eona o tsoetseng pele oa liphutheloana Arizona 'me e senotse hore k'hamphani e sebelisana le AMD mabapi le liphutheloana tsa chip. 4. Nvidia e tla theha laboratori ea lipatlisiso tsa AI Singapore ho ntšetsa pele moralo oa theknoloji ea othomathike le liroboto. 5. SK Hynix e phatlalalitse ho qalisoa ha theknoloji ea polokelo ea mocheso e laoloang ke mocheso e bitsoang "iHBM". Ha e bapisoa le litharollo tsa setso, khanyetso ea mocheso ea iHBM e fokotsehile ka 30%. 6. Ho ea ka tlaleho ea Morgan Stanley, ho hakanngoa hore boholo ba 'maraka oa indasteri ea semiconductor lefatšeng ka bophara bo ka fihla ho $1.5 trillion ka 2030, ka li-chips tse amanang le AI tse tlatsetsang ho fihlela ho 50%. Domestic1. Huatian Technology e tsetetse li-yuan tse libilione tse 3 ho aha "Huatian Nanjing Advanced Packaging and Testing Industry Base Phase II Construction Project". 2. Ziguang Guowei o rera ho reka Ruineng Semiconductor ka li-yuan tse libilione tse 1.9. Kamora hore thekiso e phetheloe, Ruineng Semiconductor e tla ba lekala le felletseng la Ziguang Guowei. 3. Kinghelm le Slkor ba hira Batsamaisi ba Liakhaonto tsa Bohlokoa! Ba hloka ho ba le phihlello ea mehloli e meholo ea bareki le bokhoni ba ho sebetsana le liphephetso indastering ea lisebelisoa tsa elektroniki, ka puseletso e kholo. Amohela batho ba nang le takatso e matla ho ikopanya le rona, ho hlahloba 'maraka hammoho, le ho theha bokamoso hammoho! 4. Yu Hao, CEO oa Zhumi Technology, o boletse phatlalatsa hore Zhumi Auto e lebelletsoe ho fihlela tlhahiso e kholo ka nako e ka etsang selemo le halofo, ka pele ho fuoa ho atolohela mebarakeng ea mose ho maoatle. 5. Li-wafer tsa silicon tse sekwere tse 2 tsa Global Crystal li qalile ho netefatsoa ka tekanyo e nyane 'me li lebelletsoe ho hlahisoa ka bongata kotara ea bone ea 2026. 6. NE Times e lokolitse lintlha tsa kotara ea pele ea 2026, e bonts'ang hore bokhoni bo kentsoeng ba li-module tsa matla tsa silicon carbide tse kopantsoeng tsa Xinlian bo boemong ba bobeli Chaena, ka karolo ea 'maraka ea 14.6%.

Changxin Technology e kenyelelitsoe lethathamong la 2026 la "Litheo tse 100 tse Ncha tse ka Holimo Lefatšeng ka Bophara," e leng eona feela k'hamphani ea memori ea semiconductor har'a likhoebo tse supileng tsa China tse lenaneng lena selemong sena.

Haufinyane tjena, dingolwa tse tsebahalang tsa Kinghelm le Slkor di se di phatlaladitswe haholo lefatsheng ka bophara, di ntlafatsa botumo ba letshwao le tshusumetso ya "Kinghelm" le "Slkor."

Ka 2024, 'maraka oa likoloi oa IoT oa Chaena o fihlile sekala sa li-yuan tse libilione tse 500, 'me ho lebelletsoe hore o tla feta li-yuan tse libilione tse 1.2 ka 2030, ka sekhahla sa kholo ea selemo le selemo (CAGR) sa 15.8% nakong ena.

SMIC (Semiconductor Manufacturing International Corporation) e sebelisa menyetla ea kholo 'marakeng oa semiconductor oa likoloi, e qala lits'ebetso tse ngata tse ikhethang tsa maemo a likoloi tse akaretsang li-sensor, BCD, MCUs, RF, memori le mahlale a ponts'o.

SMIC (Semiconductor Manufacturing International Corporation) e sebelisa menyetla ea kholo 'marakeng oa semiconductor oa likoloi, e qala lits'ebetso tse ngata tse ikhethang tsa maemo a likoloi tse akaretsang li-sensor, BCD, MCUs, RF, memori le mahlale a ponts'o.

SMIC (Semiconductor Manufacturing International Corporation) e sebelisa menyetla ea kholo 'marakeng oa semiconductor oa likoloi, e qala lits'ebetso tse ngata tse ikhethang tsa maemo a likoloi tse akaretsang li-sensor, BCD, MCUs, RF, memori le mahlale a ponts'o.

SMIC (Semiconductor Manufacturing International Corporation) e sebelisa menyetla ea kholo 'marakeng oa semiconductor oa likoloi, e qala lits'ebetso tse ngata tse ikhethang tsa maemo a likoloi tse akaretsang li-sensor, BCD, MCUs, RF, memori le mahlale a ponts'o.

SMIC (Semiconductor Manufacturing International Corporation) e sebelisa menyetla ea kholo 'marakeng oa semiconductor oa likoloi, e qala lits'ebetso tse ngata tse ikhethang tsa maemo a likoloi tse akaretsang li-sensor, BCD, MCUs, RF, memori le mahlale a ponts'o.

SMIC (Semiconductor Manufacturing International Corporation) e sebelisa menyetla ea kholo 'marakeng oa semiconductor oa likoloi, e qala lits'ebetso tse ngata tse ikhethang tsa maemo a likoloi tse akaretsang li-sensor, BCD, MCUs, RF, memori le mahlale a ponts'o.

Ho kenngwa tshebetsong ha diroboto tse bohlale tse kang batho ka bongata ho fihlelletswe ka ho qalwa ha mohala o motjha wa tlhahiso ya betri ya matla a motlakase PACK setsing sa CATL sa Zhongzhou, e leng se eketsang tlhahiso ya letsatsi le letsatsi hararo ha e bapiswa le mosebetsi wa matsoho.

Puisano le Song Shiqiang oa Slkor, e nang le sehlooho se reng "Ho tloha ho Moqapi oa Matlo ho ea ho Mothehi oa Chip: 'Boiketlo ba Bobeli ba Khoebo' le Leeto la Liindasteri tse Fetotsoeng," e sa tsoa hapa tlhokomelo e pharaletseng le likabelo lipulong tsa mecha ea litaba ea lehae.

Chipone Microelectronics haufinyane e phatlalalitse li-chips tsa motlakase tse 12 Shenzhen e shebileng li-server tsa AI le lits'ebetso tsa taolo ea indasteri.

Mmaraka oa liroboto tsa lapeng naheng ea China o lebelletsoe ho feta RMB tse limilione tse likete tse 340 ka 2025 mme o ka fihla ho RMB tse limilione tse likete tse 780 ka 2030, ka CAGR ea 18.4%.

Xiangdi e phatlalalitse karete ea eona ea pele ea litšoantšo ea Imagination DXD GPU e hlahisoang ka bongata, e ts'ehetsang theknoloji ea ho latela ray le tharollo e phahameng haholo.

Fono ea maiketsetso ea ByteDance le ZTE e reretsoe ho qala ho sebetsa mathoasong a Tšitoe selemong sena.

Hesai e qadile Fermi C500, chip e bohlale e sebetsang hantle bakeng sa LiDAR e ipapisitseng le meralo ya RISC-V, hammoho le theknoloji e le nngwe feela ya polokeho ya "photon insolation" lefatsheng le LiDAR ya polokeho ya mela e 256, ATX e ntjhafaditsweng.

Ka 2024, matla a photovoltaic a sa tsoa kenngoa lefatšeng ka bophara a tla feta 550 GW, e leng keketseho ea selemo le selemo ea hoo e ka bang 30%. Matla a China a sa tsoa kenngoa a photovoltaic a tla fihla ho 277 GW, e leng karolo ea 65% ea kakaretso ea lefats'e.

Karolong ea pele ea 2025, thepa ea li-earphone tsa Bluetooth ea China e fihlile ho li-unit tse limilione tse 59.98, kholo ea selemo le selemo ea 7.5%.

Libaka tsa Europe Bohareng le Bochabela (tse etelletsoeng pele ke Hungary, Czech Republic, le tse ling) hammoho le Mexico li hohela matsete a bohlokoa ho tsoa ho lik'hamphani tse etelletseng pele lefatšeng ka bophara le ho tloha ho libaka tsa khale tsa tlhahiso ea likoloi ho ea litsing tsa bohlokoa tsa tlhahiso bakeng sa likoloi le likarolo tsa motlakase tsa moloko o latelang.