(Karolo e latelang ea I: Moralo o kopaneng oa potoloho; Karolo ea II: Tlhahiso e Kopanetsoeng ea Potoloho)

V. ATP (Seboka, Teko, le Packaging) le liphutheloana tse tsoetseng pele

Liqeto tsa mantlha mabapi le kopano, liteko, ho paka le ho paka tse tsoetseng pele:

(1) Bakeng sa semiconductor ea morao-rao ea morao-rao ea morao-rao ea morao-rao ea ATP, United States e itšetlehile haholo ka mehloli ea linaha tse ling tse lebisitsoeng Asia.

(2) Ha li-chips li ntse li rarahana le ho feta, mekhoa e tsoetseng pele ea ho paka e emela libaka tse ka bang teng bakeng sa tsoelo-pele e kholo ea theknoloji. Leha ho le joalo, US hape ha se sebaka se bolokang chelete e ngata ho nts'etsapele indasteri e matla e tsoetseng pele ea ho paka hobane e haelloa ke lintho tse hlokahalang tsa tikoloho;

(3) Ho arabela, lichelete tse boima tsa Chaena li ka senya limmaraka tse teng.

(I) Litekanyetso tsa motheo tsa Flag State tsa ho paka le liteko tsa mantlha

(A) Boitsebiso ba motheo

Mokhahlelong oa motheo oa ATP oa morao-rao, chip (core) e bokelloa ho ba sehlahisoa se felileng, se lekoang, se phutheloang, 'me se kopantsoe ka lisebelisoa tsa elektroniki. Ho na le mekhoa e 'meli bakeng sa mohato oa ATP: (1) OEM ka IDM le (2) OEM. Likhamphani tsa Foundries ke lik'hamphani tsa OSAT (pure semiconductor Assembly and Testing) tse ikhethang ka ho leka, ho paka, ho kopanya kapa ho kopanya le ho fana ka lits'ebeletso tsa konteraka. Mabapi le 'maraka oohle oa ATP, lik'hamphani tsa US li ikarabella bakeng sa 28% ea chelete eohle e kenang; Le hoja lik'hamphani tsa US li ikarabella bakeng sa hoo e ka bang 43% ea chelete e kenang ea IDM ATP e kopantsoeng ka ho toba, lik'hamphani tsa US li rekile tlhahiso ea ATP litsing tse kantle ho US. Lik'hamphani tsa Foundries tse kang TSMC (Taiwan), UMC (Taiwan), SMIC (Mainland China) le XMC (Mainland China) li kene khoebong ea ho paka ho eketsa lits'ebeletso tsa tlhahiso tseo li li fang bareki ba se nang lipale, haholo-holo bakeng sa ho paka li-chips tse nyane tse tsoetseng pele. TSMC e qalile tharollo ea eona ea pele ea ho paka e tsoetseng pele ka 2012. Ka 2017, ho ne ho e-na le li-OSATS tse fetang 100 tse fapaneng 'marakeng. Ho na le li-OSAT tse robeli tse kholo; Bongata ba tsona ke libapali tse nyane ho isa ho tse mahareng.

Leha ho na le lik'hamphani tse ling tsa US OSAT (haholo-holo Amkor), lik'hamphani tsa US li etsa karolo ea 15% feela ea khoebo ea OSAT (Taiwan e etella pele ka 52%, e lateloa ke China ka 21%), 'me Amkor e thehiloe US empa ha e na setsi sa tlhahiso United States.

Ka tloaelo ATP ea motheo e bile khoebo e ikemetseng haholo le e nang le boleng bo tlase, e hlokang mehato e mengata 'me e hira basebetsi ba nang le boiphihlelo bo tlase haholo (sena sea fetoha ka ho hlahisoa ha mahlale a tsoetseng pele a ho paka a tšohloang ka tlase). Kahoo, ts'ebetso ena e bile karolo ea pele (e qalileng lilemong tsa bo-1970) ea ho fana ka tlhahiso kantle ho naha United States, e neng e le Asia Boroa-bochabela haholo. Kajeno, boholo ba lifeme tsa ho fana ka tlhahiso kantle ho naha tsa ATP li Chaena, Taiwan le Asia Boroa-bochabela (Singapore, Malaysia, Philippines le Vietnam). SEMI le Techsearch li fumane lik'hamphani tse fetang 120 tsa ho fana ka tlhahiso kantle ho naha tsa OSAT le lifeme tsa ho paka tse 360 ​​lefatšeng ka bophara ka 2018. Ho lifeme tse 360, ho na le tse fetang 100 Chaena, tse ka bang 100 Taiwan le tse 43 Asia Boroa-bochabela (tse ling li Europe kapa Amerika). Tlhahiso ea OSAT Chaena e sebelisa theknoloji ea hona joale ea ho paka, empa Chaena e ntse e nts'etsapele theknoloji e tsoetseng pele ea ho paka.

Ka lehlakoreng la liteko, mahlale a semiconductor a tlameha ho netefatsoa le ho lekoa pele a ka sebelisoa maemong a mocheso (lebaka le atolositsoeng), ho hanyetsa mahlaseli le maemo a thata ka lebaka la ts'ireletso ea naha. Sena se kenyelletsa tlhahlobo ea litlamorao tsa karolo e le 'ngoe (SEE) ho sebelisoa lisebelisoa tse matla tsa tlhahlobo ea mahlaseli a ion. Mehaho ea motheo e teng ea tlhahlobo ea mahlaseli a ion e boima United States e fokola 'me e ke ke ea kopana le litlhoko tsa tlhahlobo tsa hona joale kapa tsa nakong e tlang. Hangata bareki ba ba le nako e telele ea ho leta le litheko tse ntseng li phahama tsa liteko, 'me ba kotsing ea khatello ea maikutlo le haeba setsi se seholo se ka koaloa ka tšohanyetso. "Ho na le li-accelerator tse ka tlase ho halofo ea li-LABS tse ka hlahisang libalaka tsa ion tsa mefuta e fapaneng ea ion le matla ho fihlela litlhoko tsa tlhahlobo tsa SHEBA." Sena se ama boteng ba liteko tsa ho ts'ehetsa mesebetsi ea kamoso ea sepakapaka lipakeng tsa mekhatlo ea sebaka le indasteri (ho kenyeletsoa le lisathelaete).

(B) Likotsi tse kholo

Kajeno, United States e na le karolo ea 3 lekholong feela ea bokhoni ba ho paka ba semiconductor lefatšeng ka bophara (ntle le bokhoni ba ho leka), bo fanoang haholo-holo ke lik'hamphani tsa IDM, tseo hangata li nang le lits'ebeletso tsa ATP kantle ho United States. Leha sena e bile karolo ea theknoloji e tlase ea ketane ea phepelo, ke mohato oa bohlokoa. Ho itšetleha ha Amerika ka tlhahiso ea bohlokoa ea ATP Asia Boroa-bochabela, Taiwan le Chaena ho pepesetsa ketane ea phepelo ea US tšitiso.

(II) Puisano ea Citibank mabapi le theknoloji e tsoetseng pele ea ho paka

(A) Boitsebiso ba motheo

Le ha ATP ea mantlha esale e le karolo ea boleng bo tlase ea phepelo ea thepa, mahlale a ho paka a ntse a hatela pele le ho feta. Ka lilemo tse mashome, indasteri ea semiconductor e ntse e tsamaisana le Molao oa Moore, o bolelang esale pele hore palo ea li-transistors ho semiconductor e imena habeli lilemo tse ling le tse ling tse peli. Kajeno, matla le melemo ea ts'ebetso ea ho fokotseha ha boholo ba li-chip sebakeng se seng le se seng se secha sa ts'ebetso lia fokotseha, ha theko ea transistor e ntse e eketseha. Le hoja ho fokotsa palo e ntse e le khetho, kaha ho fokotsa chelete ho ntse ho bitsa chelete e ngata le ho ba thata, indasteri ea semiconductor e batla mekhoa e meng e kenyelletsang ho bokella li-chips tse nyenyane le / kapa li-circuits tse ngata tse kopantsoeng ka har'a sephutheloana se le seng. Sena se bitsoa encapsulation e tsoetseng pele. Sephutheloana se tsoetseng pele se emela theknoloji e 'ngoe le e tlatselletsang ho fokotsa bophara ba mohala hobane e fana ka sekhahla se phahameng sa chip sethaleng ho fapana le boemo ba chip mme se lumella ho kopanngoa ha mesebetsi e fapaneng ea chip ka har'a sephutheloana se le seng. Liphutheloana tse tsoetseng pele li boetse li lumella tšebeliso e kholo ea li-chips tsa khoebo-off-the-shelf (ts'ireletso-e amohetsoeng) ho etsa tharollo.

Mefuta e tsoetseng pele ea liphutheloana e kenyelletsa mekhoa ea ho bokella li-chip (haholo-holo li-chip tsa memori) le li-chip tse kentsoeng, ho tsoa ka fan, ho paka ka boemo ba wafer, le ho paka ka boemo ba sistimi (ho kopanya li-chip tse nyane kapa li-chip tse ngata ka har'a sephutheloana se le seng). Mokhoa o mong oa li-chip tsa logic ke ho arola mesebetsi e tloaelehileng ea IP ka li-chip tse fapaneng, tse nyane, tse bitsoang "li-microchip," tse hokahantsoeng ka li-interface tse tloaelehileng sephutheloana se le seng. Li-chip tse nyane li sebetsa le li-chip tse ling tse nyane, kahoo meralo e tlameha ho ntlafatsoa hammoho 'me e ke ke ea etsoa ka thoko. Setsi sa Liprojeke tsa Lipatlisiso tse Tsoetseng Pele tsa Tšireletso (DARPA) le Sesole sa Metsing, hammoho le libapali tsa indasteri (AMD, Marvell, le Intel), li na le merero e mengata e hlahlobang mokhoa ona. Liphutheloana tse tsoetseng pele li na le boleng ba ts'ireletso ea naha ka ho arola ts'ebetso, polokeho, bophahamo le ts'ebetso ea tikoloho ho fana ka lisebelisoa tse ka fetoloang bakeng sa lits'ebetso tse ikhethang tsa ts'ireletso ea naha.

Liphutheloana tse tsoetseng pele li nkile karolo ea 42.6% ea kakaretso ea boleng ba liphutheloana tsa semiconductor ka 2019 mme e lebelletsoe ho fihla ho 2025. E tla ikarabella hoo e batlang e le halofo ea 'maraka oohle oa liphutheloana tsa semiconductor. Sena se ka emela sekhahla sa kholo ea selemo le selemo (CAGR) ea 6.1% lipakeng tsa 2014 le 2025, ka lekeno le tsoetseng pele la liphutheloana le imenneng habeli ho tloha ho $20 bilione ka 2014 ho isa ho $42 billion ka 2025. Sena se batla se le makhetlo a mararo kholo e lebelletsoeng ea mmaraka oa liphutheloana tsa setso. , ka CAGR e lebelletsoeng ea liperesente tse 2.2 lipakeng tsa 2014 le 2025.

Likhamphani tse 10 tse holimo lefatšeng tsa ho paka tse tsoetseng pele li kenyelletsa: lik'hamphani tse peli tsa IDM (Intel ea United States le Samsung Korea); TSMC hape ke e 'ngoe ea lik'hamphani tse 10 tse holimo lefatšeng tsa ho paka tse tsoetseng pele. Lik'hamphani tse hlano tse holimo tsa ho paka tse tsoetseng pele tsa OSAT lefatšeng li kenyelletsa ASE (Taiwan), SPIL (Taiwan), Amkor (USA), Powertech Technology (Taiwan) le JCET (China). Ho phaella moo, ho na le lik'hamphani tse peli tse nyane tsa OSAT, Nepes Display (Korea) le Chipbond (Taiwan). Lik'hamphani tse 10 li sebetsana le hoo e ka bang karolo ea boraro ho tse 'ne ea li-chips tse tsoetseng pele tse pakiloeng.

Ho paka ka mokhoa o tsoetseng pele United States ho fanoa haholo-holo ke barekisi ba IDM, ho kenyeletsoa Intel, Texas Instruments le Micron. GlobalFoundries ke feme e thehiloeng US e boetse e fana ka lits'ebeletso tse tsoetseng pele tsa ho paka. Ho phaella moo, lik'hamphani tse nyane, tse kang Micross, Skywater le Qorvo, li fana ka lits'ebeletso tse tsoetseng pele tsa ho paka ho fihlela litlhoko tsa tšireletso le tsa indasteri.

Joalokaha ho boletsoe ka holimo, leha China hajoale ha e na bokhoni bo matla ba ho paka, e ntse e nts'etsapele bokhoni bo tsoetseng pele ba ho paka ho lefella khaello ea eona ea tlhahiso ea semiconductor e tsoetseng pele.

Ha bokhoni le tlhokahalo ea liphutheloana tse tsoetseng pele li ntse li hola, maikutlo a rometsoeng karabelong ea Federal Registration Notice of Investigation (NOI) a supa khaello ea liphutheloana tse tsoetseng pele tsa ho paka (tse ipapisitseng le thekenoloji ea boto ea potoloho e hatisitsoeng) le bofokoli ho ketane ea phepelo e amanang le eona United States. Base material supplier e fumaneha Asia. Likhamphani tse kholo tsa substrate li kenyelletsa: Ibiden (Japan), Nanya (Taiwan), Shinko (Japan), Samsung (Korea), Unimicron (Taiwan), Shennan Circuits (Chaena), Zhuhai Yueya (Chaena) le AKM Electronics Industrial (Chaena).

Ntle le moo, tlhahiso ea PCB e falletse China, e etsa hore e be 'maraka o khahlang ho feta bakeng sa barekisi ba substrate. IPC/ US Reliable Electronics Partnership (USPAE) e hakanya hore US e na le lilemo tse 20 ka morao ho Asia ka theknoloji ea tlhahiso ea boto ea potoloho bakeng sa lisebelisoa tsa elektronike tsa moloko o latelang, US e kile ea ikarabella ho feta 30% ea tlhahiso ea lefats'e ea potoloho e hatisitsoeng; hona joale e ikarabella ka tlase ho 5%

(B) Likotsi tse kholo

Matsete a China ho liphutheloana tse tsoetseng pele a sokela mebaraka e tlang:

Le ha China e haelloa ke mokhoa o matla oa ho paka o tsoetseng pele, mmuso oa China o tsetetse haholo ho paka tse tsoetseng pele. Liphutheloana tse tsoetseng pele esale e le sepheo sa theknoloji sa indasteri ea li-semiconductor ea China lilemong tse 'maloa tse fetileng, 'me Lekhotla la Naha le ikemiselitse ho paka liperesente tse ka bang 30 tsa lekeno la ho paka bakeng sa barekisi ba Machaena ka 2015. Ka Pherekhong 2021, motlatsi ea sa tsoa hiroa oa SMIC. molula-setulo o ile a re lik'hamphani tsa Machaena li lokela ho tsepamisa maikutlo ho liphutheloana tse tsoetseng pele ho hlōla bofokoli ba bona ba ho fokotsa bophara ba mohala oa semiconductor, e leng se ka bontšang hore SMIC e tla tsamaea ka matla ho kenya liphutheloana tse tsoetseng pele. Stephen Hiebert, Mookameli ea phahameng oa papatso ho SEMICONDUCTOR Packaging KLA, o tlalehile ka 2018 hore "... Re bona matsete a matla a OSAT Chaena e le ho eketseha ha matla a ho paka ho bapisa merero ea masela a pele a China."

Bokhoni bo sa lekaneng ba lisebelisoa tsa ho paka tse tsoetseng pele:

Li-packaging substrates tse tsoetseng pele li ipapisitse le theknoloji e hatisitsoeng ea boto ea potoloho, e hlahisoang haholo Asia mme haholo Chaena. Sena se baka phephetso ho lik'hamphani tse batlang ho tsetela ho liphutheloana tse tsoetseng pele United States.

Litlhoko tsa tšireletso feela ha lia lekana ho boloka theknoloji e tsoetseng pele ea ho paka US:

Palo e nyane ea lik'hamphani tsa Amerika li fana ka litharollo tse tsoetseng pele tsa ho paka bakeng sa litlhoko tsa tšireletso, 'me lik'hamphani tsena li na le karolo e nyane feela ea' maraka. Ha bokhoni bo tsoetseng pele ba ho paka bo ntse bo hola ka ntle ho US, bo tla tloha bo feta litlhoko tsa tšireletso 'me matla a' maraka a tla hohela bokhoni ba morao-rao linaheng tse ling. Qetellong, bongata bo susumetsa boqapi le thuto ea ts'ebetso; Ntle le bongata ba khoebo, US e ke ke ea khona ho tsamaisana le theknoloji mabapi le boleng, litšenyehelo kapa basebetsi.

(3) Kakaretso

Ka bokhuts'oane, US e its'etleha ho lisebelisoa tsa kantle ho naha tse tsepamisitsoeng Asia bakeng sa bokhoni ba morao-rao ba ATP, bo bakang kotsi ea tšitiso ea phepelo karolong ena ea phepelo. Encapsulation e ntse e tsoela pele ho feta ha indasteri e batla litsela tse ncha tsa ho lefella ho rarahana ha likarolo tse nyenyane le tse nyenyane ho nodes tse tsoetseng pele kapa tse nyenyane ka ho fetisisa, lihlahisoa tse tlaase, le ho fokotsa meputso e fokolang. Le hoja United States le balekane ba eona ba na le bokhoni bo tsoetseng pele ba ho paka, matsete a maholo a Chaena a ho paka a tsoetseng pele a na le monyetla oa ho senya 'maraka nakong e tlang. Ntle le moo, US e haelloa ke tikoloho ea ho nts'etsapele mahlale a tsoetseng pele a ho paka.

Boitlhotlhollo: Sengoloa sena se hatisitsoe hape ho tsoa ho "Mong. Wang's Restaurant talk", sengoloa sena se emela maikutlo a sengoli feela, ha se emele maikutlo a Sakwei le indasteri, feela ho hatisa le ho arolelana, ho ts'ehetsa ts'ireletso ea litokelo tsa thepa ea mahlale, ho hatisa hape. ka kopo bonts'a mohloli oa mantlha le mongoli, haeba ho na le tlolo ea molao, ka kopo ikopanye le rona ho hlakola.