(E Tsoela Pele ho tsoa Karolong ea I: Moralo o Kopanetsoeng oa Potoloho, Karolo ea II: Tlhahiso e Kopanetsoeng ea Potoloho, Karolo ea III: Ho Pakanngoa ha Motheo, Teko, le Ho Packaging Hantle)

5. Lisebelisoa tsa tlhahiso ea lihlahisoa tsa semiconductor

(1) Kemiso ea Lisebelisoa tsa Tlhahiso ea Semiconductor Likhoebo tse Nyenyane le tse Mahareng

Ho na le mefuta e mengata ea lisebelisoa tsa ts'ebetso ea lihlahisoa tsa semiconductor le lisebelisoa tsa tlhahiso tse sebelisoang ke likhoebo tse nyane le tse mahareng ts'ebetsong ka 'ngoe ea mohala oa tlhahiso ea semiconductor. Ho na le lisebelisoa tse khethehileng tsa semiconductor (pele ho ts'ebetso) bakeng sa ho etsa li-wafers tse se nang letho (lisebelisoa), lisebelisoa tsa ho lokisa li-wafers tse se nang letho ho li-wafers tsa ho qetela (post-processing), le lisebelisoa tsa ho etsa li-photomasks (tlhahiso ea mask). Baetsi ba li-chipmaker ba hloka lisebelisoa tse fapaneng tsa ho qetela meleng ea bona ea tlhahiso. Litsenyehelo tsa thepa e rarahaneng ea ho etsa semiconductor e ka pele ke lebaka le ka sehloohong la theko e phahameng ea masela a semiconductor, ho kenyelletsa le litšenyehelo tsa ho haha ​​masela a hloekileng haholo.

Thepa ea ho etsa semiconductor e ka pele e kenyelletsa lisebelisoa tsa ts'ebetso ea ho etsa chip joalo ka photolithography, etching, doping kapa ion implantation, deposition, polishing, kapa chemical mechanical planarization. Ntho ea bohlokoa haholo ke lisebelisoa tsa tšepe-organic chemical vapor deposition (MOCVD), mofuta o itseng oa thepa ea ho bea e behang likarolo tse tšesaane tsa litšepe tse itseng, tse sebelisoang haholo ho hlahisa li-semiconductors tse kopantsoeng, ho kenyelletsa le tse thehiloeng ho GaAs le GaN.

Thepa ea ho etsa semiconductor ea morao-rao ea SME e kenyelletsa ATP le lisebelisoa tse tsoetseng pele tsa ho paka.

(2) Boemo ba hona joale

Thepa ea tlhahiso ea semiconductor e laoloa ke lik'hamphani tsa US (kabelo ea 41.7% ho latela chelete ea thekiso), Japane (31.1%) le Netherlands (18.8%). Korea Boroa e na le karolo ea 2.2%, ha karolo e setseng e batla e le 6.2% e arolelanoa ke Chaena, Jeremane, Taiwan, Israel, Canada le linaha tse ling tsa Asia Boroa-bochabela le Europe. Boholo ba baetsi ba lisebelisoa tsa tlhahiso ea semiconductor ba Korea Boroa ke ba Samsung kapa SK Hynix, bareki ba ka sehloohong ba lik'hamphani tsena tsa Korea Boroa tsa lisebelisoa tsa semiconductor ke lik'hamphani tsa Korea Boroa. Le hoja ho boetse ho na le k'hamphani ea Chaena e etsang mefuta e fapaneng ea lisebelisoa tsa tlhahiso ea semiconductor, lik'hamphani tsa Chaena ha li na karolo e kholo ea sehlopha leha e le sefe sa lisebelisoa tsa tlhahiso ea semiconductor ntle le kopano ea morao-rao, lisebelisoa tsa ho paka le MOCVD.

Ka kakaretso, US e ikarabella bakeng sa karolo e kholo ea tlhahiso ea lefats'e ea boholo ba lisebelisoa tsa tlhahiso ea li-semiconductor tse ka pele-pele, ntle le tlhahiso ea thepa ea lithography e tsepamisitsoeng Netherlands le Japane. US e boetse e ikarabella bakeng sa karolo e kholo ea tlhahiso ea lefats'e ea lisebelisoa tsa tlhahlobo ea morao-rao. Ka lehlakoreng le leng, United States e na le karolo e nyane ea mmaraka indastering ea lisebelisoa tsa tlhahiso ea semiconductor ea lefats'e (lisebelisoa tsa kopano le tsa ho paka), athe China e na le karolo e kholo. Le hoja hajoale Chaena e itšetlehile haholo ka thepa ea tlhahiso ea semiconductor eo e seng ea Chaena (ntle le ho paka le MOCVD), e tsetela haholo ho tsepamisa maikutlo ho hlahiseng thepa e joalo. Matsete ana a fa lik'hamphani tse ruang molemo monyetla o moholo oa ho nts'etsapele le ho hlahisa lisebelisoa tsa morao-rao tse amanang le lik'hamphani tse ling.

Joalokaha chate e ka tlase e bontša, ha US e na le karolo e kholo ea 'maraka tlhahiso ea li-SME tse ngata tse ka pele, mokhelo o hlokomelehang ke lisebelisoa tsa lithography scan / stepper, tse batlang li entsoe ka ho feletseng ke khampani ea Madache ea ASML le lik'hamphani tsa Japane Nikon le Canon. Bakeng sa mechine ea lithography, ASML (Netherlands) ke eona feela e hlahisang EUV steppers/scanners, e leng ea bohlokoa bakeng sa tlhahiso ea li-circuits tse kopantsoeng ka bophara ba mela ea 5 nm kapa ka tlase. Leha ho le joalo, ke baetsi ba semiconductor ba babeli feela, TSMC le Samsung, hajoale ba sebelisang mechini ea EUV tlhahisong, ka sesebelisoa se le seng se jang chelete e fetang $100 milione. ASML le Nikon ka bobeli ba etsa metjhini e tebileng ea ultraviolet (DUV) e hlahisang khanya ea khanya ka har'a photomask le ho etsa setšoantšo se theohileng sa setšoantšo sa photomask holim'a sephaphatha. Ka ntle ho Netherlands le Japane, karolo ea US le linaha tse ling ea thepa ea lithography e etselitsoe haholo-holo bakeng sa li-chips tse nang le molumo o tlase kapa ho etsa limaske tsa lifoto.

Sehlopha sa lisebelisoa tsa tlhahiso ea semiconductor se ka ba le likarolo tse ka bang 100+, 'me likarolo le lisebelisoa tsa lisebelisoa tsa semiconductor ke karolo e kholo ka ho fetisisa ea khoebo indastering. Ho ea ka phuputso ea Baetsi ba Baetsi, halofo ea chelete ea thekiso ea thepa ea semiconductor ea US e ea likarolong le lisebelisoa tse ling. Likhamphani tse fetang 130 tsa US li fana ka lisebelisoa tsa bohlokoa bakeng sa lisebelisoa tse rekisoang ke lik'hamphani tsa kantle ho naha. Haholo-holo, Cymer (USA) e etsa lasers bakeng sa mochini oa ASML oa EUV stepper/scanner lithography. ASML e fumane Cymer ka 2013, empa Cymer e ntse e le setsi se ikemetseng sa ASML se thehiloeng US.

Ka lebaka la mofuta oa lithekiso ka lebaka la mebaraka e fokolang le bareki, lik'hamphani tse ngata tse kholo tsa lisebelisoa li etsa mefuta e fetang e le 'ngoe ea lisebelisoa ho fa bareki lethathamo le felletseng la lisebelisoa le likhetho tsa tlhokomelo. Lik'hamphani tsa lisebelisoa tsa lithography stepper / scanner joalo ka ASML ke mekhelo molaong ona ka lebaka la theknoloji e ikhethang ea lisebelisoa. Lam Research, Tokyo Electron (TEL) e tsepamisitse maikutlo ho beheng le ho etching, ha KLA e shebane le metrology le tlhahlobo.

Mokhelo o mong o ka sehloohong Japane le Netherlands ke thepa ea MOCVD, e sebelisetsoang ho hlahisa li-semiconductor tse entsoeng ka thepa e 'ngoe ntle le silicon joalo ka GaN le GaAs, ho kenyeletsoa li-LED, li-laser diode le li-chip tse ling tsa photonic, lisebelisoa tsa motlakase/RF le lisele tsa letsatsi. Joalokaha ho boletsoe kaholimo, li-chip tsa GaN li na le litlamorao tsa ts'ireletso ea maano. Lisebelisoa tsa MOCVD li etsoa ke Veeco (USA), Aixtron (Jeremane) le AMEC (China). Chaena e leka ho fumana karolo ea 'maraka' marakeng oa MOCVD ka ho reka. Ka 2016, mokhatlo oa Chaena oa Fujian Grand Chip Investment Fund, k'hamphani e thehiloeng bakeng sa tumellano, ho kenyeletsoa le mekhatlo ea mmuso le ea libaka, e ile ea leka ho reka Aixtron, empa tumellano ena e ile ea thibeloa ke Mopresidente Obama kamora tlhahlobo ea Komiti ea Matsete a Kantle ho Naha United States (CFIUS), mohlomong ea moreki ea ileng a tlohela tlhahiso ea ho nka thepa.

Likhamphani tse tharo tse holimo bakeng sa lisebelisoa tsa etching ke Lam Research (US), Tokyo Electron (Japan), le Applied Materials (US). Likhamphani tsa Machaena, ho kenyeletsoa le AMEC, li na le boiphihlelo bo itseng ba ho etching mme li ka fana ka lisebelisoa bakeng sa lits'ebetso tse tlase, leha ho le joalo, karolo ea bona ea mmaraka e ka ba 1% feela.

US e na le karolo e nyane ea mmaraka (4.9%) ho li-SME tsa ho paka ka morao ha li bapisoa le lisebelisoa tsa tlhahiso ea semiconductor tse ka pele. Japane e na le karolo e kholo ka ho fetisisa ea thepa ea ho paka (35.7%), e lateloa ke Chaena (22.9%) le Netherlands (11.1%). Leha ho le joalo, Kulicke le Soffa ba thehiloeng US ke k'hamphani e etellang pele ea ho paka lisebelisoa tsa semiconductor. US le Japane li etella pele lisebelisoa tsa tlhahlobo ea morao-rao (ATP) ka karolo ea 33.5% le 48.6% ea mmaraka, ka ho latellana.

(3) Thepa ea tlhahiso ea semiconductor, kotsi ea United States

Ho itšetleha ka lithekiso tsa kantle ho naha (tseo e seng tsa US):

Leha US e na le karolo e kholo ea 'maraka oa lisebelisoa tsa tlhahiso ea semiconductor, bahlahisi ba US ba itšetlehile haholo ka thekiso ea kantle ho naha. Jwalo ka bahlahisi ba semiconductor ba baholo ka ho fetisisa, Taiwan, Chaena le Korea Boroa ke limmaraka tse kholo ka ho fetisisa bakeng sa lisebelisoa tsa tlhahiso ea semiconductor. Le hoja Taiwan e lebelletsoe ho fumana boemo ba eona hape e le 'maraka o moholo ka ho fetisisa bakeng sa lisebelisoa tsa tlhahiso ea semiconductor ka 2021 le 2022, ka lebaka la tšebeliso e boima ea lichelete tse hlokahalang ke lisebelisoa tsa chip, Applied Materials le Lam Research li tlaleha hore hoo e ka bang 90% ea chelete eohle ea eona ea 2020 e tla tsoa thekisong e seng ea US. Lekeno la Lam Research le tsoang Chaena le eketsehile ho tloha ho 16% ka 2018 ho ea ho 31% ka 2020. Ka lebaka leo, baetsi ba lisebelisoa tsa tlhahiso ea semiconductor ba US ba kotsing ea ho angoa haholo ke lithibelo tsa khoebo tsa US-China kapa liphetoho tse sa lebelloang tsa tlhoko Asia. Tšusumetso e hlahang e ka feta hole ho fokotseha ha chelete hona joale, kaha bahlahisi ba semiconductor ba na le tekanyo ea ho koalloa ha lisebelisoa, 'me ho fetola bafani ba lisebelisoa ho hloka meralo e turang. Mohlala, Lam Research e hlokometse tlalehong ea eona ea selemo le selemo ea 2020, "Hang ha moetsi oa semiconductor a itlama ho reka lisebelisoa tsa tlhahiso ea semiconductor tsa mohlodisani, hangata moetsi o tsoela pele ho reka lisebelisoa tsa mohlodisani eo, e leng se etsang hore ho be thata hore re rekisetse moreki eo nakong e tlang. lisebelisoa." Ho phaella moo, thekiso ea lisebelisoa tsa tlhahiso ea semiconductor e lekanyelitsoe liunivesithing le lik'hamphaning tsa tlhahiso ea semiconductor tse nang le masela. Lik'hamphani tsa lisebelisoa tsa tlhahiso ea semiconductor li ke ke tsa holisa bareki ba tsona ka ntle ho mekhahlelo ena hobane lisebelisoa tse joalo li ikhetha indastering ea semiconductor.

Lithuso tsa China bakeng sa tlhahiso ea lisebelisoa tsa tlhahiso ea semiconductor li sotha 'maraka:

Ntle le moo, China e rera ho fana ka lithuso tse ngata ho tšehetsa tlhahiso ea lisebelisoa tsa tlhahiso ea semiconductor naheng. Mokhahlelo oa bobeli oa Letlole la Matsete la Naha la China le Kopanetsoeng la Matsete le shebane le mechini ea etching, lisebelisoa tsa deposition, liteko le lisebelisoa tsa ho hloekisa, ka chelete e tlohang ho $28.9 ho isa ho $47 billion. Lithuso li boloka lik'hamphani tsa China li le khoebong, leha tse ngata li bonahala li se na phaello. Ka mohlala, ho ea ka Organization for Economic Co-operation and Development (OECD), "liente tsa lichelete tsa 'muso li bile le phello e hlakileng ts'ebetsong ea lichelete ea bahlahisi ba Semiconductor ba Machaena," moo keketseho ea thepa ea khoebo e sa kang ea bapisoa le kholo ea phaello. . Lithuso tsena li fa lik'hamphani tsa China chelete ea ho tsetela ho etsa lipatlisiso le nts'etsopele molemong oa tlhahiso ea semiconductor ea moloko o latelang, e ba fa monyetla o moholo ho feta lik'hamphani tseo e seng tsa China tse sa fumaneng lithuso tse joalo. Ho fapana le nakong e fetileng, baetsi ba lisebelisoa tsa tlhahiso ea semiconductor kajeno ba leqe ho tsetela ho R&D bakeng sa boholo ba li-wafer tsa moloko o latelang, ka lebaka la litšenyehelo tse ngata tsa R&D le chelete e ngata ea ho etsa lisebelisoa tsa tlhahiso ea semiconductor le ho hloka bonnete ba hore na tlhahiso ea chip e tlang pele e tla etsoa neng le hokae. .