Khamphani ea Design ea Chip ke eng?

A khampani ea chip design e sebetsa ka ho khetheha ho theheng meralo e kopaneng ea potoloho (IC) e sebelisoang lisebelisoa ho tloha ho li-smartphones ho isa ho litsamaiso tsa AI. Lifeme tsena li fetola meralo ea mohopolo hore e be meralo e ka hlahisoang, lisebelisoa tse matlafatsang joalo ka elektroniki design automation (EDA). Ho fapana le metheo ea semiconductor, lik'hamphani tsa ho etsa li-chip e shebane haholo le boqapi, e nolofalletsang mefuta ea lisebelisoa tsa elektroniki ho fana ka R&D e rarahaneng. Bakeng sa lihlopha tsa ho reka thepa, ho sebelisana 'moho le lifeme tse joalo ho netefatsa phihlello ea theknoloji e tsoetseng pele ntle le matsete a boima a pele ho meaho ea moralo.

Histori ea Tsoelo-pele ea Likhamphani tsa Chip Design

Ho hlaha ha lik'hamphani tsa ho etsa li-chip ho tloha lilemong tsa bo-1990, ho susumetsoa ke tlhoko ea ho fokotsa litšenyehelo le ho akofisa boqapi. Bo-pula-maliboho ba pele ba kang ARM ba ile ba fetola indasteri ka li-cores tsa IP tse nang le tumello, ba theola moralo ho tsoa ho mahlale. Phetoho ena e ile ea lumella lifeme tse nyane ho qothisana lehlokoa le linatla joalo ka Intel. Ha nako e ntse e ea, tsoelo-pele ea lisebelisoa tsa EDA le Molao oa Moore e ile ea phahamisa tsebo, ka lik'hamphani tse shebaneng le li-niches tse kang GPUs (NVIDIA) kapa li-processor tsa mobile (Qualcomm). Kajeno, lekala le atleha ka tšebelisano 'moho le li-OEMs ho fana ka li-chips tsa moloko o latelang.

Lintlha tsa Bohlokoa tsa Histori

• 1990: ARM e hlahisa meralo ea meralo e nang le tumello ea molao.
• Li-2000: Ho phahama ha mefuta e sa tloaelehang, e bontšitsoeng ke Broadcom le MediaTek.
• Li-2020: Tlhokahalo e tsamaisoang ke AI ea li-ASIC tsa tloaelo le li-SoCs.

Litšobotsi tsa Likhamphani tsa Design tsa Chip

mokhoa oa kajeno oa lik'hamphani tsa ho etsa li-chip li hlalosoa ka litšiea tse tharo: boqhetseke ba ho qapa, Botebo ba IP portfolio, 'me boitseanape ba indasteri. Ka potlako ba ikamahanya le mekhoa e kang 5G le edge computing, hangata ba lokolla meralo e ntlafalitsoeng selemo le selemo. Lilaeborari tse matla tsa IP - joalo ka li-cores tsa ARM's Cortex - li nolofalletsa meralo e ka sebelisoang hape, e fokotsa nako ea ho ea 'marakeng. Ho feta moo, lifeme tsena li sebelisana 'moho le likarolo tsa likoloi, tsa bophelo bo botle le tsa IoT, ho lokisa tharollo bakeng sa lits'ebetso tse fapaneng. Lihlopha tsa boenjiniere li tlameha ho lekola bokhoni ba k'hamphani ba ho leka-lekanya ts'ebetso, ts'ebetso ea matla, le ho sekala ha ho khethoa molekane.

Mekhahlelo ea Lik'hamphani tsa Chip Design

khethang a khampani ea chip design e hloka ho sekaseka metrics ea tekheniki le ts'ebetso. Li-parameter tsa bohlokoa li kenyelletsa:

• Khokahano ea li-node: Ts'ehetso bakeng sa 7nm, 5nm, kapa theknoloji e tsoetseng pele ea ho paka.
• Phapano ea IP: Ho fumaneha ha li-processor cores, li-memory controller, le li-module tsa khokahano.
• Nako-to-market: Karolelano ea nako ea potoloho ea moralo ho tloha mohopolong ho isa ho tape-out.

Ka mohlala, lik'hamphani tse joalo NVIDIA e ipabola ka har'a meralo ea GPU e ntlafalitsoeng bakeng sa mesebetsi e mengata ea AI, ha Qualcomm e laola li-SoC tsa mobile ka li-modem tse kopaneng tsa 5G.

Likarolo tsa Likhamphani tsa Moralo oa Chip ho Consumer Electronics

Lik'hamphani tsa ho etsa li-chip sebetsa joalo ka lienjineri tse ncha bakeng sa lisebelisoa tsa elektroniki tsa bareki. Ba nolofalletsa lihlahisoa ho khetholla lihlahisoa ka silicon e tloaelehileng, joalo ka li-chips tsa M-Series tsa Apple kapa li-processor tsa Tensor tsa Google. Ka moralo oa ho rekisa kantle, li-OEM li fokotsa likotsi tsa R&D mme li shebane le likarolo tse ikhethileng tsa mmaraka. Lihlopha tsa ho reka thepa li tlameha ho lekola lintlha tse kang mefuta ea lilaesense (tse thehiloeng ho royalty khahlano le litefiso tsa pele) le ho lokisoa ha 'mapa oa nako e telele ho netefatsa hore litšenyehelo li sebetsa hantle.

Likopo tsa Likhamphani tsa Design tsa Chip

Ho tloha ho li-smartphone ho ea ho lisebelisoa tse bohlale tsa lapeng, lik'hamphani tsa ho etsa li-chip e tšehetsa hoo e batlang e le theknoloji e 'ngoe le e' ngoe ea bareki. Lisebelisoa tsa bohlokoa li kenyelletsa:

• Mobile processors: Li-CPU tse sebetsang hantle bakeng sa ho etsa lintho tse ngata tse se nang moeli.
• Li-accelerator tsa AI: Li-chips tse khethehileng bakeng sa mesebetsi ea ho ithuta ka mochini.
• Balaoli ba IoT: Li-IC tsa matla a tlase bakeng sa lisensara tse hoketsoeng le tse ka roaloang.

Libaka tse ntseng li hlaha joalo ka quantum computing le likoloi tse ikemetseng li eketsa menyetla ea ho rarolla mathata a IC.

Thuto-pale: Smartphone Innovation

Tšebelisano ea Apple le lik'hamphani tsa ho etsa li-chip joalo ka TSMC le ARM li hlahisitse chip ea A16 Bionic, e fanang ka ts'ebetso ea 40% e potlakileng ea GPU. Tšebelisano ena e totobatsa kamoo litšebelisano tsa maano li tsamaisang melemo ea tlholisano mebarakeng e nang le batho ba bangata.

Baetsi ba Likhamphani tsa Design tsa Chip

The khampani ea chip design landscape e na le baetapele ba joalo ka NVIDIA, Qualcomm, AMD, le ARM, hammoho le libapali tse ntseng li phahama joalo ka MediaTek le Unisoc. NVIDIA e laola AI le lits'oants'o, ha Qualcomm e etella pele ho li-IC tsa puisano tse se nang mohala. Lifeme tsa tikoloho, joalo ka HiSilicon ea China, li ntse li hola nakong ea liphetoho tsa lipolotiki. Lihlopha tsa ho reka thepa li lokela ho etelletsa pele balekane ba nang le maqheka a netefalitsoeng le maano a ho fokotsa kotsi ea tikoloho.

fihlela qeto e

Bakeng sa ho reka thepa ea elektronike le lihlopha tsa boenjiniere, kutloisiso lik'hamphani tsa ho etsa li-chip e bohlokoa bakeng sa ho fumana leano le nts'etsopele ea lihlahisoa. Ho tloha ho ho iphetola ha lintho tsa nalane ho isa ho maemo a tekheniki, tsebo ena e netefatsa liqeto tse nang le tsebo indastering e ntseng e fetoha ka potlako. Ha tlhoko ea li-IC tse khethehileng e ntse e hola, tšebelisano le lifeme tsa meralo e tsoetseng pele e tla lula e le bohlokoa. Lekola lisebelisoa tse nang le matla joalo ka Mokhatlo oa Liindasteri tsa Semiconductor bakeng sa kutloisiso e tebileng.