Evolution of CIS Packaging

Initially, CIS packaging used ceramic with glass covers, such as Amkor's VisionPak, which was expensive and occupied significant camera space.

By the late 20th century, Wafer Level Packaging (WLP) emerged, offering smaller size, lighter weight, and lower cost.

In March 2007, Toshiba showcased a WLP graphic sensor module with through-silicon via (TSV) technology, which provided fully enclosed devices, reduced contamination-related yield losses, and offered benefits like reduced size, lower parasitic effects, improved chip speed, and lower power consumption.

Today, only four OSAT companies—TSMC's Advanced Semiconductor Engineering, Huahong Group, JCET, and KYEC—offer image sensor WLP solutions, with Huahong and JCET providing 300 mm (12-inch) WLP services.