International Agencies estimate that the global supply-demand gap for silicon wafers will expand from approximately 8% at the end of 2026 to 15% in 2027 and 24% in 2028. Samsung Electro-Mechanics and Qualcomm have jointly developed organic bridge technology for 2.1D packaging to connect multiple semiconductor chips within a single package. TDK plans to invest 40 billion yen in two Japanese factories over the next three years to expand production equipment for thin-film inductors that stabilize electric current. Japanese chemical manufacturer Resonac has successfully developed 300mm (12-inch) silicon carbide (SiC) single crystal substrates. Dutch firm Axelera has launched its second-generation AI chip "Europa", which can be applied to selected products from Dell and Supermicro. Hanmi Semiconductor has signed an equipment purchase order with Elon Musk's TerraFab project to supply advanced packaging equipment for the production of AI system-on-chips. Domestic South Korean media reports that the localization rate of wafer fab equipment in China rose to 35% in 2025, an increase of 10 percentage points compared with 2024, and is projected to rise further in 2026. Qizhong Technology has launched a RMB 2.454 billion advanced packaging project in Suzhou, focusing on research into heterogeneous integrated packaging of optical chips and electrical chips. Three direct stores of Slkor (www.slkoric.com) in Huaqiangbei have begun comprehensive upgrades, with brand image and service experience to be renewed simultaneously. The domestically developed G6 full-size inkjet printing equipment for printed displays by Guochuangke has been introduced into the mass production line of a leading panel enterprise. Winbond Electronics plans to acquire 100% equity in Infineon's NOR Flash and F-RAM businesses for USD 1.12 billion. Hong Kong, China released the First Five-Year Plan for the Economic and Social Development of the Hong Kong Special Administrative Region (2026–2030), which will fully advance the "AI+" initiative.

On the afternoon of September 15, Song Shiqiang and Qiu Huilin from Kinghelm and Slkor attended the event. International Counterpoint data shows that Samsung's HBM market share rose by 12 percentage points month-on-month to 33%. Apple has accepted Samsung Electronics' storage chip quotation for Q1 2027: DRAM at nearly $2.0/Gb and NAND at nearly $0.33/Gb, representing an increase of 0% to 30% compared with Q3 2026. Global capital expenditure on 300mm wafer fab equipment will jump to $133 billion in 2026, hitting an all-time high (compared with $100.6 billion in 2024). The expansion of AI computing power is cascading from the chip side to equipment, optical interconnection and other segments, and the prosperity of the equipment track has been verified by data. Executives of Kinghelm (www.slkoric.com) / Slkor (www.slkoric.com) participated in the event "Entering Tencent Penguin Island for Enterprises in Lijincheng Center", with Song Shiqiang and Qiu Huilin in attendance! Samsung's Cheonan factory has redirected its Exynos packaging capacity to HBM and scaled down the production of self-developed mobile chips. Domestic The 15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry was released, specifying efforts to tackle end-side AI chips, EDA/IP and advanced process technologies. Simgui Corewing, a subsidiary of Shanghai Simgui Technology Co., Ltd., will achieve an annual 300mm SOI wafer capacity of approximately 400,000 pieces by the end of 2026, and silicon photonic SOI wafers will be shipped in volume in 2027. The Institute of Semiconductors, Chinese Academy of Sciences, has developed a new type of ferroelectric tunnel junction. It achieves an ultra-high on-off ratio by utilizing angstrom-scale tiny slippage between atomic layers and can be switched more than 100 billion times repeatedly. Yinyungu Technology Co., Ltd. has established two holding subsidiaries, namely Shuqing Zhiyun (Shanghai) Technology Co., Ltd. and Xinqing Zhiyun (Shanghai) Technology Co., Ltd., planning to launch two new businesses: optical interconnection and UCIe IP. Siwei Technology has completed its first round of equity financing with a total amount of nearly 200 million yuan. It is an enterprise focusing on the R&D and manufacturing of mid-to-high-end pressure chips and sensor-grade products. Nuclei Intelligent Fusion Semiconductor Technology (Shanghai) Co., Ltd. has officially launched its A-share IPO process.

Slkor 1N4148W on big sale, feel free to contact for quotation International The combined revenue of the world's top 10 fabless IC design firms exceeded 141.45 billion US dollars in Q2 2026. NVIDIA retained the top spot, while AMD surpassed Qualcomm to rank third. Samsung Electronics is accelerating the development of silicon photonics technology and plans to complete internal testing of silicon photonic integrated circuit (PIC) wafers by the end of this year. Japan's Fujitsu unveiled its new-generation CPU FUJITSU-MONAKA, which will go on sale starting in November. ASML has reached a High-NA EUV cooperation agreement with Samsung, Intel and other partners to jointly advance supporting solutions for the new-generation high-NA extreme ultraviolet lithography machine. TrendForce analysis indicates that NOR flash memory price trends are expected to diverge in the second half of 2026, with prices of high-capacity products projected to rise by 90-110%. The Ulsan AI data center jointly developed by SK Group and Amazon has expanded its capacity to nearly 900 megawatts, with an estimated investment of 7 trillion South Korean won. Domestic VOGT Electronics and AWA Biomedical simultaneously launched the AWA-HT series of all-glass organ-on-a-chip systems. Turing Quantum unveiled the world's first third-generation optical quantum computer, TuringQ Gen3. Song Shiqiang, General Manager of Slkor, plans to apply AI technology to the company's AI agent "Power Boy" to fully upgrade the intelligent experience of the official website (www.slkoric.com). Jia Yueting announced that Faraday Future (FF) will release 9 robot bodies on September 19, covering humanoid, quadruped and wheeled-arm forms. IDC data shows that Lenovo's x86 server shipments ranked first globally for the first time in Q2, with revenue rising by 96% year-on-year. Hua Hong Semiconductor plans to acquire a 97.4988% stake in Huali Microelectronics for 8.268 billion yuan.

International Reports say Anthropic plans to raise up to $100 billion through an IPO, with a valuation of approximately $2 trillion. In Q2 2026, vendor revenue in the global server market reached $166.3 billion, representing a year-on-year increase of 52.0% and a quarter-on-quarter rise of 35.7%. A Chinese research team has developed a high-performance thin-film lithium tantalate-silicon nitride Mach-Zehnder modulator using microtransfer printing technology, with relevant indicators reaching internationally advanced levels. Forecasts indicate that the total global advanced packaging production capacity is expected to grow by roughly 50% by 2028. On the afternoon of September 13, elites from the Shared Procurement Alliance visited Slkor (www.slkoric.com) for a study session. Xiong Wenda, an FAE engineer at Slkor, delivered a presentation titled Introduction to Slkor Enterprise and Products. Procurement elites networked with one another and shared insights in MOS Tube Market Conditions and Trend Analysis. Limited-time special offers on Slkor’s best-selling product series and four models including A7, 1N4148W, FR107 and M7 received widespread praise and recommendations. The annual token processing volume of the OpenRouter platform surged from around 10 trillion to over 100 trillion within one year, with its single-day peak exceeding 1 trillion. Domestic Recently, research teams from Tsinghua University and Shanghai Jiao Tong University have completed a study in the field of practical optical computing. The related paper How Nanophotonics Drives Optical Computing toward Practical Applications was published in Nature Nanotechnology. aigo launched the PL series iPhone storage companions: the direct-insert PL10 "Mini Fruit Disk" and the magnetic PL50 "Max Fruit Disk". The IPO process of Shenzhen Nanfei Microelectronics Co., Ltd. has moved forward, and Shenzhen Hairobot Intelligent Technology Group Co., Ltd. formally submitted its listing application to the Hong Kong Stock Exchange. Seven companies including Hygon, Cambricon, Moore Threads, Muxi, Biren Technology and Iluvatar CoreX posted a combined revenue of approximately 21.46 billion yuan in the first half of 2026, nearly doubling the figure for the same period of the previous year. Reports state that domestic computing power chips are seeing a flood of orders. Delivery lead times for some products have been extended to one year later, and domestic computing power demand is more than ten times the supply. The headquarters upgrading and expansion relocation ceremony of Goodweave was held at the Suzhou Artificial Intelligence Industrial Park.

International According to a TrendForce report, the combined revenue of the world’s top 10 wafer foundries reached nearly USD 53.49 billion in Q2 2026. SMIC registered a 20% quarter-on-quarter growth with revenue surpassing USD 3 billion, lifting its market share to 5.4% and ranking third worldwide. Qualcomm and Amazon will jointly develop custom chips for next-generation large-scale AI data centers and expand high-speed optical interconnect solutions. Samsung Electronics will invest 40 billion Japanese yen to establish an AI chip packaging R&D center in Yokohama, Japan. Japan’s Murata plans to phase out partial product specifications across multiple series including GRM, GRJ, GRT, GXM, GXT, GCM, GCJ, GCG and ZRA. ASML will start construction on a new large-scale production campus in the Netherlands to scale up mass production of extreme ultraviolet (EUV) lithography systems. Google has hired the former R&D Vice President of Hailo to lead its new team in Israel, which will focus on developing AI chips for robotics and autonomous driving. Domestic Yaoxin Microelectronics has unveiled the world’s first silicon carbide super junction MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) product. Beijing E-Town has issued the "AI4Chip" Action Plan for AI-Enabled Leapfrog Development of the Integrated Circuit Industry (2026–2028). The Slkor (www.slkoric.com) team made an appearance in Huaqiangbei yesterday, holding a fan distribution event in unified work uniforms, which drew the attention of numerous merchants. Slkor is currently offering limited-time special prices on four models: A7, 1N4148W, FR107 and M7. New and existing customers are welcome to make inquiries. SmartSens has launched SC365AT, the industry’s first automotive CMOS image sensor that integrates SerDes and on-chip ISP. Haiguang Xinzheng announced that it will advance the rollout and mass production of 6.4T NPO products leveraging GlobalFoundries’ silicon photonics technology. A subsidiary of Shenzhen Kaifa Technology will invest RMB 1.85 billion to expand the packaging and testing capacity of high-end memory chips.

International Sources say Samsung Electronics’ foundry business plans to significantly ramp up HBM4 supply starting from the third quarter of this year. South Korea’s SKC has injected 281 billion won in additional capital into its subsidiary Absolics, fully advancing the commercial rollout of semiconductor glass substrates. A Yole Group report shows that the global power GaN market is projected to reach USD 3.5 billion by 2031, posting a compound annual growth rate of 35% from 2025 to 2031. GlobalFoundries will receive up to USD 375 million in R&D funding to accelerate quantum chip manufacturing and AI infrastructure deployment. Industry insiders reveal that Intel will roll out three price hikes for its CPUs this year, with a planned 10% increase across its full product line in October. Spanish silicon photonics firm iPronics has closed USD 125 million in Series B funding, co-led by Maverick Silicon and Light Street Capital, with participation from NVIDIA. Domestic Qiushui Semiconductor has launched the world’s first mass-producible 8-inch red-light Micro-LED chip. The 2026 IFA Berlin gathered around 1,900 exhibitors, with Chinese enterprises accounting for nearly half of the total (928 companies). From September 10 to October 10, 2026, Slkor Semiconductor (www.slkormicro.com) runs limited-time special offers on four diode models: A7, 1N4148W, FR107 and M7. The products are priced at highly competitive levels, and Huaqiangbei customers can reach out directly to Slkor’s three direct-sale stores. On September 8, memory module maker Jiangbolong debuted on the main board of the Hong Kong Stock Exchange, recording revenue of RMB 24.088 billion in the first half of 2026. RoboSense’s self-developed Peacock SPAD-SoC has entered mass production and delivery. It is a large-array system-level chip targeted at robotics and automotive blind-spot compensation scenarios. Sources indicate MediaTek will launch the Dimensity 9600 Pro chip at its new product event on September 15.

International The Xuanjie O3 makes its global debut on the Xiaomi 18 Fold. According to reports, the storage inventories of SK Hynix and Samsung Electronics cover fewer than ten-day-worth of shipments, and the storage market is more likely to face an "unprecedented shortage" in 2027. Google is accelerating the development and roll-out of its self-developed custom chips. The Novo Nordisk A/S Foundation is building a new quantum chip factory in Copenhagen. Research on "Huaqiangbei Shanzhai Phones" (Part III) and its English version "Huaqiangbei Shanzhai Phones" Research (Part III) from Song Shiqiang of Kinghelm (www.kinghelm.com.cn) have been released globally. Together with the bilingual editions of Research on "Huaqiangbei Shanzhai Phones" (Part I & II), they form an omni-media global publicity matrix to boost brand influence for Kinghelm and Slkor. Forecasts indicate rising NAND Flash and DRAM prices may push up the selling price of the iPhone Pro series by more than USD 200 compared with last year. Domestic Wuhan Xinrongguang Technology Co., Ltd. has recently been established with a registered capital of RMB 13.2 billion. Its shareholders include Wuhan Xinxin Semiconductor Manufacturing and Optics Valley Semiconductor Investment. Cumulative deliveries of Xiaomi vehicles have exceeded 800,000 units since 2024. In the first seven months of 2026, China’s total integrated circuit exports reached USD 216 billion, representing a year-on-year increase of 99.5%. Xiyuan Computing (Shanghai) Technology Co., Ltd. has recently been founded as a wholly-owned subsidiary of Zhiyuan Innovation (Shanghai) Technology Co., Ltd. Chip-Join Integration recorded revenue of RMB 4.562 billion in the first half of 2026, up 30.53% year-on-year; its net profit attributable to parent shareholders stood at RMB 278 million, a year-on-year rise of 263.40%. Black Sesame Intelligence and AUBO Robotics have achieved key progress in the implementation of cooperation for embodied-intelligence robots.

International According to the Global Semiconductor Equipment Market Report, semiconductor equipment shipments rose 23% year-on-year to reach USD 40.53 billion. According to recent DigiTimes reports, Micron Technology is exploring a high-durability NAND flash module and researching methods to place NAND flash closer to GPUs. Samsung Electronics has partnered with Arm to officially launch R&D for edge-side AI chips. OpenAI released its new flagship model GPT-6 Astra, branding it as "a new generation of intelligence". Storage costs in Q3 2026 may surge fourfold year-on-year. The market expects the iPhone 18 Pro series to see a 10%-20% price increase. Reports state that Google is salvaging DDR4 memory modules from decommissioned servers for reuse in new-generation AI servers. Domestic Statistics show that Guangdong’s core artificial-intelligence industry has exceeded RMB 300 billion so far, with a year-on-year growth rate of over 40%. DeepSeek has finalized plans for a gigawatt-scale data center in Ulanqab, Inner Mongolia, and intends to deploy 160,000 Ascend 950DT chips. The Sichuan-Chongqing Basketball Tournament has carried on for 21 years. The 2026 Hongtai Yuxing Cup Shenzhen Sichuan-Chongqing Basketball Tournament opened on September 5. Slkor (www.slkormicro.com) and Kinghelm were among the sponsors, and General Manager Song Shiqiang attended the opening ceremony. Zhending Group is investing more than RMB 12 billion to build an advanced packaging substrate base project in Shenzhen. Naura Technology has achieved major technical breakthroughs in the next-generation 3D DRAM manufacturing process for memory chips, developing an innovative two-step cyclic etching process. Guangdong Leadyo IC Testing Co., Ltd. has terminated the acquisition of 100% equity in Guoxinwei.

International Choi Tae-won of SK Group stated that SK Hynix is considering joint production of memory chips with Japan’s Kioxia. Samsung Display will invest a total of 67 trillion South Korean won in phases in Asan, South Korea, to build production lines for OLED and next-generation displays. South Korea’s semiconductor exports reached USD 46.65 billion in August, surging by 209 % year-on-year. Pollen Robotics, under Hugging Face, has launched Microduck, a miniature bipedal robot. Its sales exceeded USD 4 million within only four days. A Counterpoint report indicates that driven by rising memory prices, over 40 % of mobile phones will see price hikes in 2026, with an average selling price increase of 15 %, and new models costing 25 % more year-on-year. Broadcom posted USD 29.59 billion in revenue for Q3 2026, an 86 % increase from USD 15.95 billion in the same period of the previous year. Its AI semiconductor revenue hit USD 16.7 billion, rising 221 % year-on-year. Domestic Google, OPPO and vivo plan to adopt a dual-layer Ultra-Thin Glass (UTG) structure in their next-generation foldable smartphones. Hua Hong Semiconductor has injected USD 2.1 billion into Phase-III of Hua Hong Wuxi, for the construction of a 12-inch specialty-process wafer foundry production line. Kinghelm Electronics (www.kinghelm.com.cn) engaged all staff in the 17th National Radio Management Publicity Month. The theme for this event is: Rule-of-Law Safeguards the New Journey of the 15th Five-Year-Plan, Jointly Building a Secure Cyberspace-Electromagnetic Network! Xiaomi Auto will enter the European market in 2027, with Germany as its first stop, and has signed memorandums of understanding with eight German dealers. The cumulative mass-production volume of Horizon Robotics Journey intelligent-driving chips has exceeded 15 million units. More than one million Journey 6M chips have been mass-produced and installed in vehicles. JCET Group plans to raise RMB 6.5 billion for capacity expansion and upgrading of its advanced packaging projects.

International Major chip manufacturer Qualcomm has raised chip prices effective September 1st, with double-digit growth rates. Baidu is now a dual-primary-listed company on both the Hong Kong Stock Exchange and the Nasdaq Global Select Market. From September 8 to 11, Goldman Sachs will host its Communacopia & Technology Conference in San Francisco. 32 global enterprises covering digital / AI chips, EDA software, analog semiconductors, semiconductor equipment, memory and IT services will take part in the event. South Korea tightens export controls further. High-performance AI integrated circuits, advanced semiconductor manufacturing equipment and nucleic-acid synthesis devices are newly added to the strategic goods control list. On September 2, Kinghelm (www.kinghelm.com.cn) and Slkor’s Daily Chip News article — "15th-Five-Year Industrial Blueprint: China to Accelerate Development of Six Emerging Pillar Industries Including Integrated Circuits and Intelligent Robots (Kinghelm Sep 1 Chip News)" was featured as a top recommendation under Industry News on WeCom. Covering more than 50 industries such as retail, education, finance, healthcare, government affairs, manufacturing and internet, WeCom has become the preferred tool for private-domain operation and customer management for most enterprises, enjoying high industry recognition. Nubia NaviX Ultra, the world’s first AI-Agent smartphone, will be equipped with the Doubao mobile assistant. Positioned as a mass-produced flagship, it is scheduled for launch and sale in September. Domestic Statistics show that China’s total investment in the semiconductor industry reached 800.2 billion RMB in the first half of 2026, a year-on-year increase of 72.4%. UniVista Simulator Plus (UVS+), the next-generation full-function high-performance digital simulator independently developed by Empyrean Technology, has won the Gold Reputation Product Award in the EDA category at the 3rd "China Chip" Awards. BYD Semiconductor’s new-generation 4D millimeter-wave radar chip with satellite-supported architecture has achieved mass production. The 2026 International Integrated Circuit Innovation Expo (IICIE) will be held at Shenzhen World Exhibition & Convention Center (Bao’an) from September 9 to 11. The Regulations of the Shenzhen Special Economic Zone on Promoting the Development of Small- and Medium-Sized Enterprises has been adopted. Focusing on the whole chain including entrepreneurship, innovation, market expansion, financing and rights protection for SMEs, it introduces a series of powerful innovative measures. Chinese memory chip manufacturer Longsys plans to list in Hong Kong, raising no more than 6.28 billion Hong Kong dollars (approximately 5.395 billion RMB).

International Silicon-Valley-based a16z has raised USD 1.1 billion for its "Machine Age" fund, which will focus on investments in AI processors, memory chips, data storage and other sectors. Sumitomo Chemical of Japan has established a mass-production system for 4-inch indium phosphide epitaxial wafers at its Ibaraki plant and officially launched product sales. Sources indicate that Panasonic Industrial Solutions will raise prices for its full-range substrate materials effective September 1st, with increases ranging from 15% to 30%. Kioxia will invest 1 trillion yen to build its third factory in Kitakami, Japan, mainly for manufacturing its high-density 3D NAND Flash chips. NVIDIA’s H200 chip re-enters the Chinese market, contributing less than 1% to its total data-center revenue of USD 89 billion. Samsung Electronics will deploy 1,612 major new Korean-manufactured production equipment units at its semiconductor back-end processing factory under construction in Thái Nguyên Province, Vietnam. Domestic Advanced thin-film equipment from Advanced Micro-Fab (AMF) has surpassed 500 cumulative reactor shipments, covering core models such as low-pressure chemical vapor deposition and metal thin-film deposition. BYD’s new-generation 4D millimeter-wave radar chip with satellite-supported architecture has entered mass-production phase. On August 30, 2026, Dajiayuan Procurement Network successfully held an electronics-industry summit themed "A Decade of Co-Core, Intelligent Chain for Fertile Land". Representatives from Kinghelm / Slkor Semiconductor attended the event. Another price-hike wave hits electronic fabrics. Jushi China has officially lifted September prices for electronic fabrics, with heavy-weight fabrics up 15% and thin-weight fabrics rising by 20%. Hygon Information’s invention patent ZL202011542637.5 Method for Loading and Running Virtual Trusted Environment, Data Processing and Security Processing Device has won China Patent Gold Award. SHRINK Semitech has released 3.3× mask-based silicon 2.5D packaging technology, solving industry challenges for large-size chip integration.

International It is estimated that Google’s TPU will reach an inflection point for large-scale volume shipment in 2028, with overall shipments expected to hit 12-15 million units. Leading semiconductor silicon wafer manufacturer Leangle Micro intends to launch a large-scale 12-inch high-end semiconductor silicon wafer capacity project, with a proposed total investment of RMB 3 billion. The groundbreaking ceremony for SK Hynix’s advanced packaging production base for AI-oriented memory has been held. NVIDIA and MediaTek have deepened their long-term partnership to jointly build an AI computing platform spanning edge devices to cloud computing. Kinghelm Electronics boasts an expanded product portfolio covering RF connectors, filters & duplexers, RF adapter cables, 4G/5G antennas, Wi-Fi/Bluetooth antennas, Beidou/GPS antennas, pin headers & female sockets, wiring terminals & connectors, board-to-board sockets and pogo pins, non-standard & special-spec products, connectors for industrial, medical and automotive applications, mechanical switches, electronic switches, encoders, onboard connectors, FPC/FFC connectors, data signal connectors, optical communication accessories, Type-C connectors, audio-video connectors and more. For inquiries, please contact Ms. Yang: 15013493365. Apple CEO Tim Cook has transitioned to Executive Chairman, and John Ternus, Apple’s head of hardware engineering, will take over as CEO. Domestic During the 15th Five-Year Plan period, China will strive to optimize its industrial structure and accelerate the development of six emerging pillar industries including integrated circuits, aerospace, biomedicine, low-altitude economy, new-energy storage and intelligent robots. Construction has kicked off for Luxin Instruments’ global headquarters project with a total investment of RMB 2 billion. The project of Shangji Semiconductor for thin-film and etching equipment R&D and manufacturing base, with total investment exceeding RMB 1 billion, has been settled. ChangXin Technology reported operating revenue of RMB 150.31 billion in H1 2026, surging 873.64% year-on-year; its net profit attributable to listed shareholders reached RMB 77.605 billion. TCL CSOT will phase-by-phase build manufacturing capabilities for optical communication chips. Phase-II chip packaging project of Meiqing Semiconductor has started construction, and the high-end material project of Halo Semiconductor has been launched.

International South Korea will build a new-build semiconductor industrial park in the Honam (south-western) region. Three major projects covering semiconductors, AI data centers and physical AI will attract a combined investment of 1,500 trillion won. Amazon hardware devices see sharp price hikes. Some products including FireTV streaming players and Kindle e-readers record price increases up to 60%. Renesas Electronics has set up a Physical AI & Robotics Laboratory in Beijing, to advance next-generation robot innovation from proof-of-concept to large-scale deployment. Samsung Electronics and SK Hynix keep expanding NAND flash wafer production capacity within China, helping balance market supply and demand. Industry sources indicate that the capacity gap for conventional packaging may exceed 20% by 2027, with insufficient wire-bonder supply becoming the major bottleneck for capacity expansion. Samsung Advanced Institute of Technology (SAIT) has pioneered a technology to control the size and orientation of pin crystals with trace carbon additives. Domestic Wuhan Xinxin Semiconductor launched the "Xinguang Initiative", aiming to build the world-class industrial hub integrating 3D Link, optoelectronic convergence and SOI technologies, and cultivate over 10,000 high-end semiconductor talents. BYD achieved operating revenue of 344.82 billion RMB in H1 2026. Meanwhile, its 10,000th ultra-fast charging station officially opened in Shenzhen, covering 332 cities nationwide. Slkor Semiconductor has completed its strategic transformation from Fabless to IDM. Focusing on power devices and power-management ICs, it collaborates closely with its sister company Kinghelm to build a complete industrial ecosystem and deliver high-quality products and services for global markets. China’s cumulative integrated circuit export value reached 1.49 trillion RMB in the first seven months of 2026, rising by 91.6% year-on-year. Zhixin Sensing has released an off-the-shelf large-array MEMS micromirror chip. Industry experts believe it will strongly drive the domestic development of Optical Circuit Switching (OCS). Jingya Shengsi has achieved stable mass production of self-developed 2-inch aluminum-nitride single crystals, whose quality has reached international advanced level.

International In Q1 2026, the combined revenue of the world’s top-five enterprise-grade SSD vendors reached 18.46 billion US dollars, representing a quarter-on-quarter increase of 86.1%. SEMCO will raise prices of consumer-grade X5R MLCC products for OEM and ODM customers by an average of 25%-30%. The price hike aims to moderate order intake and free up production capacity for high-end production lines. China’s SmartSens has launched the SCC85XS, an ultra-high-definition CMOS image sensor for smartphones. It delivers comprehensive performance advantages including ultra-low noise, low power consumption, high sensitivity and excellent color reproduction. NVIDIA has agreed to acquire AI platform Hugging Face for 12.9 billion US dollars. Kinghelm Electronics and Slkor Semiconductor invite you to attend the 3rd Core-Growth Forum on September 19. Sponsored by Slkor’s 3rd flagship store in Huaqiangbei, the event offers a lucky draw for smartphones for registered participants. We look forward to seeing you there! Elon Musk stated that the significance of the AI5 chip has driven him to devote substantial working hours; he has even memorized the AI5 chip design. Domestic Wang Sheng, Vice-Governor of Guangdong Province, praised the outstanding efficiency of Shenzhen Huaqiangbei’s intelligent-hardware industrial chain: design in the morning, prototyping in the afternoon, mass production the next day, and overseas shipment within one week. The 15th-Five-Year Plan for the Development of Strategic Emerging Industries in Shanghai has been released. It clarifies Shanghai’s priorities: high-end chips, AI-empowered chip design, advanced packaging, innovative devices and new-architecture chips. Shanghai Xunuo Naojí Technology Co., Ltd. has been registered and established, with Sci-Tech Board listed company Dongwei Semiconductor among its shareholders. Powertech Technology plans to kick off mass production of panel-level advanced packaging as early as early 2027, targeting server CPUs, AI computing chips and advanced optical applications. SMIC posted operating revenue of approximately RMB 38.635 billion in H1 2026, rising 19.4% year-on-year; net profit reached roughly RMB 4.467 billion, a year-on-year surge of 94.2%. Changjing Technology’s automotive-grade power device and module manufacturing project has settled in Jiangyin, Wuxi.

International OpenAI released benchmark test results of its in-house inference chip Jalapeño, demonstrating superior energy efficiency compared with NVIDIA GB300. A research team from Kyoto University has developed a new silicon carbide junction field-effect transistor that can operate stably at high temperatures up to 600℃. Infineon acquired India-based C2i Semiconductor to expand its footprint in power management for AI data centers. Kioxia of Japan will invest 6.27 billion US dollars to build a new manufacturing plant for memory chips. CPU shipments of Intel and AMD have declined for two consecutive quarters, with a year-on-year drop of over 20% in the previous quarter. According to South Korean media reports, the export price of Korean-made DRAM has soared 12-fold in three years. Its current export price per kilogram is enough to purchase 620 grams of gold. Domestic Xiaomi’s self-developed flagship processor Xuanjie O3 is the first chip to support CXMT LPDDR6 memory. According to IDC report, the market size of China’s AI fundamental data service market reached RMB 6.262 billion in 2025, and is projected to grow to RMB 7.834 billion in 2026. Slkor Semiconductor is accelerating its globalization progress with total followers exceeding 100,000 across all platforms. Its educational video Full-Bridge Rectifier released on TikTok has gained 710,000 views, greatly enhancing Slkor’s international brand exposure and professional image. Huaqin Technology posted a revenue of RMB 93.719 billion in H1 2026, with net profit attributable to parent company hitting approximately RMB 3 billion, representing a 58.8% year-on-year increase. Yunyi Electric terminated the R&D and industrialization project for semiconductor discrete devices planned back in 2022. Lion Micro intends to invest RMB 3 billion to construct a project with a monthly capacity of 200,000 pieces of 12-inch lightly-doped silicon substrates and 120,000 pieces of 12-inch silicon epitaxial wafers.

International In the first half of 2026, the contract prices of niche flash memory including NOR Flash and SLC NAND registered a cumulative increase of 100%-120% and 130%-150% respectively. The supply-demand gap remains unalleviated in the second half of the year. In H1 2026, the operating revenue of above-scale enterprises in the robotics industry reached RMB 165.5 billion, a year-on-year increase of 24.5%. Apple released the M6 and M5 Ultra processors. The M6 is a cutting-edge chip built on the 2-nanometer process. The Tiangong Omni robot from Beijing Humanoid Robot Innovation Center won the championship at the 2nd World Humanoid Robot Games with a time of 45.66 seconds. Its shy-looking running posture went viral online. On August 7, Song Shiqiang, General Manager of Kinghelm and Slkor Semiconductor, joined the live stream on LCSC Mall. Pre-event promotion gained 13,523 reads. The live stream recorded 26,046 total views, a peak concurrent audience of 3,575 and 24,880 comments. It drove sales of Kinghelm products to a peak, among which the hit product KH-IPEX-K501-29 achieved sales exceeding 200,000 units. Kinghelm’s product article Kinghelm RF Coaxial Connectors: KH-BNC50-3511, KH-SMA-K513-G and KH-SMA-KE-Z was featured on the homepage of LCSC Mall. Domestic China has more than 1.165 million enterprises related to the robotics industrial chain, with around 144,000 newly-established enterprises since 2026. Shanghai released the 15th Five-Year Plan for Accelerating New-Type Industrialization and Building a Modern Industrial System, highlighting integrated circuits, artificial intelligence and other key sectors. Phase-I of the optical chip industrialization project with a total investment of RMB 6.3 billion is located in Danzao Town, Nanhai District, Foshan City. ZT-Memory’s second-generation high-capacity new flash memory chip delivers a 2Gb per-chip storage capacity adopting the 28-nm process. Sample testing and mass-production preparation will be fully advanced soon. Yixincun (Hainan) Technology Co., Ltd., the storage chip R&D entity under YiMoon Technology, has settled in Haikou. The STAR Market IPO application of Yangtze Memory Technologies Co., Ltd. has been accepted, with a planned fundraising amount up to RMB 33 billion.

International According to Economic Daily, prices for a full range of silicon wafers including 6-inch, 8-inch and 12-inch products have been raised simultaneously, with an expected starting price increase of 10%. Nexperia China sees explosive capacity for its 12-inch wafers, shipping 17,919,236 components across all channels within 24 hours. Japan will inject an additional 150 billion yen into Rapidus to push for mass production of 2-nm chips in 2027. Samsung Display plans to invest in building the flexible OLED A7 factory, which is scheduled to start construction next year. Anthropic has hired former Google chip executive Amir Salek to co-design models and chips with the Claude team. NVIDIA raises prices of AI servers by more than 15%, mainly covering the Vera Rubin and Grace Blackwell chip platforms. The price hike will take effect in early 2027. Domestic Montage Technology’s Retimer chip has been officially included in the PCI-SIG vendor list. Qianhe Yibang’s first self-developed 4-layer 3D DRAM stacked computing-in-memory chip has returned from fabrication and been successfully powered-on. Research on Huaqiangbei Counterfeit Mobile Phones (Part II), the landmark work of Song Shiqiang, General Manager of Slkor , is about to be released. The cumulative shipment of the 8M version of ZT-Memory’s first-generation memory product has exceeded 600 million units. On August 24, Xiaomi unveiled three chips, namely Xuanjie O3, Xuanjie O100 and Xuanjie D100, targeting mobile SoC, on-device AI acceleration and intelligent driving scenarios respectively. BOE and 3M have jointly built a laboratory to tackle display technologies such as seamless flexible foldable screens. BTA12-600B is applied in power control, switching circuits and other fields.

International NVIDIA has reached a $6-billion technology licensing agreement with AI startup Poolside. Nokia plans to close nearly all its branches across Chinese mainland by the end of 2026. Google intends to end Pixel production in China in 2027. Samsung Electronics has raised prices for new orders of some advanced-process foundry wafers, with a maximum increase of 15%. On August 22, Kinghelm held its team-building event themed "Chase Dreams for a Brighter Future, Gather Happily Beneath the Flower Fields". A wide range of activities were available, including two-person off-road vehicles, CS games, Hanoi Tower puzzles, pottery DIY, karaoke, arcade games, Mongolian-style archery, mahjong, billiards and table tennis. The team also enjoyed farmhouse group dinner and rural delicacies, having a great time and boosting team vitality. Samsung Electronics and SK Hynix are competing in next-generation HBM (High-Bandwidth Memory) technology. Domestic Fibocom acquired a 37.16% equity stake in Hangsheng Electronics for 1.428 billion yuan. The antitrust review has been approved, and the restructuring is entering its final phase. JCET generated operating revenue of 19.53 billion yuan in H1 2026, a year-on-year increase of 5.0%; its net profit attributable to parent company reached 845 million yuan, surging 79.4% year-on-year. Shenzhen Kinwong Electronic Co., Ltd. plans to invest 4.388 billion yuan to build an ultra-high-layer PCB intelligent manufacturing project. Yangtze Memory Technologies Co., Ltd., a leading domestic memory manufacturer, has completed IPO coaching acceptance. Beijing Junzheng Integrated Circuit Co., Ltd. will be listed on the Hong Kong Stock Exchange on August 25, 2026. Nexperia China has launched more than 100 new products developed on the 12-inch platform, including automotive-grade SGT T2X MOSFETs and HCS high-speed logic devices. The Kinghelm team enjoys farmhouse group dinner and savors rural delicacies

International Waymo, a subsidiary of Google, announced that its self-developed custom ASIC chip has been adopted in its latest-generation robotaxis and entered mass production. ADEKA will expand production of photoacid generators (PAG) for photoresists used in advanced lithography processes including EUV lithography. Micron Technology has established Micron Research Labs and plans to invest USD 10 billion over the next decade. According to Sigmaintell data, global shipments of flexible OLED panels for smartphones reached 350 million units in the first half of the year, rising 15.6% year-on-year. STMicroelectronics will announce its third price hike of the year on August 23, covering multiple product lines. SK Hynix plans to build a memory chip manufacturing plant in Japan, with Miyagi Prefecture in northeastern Japan as a candidate location. Domestic A key semiconductor project supported by Guanggang Gas has completed nitrogen gas supply commissioning. In H1 2026, Tuojing Technology posted operating revenue of RMB 2.913 billion, an increase of RMB 959 million compared with the same period last year, representing a year-on-year growth of 49.06%. Slkor has completed the upgrade of its English-language official website. It has optimized the product category structure and multilingual content to comprehensively improve browsing experience and search efficiency for overseas users. Jingxin Microelectronics’ self-developed RapidIO 3.2 switch chip SR1820 and RapidIO 3.2-to-PCIe 4.0 protocol bridge chip ST0420 have achieved successful power-on validation. T-Head’s second-generation chip is expected to enter tape-out and production in the second half of this year. This new generation delivers powerful computing performance and high interconnection bandwidth. JCET has made breakthroughs in the R&D of high-aspect-ratio advanced TSV technology and has completed sample prototyping together with its partners.

Song Yuanming (center) from Kinghelm and Slkor leads the team to attend the Adaptive Robot Industry Chain Conference. International Broadcom plans to raise more than USD 60 billion in debt to finance an AI-chip-related financing transaction. NVIDIA’s 200G/lane co-packaged optical Ethernet switches have entered full-scale mass production. Shinko Electric Industries, a Japanese semiconductor packaging substrate manufacturer, has successfully developed a 22-layer glass-core substrate, with 11 layers of copper wiring stacked on each side of the glass core. Apple plans to complete price adjustments for the iPhone 17 series across global regions by the end of August 2026. Certain models will see a maximum price hike of nearly RMB 1,000. On August 20, the Adaptive Robot Industry Chain Conference themed "Chain-linking Flexiv · Smart Valley Symbiosis" was held at Zhongshan Fuju Yungu Digital Industrial Park. A team led by Song Yuanming from Kinghelm and Slkor attended the event. Micron Research Labs has secured USD 10 billion (approximately RMB 67.2 billion) in investment and will serve as a new research center for memory and artificial intelligence technologies. Domestic Scan the QR code and tune in at 10:30 today (August 21) for the live stream hosted jointly by Slkor and Zhuimengren, featuring Slkor’s third direct-store in Huaqiangbei. Surprises are waiting for you! On August 19, 2026, Unitree Robotics, dubbed "the first A-share humanoid-robot stock", was listed on the STAR Market. Its share price surged 629% at opening, with market capitalization once exceeding RMB 440 billion. Construction has kicked off for Dier Laser’s general-semiconductor laser-processing technology, equipment R&D and industrialization base. The total project investment stands at RMB 3 billion; completion is scheduled for 2027 and commissioning for 2028. The first unit of Huahai Qingke’s new-generation dual-table high-efficiency dicing equipment Versatile-DT300D has been officially rolled off the production line. In H1 2026, Advanced Micro-Fabrication Equipment Corporation generated operating revenue of RMB 6.691 billion, a year-on-year increase of 34.89%. Its net profit attributable to parent shareholders reached RMB 2.825 billion, soaring by 300.22% year-on-year. Yuanjie Technology plans to invest in the construction of the Yuanjie Semiconductor Science and Technology Industrial Park, with a total planned investment of around RMB 4.268 billion.