International

1. It is estimated that Google’s TPU will reach an inflection point for large-scale volume shipment in 2028, with overall shipments expected to hit 12-15 million units.
2. Leading semiconductor silicon wafer manufacturer Leangle Micro intends to launch a large-scale 12-inch high-end semiconductor silicon wafer capacity project, with a proposed total investment of RMB 3 billion.
3. The groundbreaking ceremony for SK Hynix’s advanced packaging production base for AI-oriented memory has been held.
4. NVIDIA and MediaTek have deepened their long-term partnership to jointly build an AI computing platform spanning edge devices to cloud computing.
5. Kinghelm Electronics boasts an expanded product portfolio covering RF connectors, filters & duplexers, RF adapter cables, 4G/5G antennas, Wi-Fi/Bluetooth antennas, Beidou/GPS antennas, pin headers & female sockets, wiring terminals & connectors, board-to-board sockets and pogo pins, non-standard & special-spec products, connectors for industrial, medical and automotive applications, mechanical switches, electronic switches, encoders, onboard connectors, FPC/FFC connectors, data signal connectors, optical communication accessories, Type-C connectors, audio-video connectors and more. For inquiries, please contact Ms. Yang: 15013493365.
6. Apple CEO Tim Cook has transitioned to Executive Chairman, and John Ternus, Apple’s head of hardware engineering, will take over as CEO.

Domestic

1. During the 15th Five-Year Plan period, China will strive to optimize its industrial structure and accelerate the development of six emerging pillar industries including integrated circuits, aerospace, biomedicine, low-altitude economy, new-energy storage and intelligent robots.
2. Construction has kicked off for Luxin Instruments’ global headquarters project with a total investment of RMB 2 billion.
3. The project of Shangji Semiconductor for thin-film and etching equipment R&D and manufacturing base, with total investment exceeding RMB 1 billion, has been settled.
4. ChangXin Technology reported operating revenue of RMB 150.31 billion in H1 2026, surging 873.64% year-on-year; its net profit attributable to listed shareholders reached RMB 77.605 billion.
5. TCL CSOT will phase-by-phase build manufacturing capabilities for optical communication chips.
6. Phase-II chip packaging project of Meiqing Semiconductor has started construction, and the high-end material project of Halo Semiconductor has been launched.