International

Agencies estimate that the global supply-demand gap for silicon wafers will expand from approximately 8% at the end of 2026 to 15% in 2027 and 24% in 2028.
Samsung Electro-Mechanics and Qualcomm have jointly developed organic bridge technology for 2.1D packaging to connect multiple semiconductor chips within a single package.
TDK plans to invest 40 billion yen in two Japanese factories over the next three years to expand production equipment for thin-film inductors that stabilize electric current.
Japanese chemical manufacturer Resonac has successfully developed 300mm (12-inch) silicon carbide (SiC) single crystal substrates.
Dutch firm Axelera has launched its second-generation AI chip "Europa", which can be applied to selected products from Dell and Supermicro.
Hanmi Semiconductor has signed an equipment purchase order with Elon Musk's TerraFab project to supply advanced packaging equipment for the production of AI system-on-chips.

Domestic

South Korean media reports that the localization rate of wafer fab equipment in China rose to 35% in 2025, an increase of 10 percentage points compared with 2024, and is projected to rise further in 2026.
Qizhong Technology has launched a RMB 2.454 billion advanced packaging project in Suzhou, focusing on research into heterogeneous integrated packaging of optical chips and electrical chips.
Three direct stores of Slkor (www.slkoric.com) in Huaqiangbei have begun comprehensive upgrades, with brand image and service experience to be renewed simultaneously.
The domestically developed G6 full-size inkjet printing equipment for printed displays by Guochuangke has been introduced into the mass production line of a leading panel enterprise.
Winbond Electronics plans to acquire 100% equity in Infineon's NOR Flash and F-RAM businesses for USD 1.12 billion.
Hong Kong, China released the First Five-Year Plan for the Economic and Social Development of the Hong Kong Special Administrative Region (2026–2030), which will fully advance the "AI+" initiative.

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