International

1. Choi Tae-won of SK Group stated that SK Hynix is considering joint production of memory chips with Japan’s Kioxia.
2. Samsung Display will invest a total of 67 trillion South Korean won in phases in Asan, South Korea, to build production lines for OLED and next-generation displays.
3. South Korea’s semiconductor exports reached USD 46.65 billion in August, surging by 209 % year-on-year.
4. Pollen Robotics, under Hugging Face, has launched Microduck, a miniature bipedal robot. Its sales exceeded USD 4 million within only four days.
5. A Counterpoint report indicates that driven by rising memory prices, over 40 % of mobile phones will see price hikes in 2026, with an average selling price increase of 15 %, and new models costing 25 % more year-on-year.
6. Broadcom posted USD 29.59 billion in revenue for Q3 2026, an 86 % increase from USD 15.95 billion in the same period of the previous year. Its AI semiconductor revenue hit USD 16.7 billion, rising 221 % year-on-year.

Domestic

1. Google, OPPO and vivo plan to adopt a dual-layer Ultra-Thin Glass (UTG) structure in their next-generation foldable smartphones.
2. Hua Hong Semiconductor has injected USD 2.1 billion into Phase-III of Hua Hong Wuxi, for the construction of a 12-inch specialty-process wafer foundry production line.
3. Kinghelm Electronics (www.kinghelm.com.cn) engaged all staff in the 17th National Radio Management Publicity Month. The theme for this event is: Rule-of-Law Safeguards the New Journey of the 15th Five-Year-Plan, Jointly Building a Secure Cyberspace-Electromagnetic Network!
4. Xiaomi Auto will enter the European market in 2027, with Germany as its first stop, and has signed memorandums of understanding with eight German dealers.
5. The cumulative mass-production volume of Horizon Robotics Journey intelligent-driving chips has exceeded 15 million units. More than one million Journey 6M chips have been mass-produced and installed in vehicles.
6. JCET Group plans to raise RMB 6.5 billion for capacity expansion and upgrading of its advanced packaging projects.