International

1. According to a TrendForce report, the combined revenue of the world’s top 10 wafer foundries reached nearly USD 53.49 billion in Q2 2026. SMIC registered a 20% quarter-on-quarter growth with revenue surpassing USD 3 billion, lifting its market share to 5.4% and ranking third worldwide.
2. Qualcomm and Amazon will jointly develop custom chips for next-generation large-scale AI data centers and expand high-speed optical interconnect solutions.
3. Samsung Electronics will invest 40 billion Japanese yen to establish an AI chip packaging R&D center in Yokohama, Japan.
4. Japan’s Murata plans to phase out partial product specifications across multiple series including GRM, GRJ, GRT, GXM, GXT, GCM, GCJ, GCG and ZRA.
5. ASML will start construction on a new large-scale production campus in the Netherlands to scale up mass production of extreme ultraviolet (EUV) lithography systems.
6. Google has hired the former R&D Vice President of Hailo to lead its new team in Israel, which will focus on developing AI chips for robotics and autonomous driving.

Domestic

1. Yaoxin Microelectronics has unveiled the world’s first silicon carbide super junction MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) product.
2. Beijing E-Town has issued the "AI4Chip" Action Plan for AI-Enabled Leapfrog Development of the Integrated Circuit Industry (2026–2028).
3. The Slkor (www.slkoric.com) team made an appearance in Huaqiangbei yesterday, holding a fan distribution event in unified work uniforms, which drew the attention of numerous merchants. Slkor is currently offering limited-time special prices on four models: A7, 1N4148W, FR107 and M7. New and existing customers are welcome to make inquiries.
4. SmartSens has launched SC365AT, the industry’s first automotive CMOS image sensor that integrates SerDes and on-chip ISP.
5. Haiguang Xinzheng announced that it will advance the rollout and mass production of 6.4T NPO products leveraging GlobalFoundries’ silicon photonics technology.
6. A subsidiary of Shenzhen Kaifa Technology will invest RMB 1.85 billion to expand the packaging and testing capacity of high-end memory chips.