International

1. Japan-based Socionext adopts Intel’s 18A-P foundry process technology to develop custom SoCs.
2. LG Display plans to invest 3 trillion KRW in the R&D of FLiPP, its next-generation OLED technology.
3. Black Duck announces its withdrawal from the Chinese market. It will shut down its Chinese subsidiary and lay off all local employees.
4. Marvell enters a custom AI-chip partnership with Google to co-develop Google’s in-house chips and related supporting technologies.
5. Samsung Electronics speeds up R&D on its 7-generation 10nm-class DRAM, targeting R&D completion in September and hand-over to mass-production lines in December.
6. According to a Morgan Stanley report, driven by chip supply shortages, mature-node DRAM such as DDR4 is expected to rise by 50% in Q3 2026, followed by another increase of over 10% in Q4.

Domestic

1. Ruilian New Materials has signed a cooperation agreement with TCL CSOT, officially entering the printed OLED industry.
2. Shenzhou Semiconductor’s Central China Headquarters and R&D Center settles in Wuhan Optics Valley, focusing on R&D of semiconductor RF power supplies and impedance matching units.
3. On the morning of August 20, Song Shiqiang, General Manager of Slkor , delivered a company-wide training session covering foundational knowledge of embodied-intelligence robots, including machine vision, reducer joints, motion control and self-adaptation.
4. Sources indicate that Xiaomi’s new-generation Xuanjie chip has entered terminal real-machine integration and is set for official release soon.
5. Baidu founder Robin Li states that Kunlun chips have completed R&D and commercialization across three generations of AI processors.
6. Fudan Microelectronics plans to invest RMB 17.5 million to set up a joint-venture company focused on in-house development of high-power burn-in test systems.