Global Industry News

1. ChangXin Memory Technologies currently ranks fourth in the global DRAM market, trailing Micron Technology, SK Hynix and Samsung Electronics.
2. NVIDIA officially unveiled its GB300 AI chip.
3. Yole stated that the advanced packaging market reached USD 55 billion in 2025, and is projected to expand to over USD 120 billion by 2031.
4. IDC forecasts that global AI server shipments will exceed 2 million units in 2026, representing a year-on-year surge of 55%.
5. On July 25, Slkor  held its summer team-building event at Laohugou under the theme "Uphold Integrity, Forge Ahead, Empower the Future with Chips". Team activities including tug-of-war and mountain off-road vehicles, alongside a wild picnic feast, allowed all employees to enjoy great fun and food, further boosting team cohesion and centripetal force.
6. China’s Innoscience rolled out an all-GaN 12kW 800V-to-50V HVDC power supply solution for data centers.

Domestic Industry News

1. The 2026 Fortune China 500 list was released, featuring 25 semiconductor and electronic component enterprises including SMIC, Naura Technology and TFME.
2. Xiaomi has raised its 2026 smartphone shipment target from approximately 90 million units to 110 million units.
3. Nasen Intelligent Technology (Zhejiang) Co., Ltd. passed the hearing for its IPO on the Hong Kong Stock Exchange.
4. Mass-produced complete servers equipped with LX500, a RISC-V + AI integrated chip featuring Lanxin computing power, rolled off the production line at Lenovo Lianbao Factory in Hefei.
5. Unigroup Guoxin Micro intends to designate its power semiconductor business as one of its core main business pillars.
6. Qiyuan Xinchuang, a wholly-owned subsidiary of Swancor Advanced Materials, officially signed a contract to settle in Pudong Zhangjiang Robot Valley as a key artificial intelligence project of Shanghai.