International

1. On the eve of the APEC Summit, Song Shiqiang from Slkor, Ruan Shidie from Gdome Technology, and Cheng Yimu from the Electronic Chamber of Commerce were interviewed by RTHK(RADIO TELEVISION HONG KONG）Principal Reporter LAM Hon-shan, for the feature titled "Shenzhen Boasts Vigorous High-Tech Development; Smart Glasses and Semiconductor Technologies Reach International Standards". Song Shiqiang described Huaqiang North as a cradle for startup tech enterprises, noting that the business district has undergone transformation in recent years.
2. Infineon has successfully manufactured 300mm silicon carbide wafers, boosting chip output to 2.3 times the original volume.
3. Sources indicate that Japan’s Rapidus has not yet produced the SRAM cells required for 2nm chips, putting its target of mass-producing 2nm chips by March 2028 at risk.
4. According to the Commercial Times, NVIDIA’s stock price has fallen by approximately 19% this week, with its market value plunging by 1 trillion.
5. Mitsubishi Electric plans to invest 40 billion yen to expand production capacity for optical EML chips.
6. Canon will launch the KrF lithography machine FPA-6400ES6a in early December, designed for semiconductor manufacturing applications such as memory chips and logic chips.

Domestic

1. The 2026 APEC CEO Summit is expected to attract more than 2,000 participants. Fortune Global 500 firms and renowned enterprises including Google, Boeing and Charoen Pokphand Group have applied to attend.
2. The University of Hong Kong, in collaboration with the Advanced Semiconductor and Integrated Circuit Research Centre, has successfully developed the world’s first megawatt-class ultra-wide bandgap semiconductor power module.
3. Kinghelm/Slkor (www.slkoric.com) is preparing to participate in the 2028 electronica Munich. It will send Song Yuanming, Director of the International Business Department, and Huang Dejun, Manager of the Promotion Department, to Germany for on-site study and inspection.
4. Guoxin Micro has achieved breakthroughs in its automotive electronic chip business. Its revenue in the first three quarters of 2026 reached 165 million yuan, a year-on-year increase of 106.12%, with shipments exceeding 40 million units.
5. The registered capital of Guangzhou Xmc Phase III Integrated Circuit Manufacturing Co., Ltd. has been raised from 7.5 billion yuan to 9 billion yuan, marking a 20% capital increase.
6. The fully automatic laser lift-off equipment for silicon carbide substrates independently developed by Silai Semiconductor has realized laser lift-off for 350mm silicon carbide ingots.