Slkor MB6F Bridge Rectifier: 600V Withstand Voltage, 0.5A, MB‑F Package Glass‑Passivated Surface‑Mount Bridge Rectifier

This article sorts out key parameters, product features, applicable scenarios and practical engineering points of the Slkor MB6F surface-mount bridge rectifier based on the specification document of MB05F-MB10F series. MB6F is a surface-mount bridge rectifier with MB-F package. It adopts glass-passivated die construction with low forward voltage drop and strong surge-current capability. It is suitable for single-phase rectification conversion. Derating design shall be implemented under different substrate and load conditions to ensure long-term reliability of complete equipment.

I. Core Product Parameters

1. Package: MB-F molded plastic surface-mount package. Terminals are solderable plated leads. The device weighs approximately 0.134 g and can be mounted in any position. Polarity is marked on device body. RoHS-compliant lead-free version is available.
2. Body dimensions: All units are mm. Dimension A ranges from 4.50 to 4.95, dimension B ranges from 3.60 to 4.10, dimension C ranges from 0.15 to 0.35, maximum value of dimension D is 0.20, dimension E ranges from 6.40 to 7.00, dimension G ranges from 0.50 to 1.10, dimension H ranges from 1.30 to 1.70, dimension J ranges from 1.20 to 1.60, dimension K ranges from 2.30 to 2.70, maximum value of dimension L is 1.80.
3. Basic electrical test condition: Test ambient temperature is 25℃. It adapts to single-phase 60 Hz AC input, for resistive load and inductive load. Current derating shall be applied under capacitive-load working conditions.
4. Output current corresponding to heat-dissipation substrate: Allowable output current differs between glass-epoxy PCB with 1.3 mm² solder pad and aluminum-substrate PCB with 1.3 mm² solder pad. The allowable average rectified output current decreases as ambient temperature rises.
5. Device withstand capability: It has high capability to resist peak forward surge current. Surge parameter is measured under single half-sine-wave pulse of 5.3 ms. Each leg of the device has specific forward voltage and reverse leakage-current characteristics. Junction capacitance changes with reverse voltage.
6. Flammability grade: Plastic housing meets UL94V-0 flammability standard.

II. Core Product Features

1. Glass-passivated die construction improves device reliability.
2. Low forward voltage drop reduces power loss during rectification.
3. Excellent surge-current resistance to cope with inrush current during power-on.
4. Designed for surface-mount application and fits automatic SMT soldering production.
5. Package plastic material meets UL94V-0 flammability specification.
6. Lead-free RoHS-compliant version available; mounting position is unrestricted.

III. Main Application Fields

1. Secondary rectification circuits of small-size switching power supplies for AC-to-DC conversion.
2. Internal rectifier units of adapters and chargers.
3. Power-supply rectification circuits on small household appliance control boards.
4. Input rectification for power supplies of small-size industrial control modules.
5. Internal power-supply rectification for consumer electronics and instruments.

IV. Suggestions for Engineering Design

1. Load classification: Current derating is required for capacitive-load conditions. Resistive and inductive loads can be used referring to the device current-derating curve in specification.
2. PCB pad design: Pay attention to pad area. Glass-epoxy PCB and aluminum-substrate PCB deliver different heat dissipation performance. Aluminum-substrate PCB offers better heat dissipation and supports higher output current under the same ambient temperature. Design pads referring to 1.3 mm² condition in specification.
3. Derating for temperature: Allowable average rectified current of the device drops when ambient temperature increases. Reserve sufficient current margin according to maximum ambient operating temperature and derating curve instead of continuous operation at full rated value.
4. Inrush-current consideration: Instantaneous surge current occurs at power-on. Confirm that practical inrush current never exceeds device surge-current rating to avoid damage.
5. Polarity identification: Polarity can be recognized from marks on device body. Verify polarity during SMT soldering to prevent burnout caused by reversed connection.
6. High-frequency design reference: Refer to junction-capacitance characteristics measured at 1.0 MHz and 4.0 V DC reverse voltage when junction-capacitance parameters are needed.

V. Product Summary

MB6F is a surface-mount bridge rectifier in MB-F package. With glass-passivated die technology, it features low power loss and good anti-surge performance for mass SMT assembly. This device is widely used for medium-and-low-power single-phase AC rectification. In practical engineering, derating design shall be completed according to load type, PCB substrate material and operating ambient temperature. Inrush current shall be controlled and polarity shall be verified to realize stable and reliable operation.

About Slkor：

Slkor has research and development offices in Busan, South Korea, Beijing, China, and Suzhou, China. Most of the wafer manufacturing and packaging and testing are carried out within China. The company employs and collaborates with individuals and organizations worldwide, with a laboratory for product performance and reliability testing and a central warehouse located at its headquarters in Shenzhen. Slkor has filed for over a hundred invention patents, offers more than 2,000 product models, and serves over ten thousand customers globally. Its products are exported to countries and regions including Europe, the Americas, Southeast Asia, and the Middle East, making it one of the rapidly growing semiconductor companies in recent years. With well-established management systems and streamlined workflows, Slkor has rapidly enhanced the brand awareness and reputation of its "SLKOR" brand through its outstanding quality and standardized services. Its product range includes three major series: diodes, transistors, and power devices, with recent introductions of new products such as Hall elements and analog devices, expanding its presence in sensors, Risc-v microcontrollers, and other product categories.

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