Global News

1. Market sources indicate that NVIDIA’s first batch of GB300 AI GPUs built on the Blackwell architecture has recently rolled off production lines at wafer fabs.
2. Data from Counterpoint Research shows that smartphone memory prices surged more than 80% quarter-on-quarter in Q2 2026, pushing up the BOM costs of handsets across all price tiers significantly.
3. Samsung Electro-Mechanics and Soulbrain will jointly develop key chemicals required for mass production of next-generation advanced packaging glass substrates.
4. Meta and BlackRock will invest USD 14 billion to build an El Paso data center in Texas.
5. SK Hynix plans to mass-produce and ship its new low-power mobile DRAM LPDDR6 in the second half of 2026, with Xiaomi as the first customer to adopt the product in its smartphones.
6. Japanese media reported that an earthquake hit Kumamoto Prefecture on July 28, disrupting multiple semiconductor manufacturers, and some firms have suspended operations for the time being.

Domestic News

1. Basic Semiconductor will construct a silicon carbide module packaging production base in Pingshan District, Shenzhen, with a planned investment of RMB 193.3 million.
2. Dacai Optoelectronics’ western super factory has been fully completed and is scheduled to start production on August 1.
3. Slkor and Kinghelm are carrying out refined website revamps to optimize interfaces and column categorization, delivering a clearer and smoother browsing experience for users.
4. Shenzhen Aixin Semiconductor closed a Series B+ financing round of nearly RMB 1 billion, with investors including Guoxin Fund and Shenzhen Kunpeng Capital.
5. ICNA3611, the first self-developed OLED Touch and Display Driver Integration (TDDI) chip from Chipone North, has achieved commercial mass production.
6. Suzhou Jingxi Semiconductor plans to invest RMB 630 million in an industrialization project for advanced semiconductor wafer laser stealth dicing.