International

1. According to TrendForce’s report, domestic AI chips are expected to capture nearly 90% of China’s high-end market in 2026, while combined shipments of NVIDIA, AMD and other overseas players will shrink to roughly 10%.
2. NXP Semiconductors held a groundbreaking ceremony for its new packaging and testing plant in Malaysia. Mass production at the new facility is scheduled to kick off in Q1 2028.
3. Intel plans to re-enter the memory market. The company is researching innovative memory architectures as well as 3D stacking solutions for CPUs and memory.
4. Ajinomoto of Japan cuts its supply of ABF films to customers in Chinese mainland by 30%.
5. Samsung Electronics adopts AI coding tool Claude Code to boost design and verification efficiency. The verification cycle for certain chips has been shortened from one month to two days.
6. The project of TGG Semiconductor’s R&D and manufacturing headquarters for high-end equipment from Japan has signed to settle in Wuxi.

Domestic

1. Synopsys announced the completion of verification for the world’s first HBM4 IP test chip.
2. SMIC posted revenue of USD 3.006 billion in Q2 2026, rising 20% quarter-on-quarter. This marks its first time exceeding USD 3 billion in quarterly revenue.
3. Slkor Semiconductor opens its third direct store at Booth N1A001-002, Phase 2, New Asia Electronic City, Huaqiangbei. The grand opening ceremony will be held at 14:00 this afternoon (August 14). All friends, new and existing customers are warmly invited to attend and witness the event!
4. ChangXin Technology reaches a market capitalization of CNY 3.54 trillion, surpassing Tencent’s CNY 3.45 trillion to become China’s most valuable listed company.
5. HONOR unveils its first embodied intelligent robot phone, the ROBOT PHONE.
6. Yuanjie Technology plans to invest CNY 4.3 billion to build an industrialization base in Shaanxi Province, consisting of laser chip production lines, manufacturing workshops and supporting facilities.