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China's RISC-V main control chip market is expected to exceed 200 billion yuan by 2030
2026-10-19 139
Slkor BC817-40 can meet the application requirements of high frequency and high gain.

International

1. South Korea's LX Semicon has put more than 60 patents covering SiC devices and epitaxial wafers up for sale.
2. NVIDIA denied the discontinuation of the RTX 5090 graphics card, stating that official supplies will remain available.
3. Samsung Electronics and SK Hynix jointly unveiled the 7th-generation high-bandwidth memory "HBM4E".
4. IDC data shows that global smartphone shipments fell by 22% in the third quarter of 2026 due to rising memory costs.
5. Applied Materials plans to invest 5 billion US dollars to build the EPIC R&D center, with Intel, Samsung Electronics, Micron and SK Hynix among the founding partners.
6. Japan has approved JASM's plan to convert its second wafer fab to produce 3nm chips. The plant is set for a monthly capacity of 6,000 wafers and is expected to be completed and start production in December 2028.

Domestic

1. Jiangyin Zhongde Electronics has successfully developed high-end chromium etching solution. Its pioneering "self-purification" technology fills the domestic gap.
2. According to Frost & Sullivan data, China's RISC-V main control chip market grew from approximately 1.1 billion yuan in 2021 to about 37.7 billion yuan in 2025, and is projected to reach around 219.4 billion yuan by 2030.
3. Slkor (www.slkoric.com), led by technical experts from Tsinghua University and Yonsei University, focuses on silicon carbide power devices. It has developed into an integrated enterprise covering design, R&D, manufacturing and sales. The international influence of the "Slkor" brand keeps growing, serving tens of thousands of customers worldwide.
4. Pengcheng Laboratory recently released a series of technological achievements including the "Super Optical Direct Connection System and Optical Chips" in Shenzhen, and announced the official launch of the domestic optical chip process platform "Hetao Line".
5. Li Auto's chip subsidiary secured 1.625 billion yuan in financing, with a maximum valuation of 17.1 billion yuan.
6. Another breakthrough has been achieved in China's advanced packaging sector! The 16-layer glass-stacked GCP from Boking has officially rolled off the production line and entered operation.
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