SK Hynix and SanDisk jointly release the first standard specification for HBF

International

1. Data released by DRAMeXchange shows that memory chip prices hit a new high in July, with a further 20-percent increase expected in Q3.
2. Samsung Electronics unveiled its zHBM technology and the V10 BV-NAND prototype chip.
3. The European Union plans to invest 11.4 billion US dollars to build seven AI mega-factories.
4. Doosan Group acquired a 70.61 % stake in SK Siltron for 2.3 trillion South Korean won.
5. VSMC, the Singapore-based subsidiary of Vanguard International Semiconductor Corporation, has completed process qualification for its first 12-inch wafer fab, with mass production scheduled for Q1 2027.
6. SK Hynix, together with SanDisk, released the first-edition standard specification for HBF (High-Bandwidth Flash) at the FMS 2026 Flash Memory Summit.

Domestic

1. Official estimates indicate that as of June 2026, China has more than 6,600 artificial-intelligence enterprises, accounting for 15 % of the global total.
2. China has issued the revised Regulations on the Protection of Integrated Circuit Layout-Designs, which will take effect officially on October 15, 2026.
3. Song Shiqiang, General Manager of Kinghelm / Slkor , was invited to attend the IPO appreciation dinner of JLC Group held at Shenzhen Futian Convention & Exhibition Center. He expressed the hope that JLC will deliver more comprehensive, faster and high-quality supporting services for more hardware-oriented tech-innovation enterprises.
4. A joint research team from Peking University and the Chinese Academy of Sciences has developed the first millisecond-scale neurodynamics chip, achieving a single-step computation latency of merely 2.12 milliseconds.
5. The 8.5-generation high-precision mask substrate (1220 × 1400 mm) independently developed by Puzhao Materials has rolled off the production line.
6. Reports state that amid memory shortages, PC manufacturers including HP, ASUS and Acer have begun small-volume adoption of chips from CXMT.