International

1. Intel is prioritizing the supply of server CPUs and shifting part of its production capacity in Oregon from the 18A process to the Intel 3 process.
2. Infineon has launched AURIX RC1, its first automotive MCU platform built on the RISC-V architecture.
3. Reports state that Apple is developing high-mobility oxide technology for next-generation OLED panels.
4. Aisin of Japan has developed a new AI chip with a 98% reduction in power consumption.
5. Prices of DDR5 memory in Japan have skyrocketed. The Corsair DDR5-6000 128GB kit (64GB×2), for instance, has jumped from 59,800 yen to 514,800 yen, marking a 760.9% increase in one year.
6. Vietnam, together with Viettel, has released the country’s first domestically designed secure semiconductor platform, along with the 28-nanometer secure chip VGC v1.0 based on the RISC-V architecture.

Domestic

1. On November 2, Kang Hui appeared in Huaqiang North, Shenzhen, to shoot a promotional video in preparation for the APEC meeting.
2. Meta and China’s Fourier Intelligence have jointly developed the Max humanoid robot prototype, and kicked off the development of the second-generation prototype Max 2 in September this year.
3. On the morning of November 4, Song Shiqiang, General Manager of Slkor (www.slkoric.com), chaired an all-staff meeting to fully advance the standardization and streamlining of product technical documents and archives.
4. Xingu Equity Investment, under Changxin Technology, has increased its registered capital from approximately RMB 6.38 billion to around RMB 7.88 billion.
5. On November 4, the Wuhan-Ezhou Optics Valley Pan-Semiconductor Industrial Park Investment Promotion Conference saw the establishment of the Wuhan Pan-Semiconductor Industry Investment Fund with a total size of RMB 1 billion.
6. Lingchuan Technology’s AI video chip adopting fully domestic 3D stacking technology has returned from fabrication, and mass shipment is expected in 2027.