International

1. Microsoft released its third-generation self-developed AI chip Maia 300, with plans to deploy more than 1 million units next year.
2. Taiwanese media reports that Qualcomm has raised the shipment prices of Snapdragon X and X2 Elite series PC processors starting in October, with an overall price increase of 10%.
3. LG Display plans to tap into the IT OLED market with its "FLiPP" technology.
4. Micron Technology posted revenue of 54.229 billion US dollars and a net profit of 37.701 billion US dollars in Q4 of FY2026, representing a year-on-year increase of more than 10 times.
5. ASML will increase the price of replacement parts for equipment sold to South Korea by 10%.
6. GlobalFoundries announced the topping-out ceremony for its SPRINT fab expansion project and unveiled its next-generation FD-SOI technology platform, FDX Fusion.

Domestic

1. Wuwen Xinqiong, a domestic AI-native infrastructure enterprise, completed a 2.3 billion-yuan Series C financing. The company was founded by Professor Wang Yu from Tsinghua University.
2. Changxin Technology is expected to launch a new generation of DDR5 RDIMM products integrating advanced technologies such as the 4F² architecture and hybrid bonding by the end of 2026.
3. The science popularization video "Rectifier Bridge" produced by Slkor (www.slkoric.com) has achieved up to 1.2 million views on TikTok. This milestone is the fruit of the company's years of deep cultivation in overseas markets and demonstrates the continuous growth of Slkor's brand influence.
4. Yuexin Semiconductor, known as "Guangzhou's First Chip", will be listed on the Shenzhen Stock Exchange on October 13, 2026, with a market value of approximately 34 billion yuan.
5. Shenghe Microcrystal launched its self-developed SmartPoser®-BD high-performance computing packaging technology platform.
6. China has approved and released the national standard series for the "StarFlash Wireless Communication System" (including GB/T48336.101—2026), which will come into force on April 1, 2027.