Description

Features

1. Rated reverse working voltage: 12V, matched with 12V signal and power supply circuits
2. Ultra-low typical junction capacitance of 0.6pF, no high-speed signal distortion
3. Nanoampere-level ultra-low reverse leakage current to reduce standby power loss
4. Outstanding ESD protection capacity: ±30kV air discharge & ±30kV contact discharge (IEC 61000-4-2)
5. Lightning surge resistance: 15A peak current under 8/20μs waveform (IEC 61000-4-5)
6. EFT anti-interference capability up to 40A (IEC 61000-4-4, 5/50ns pulse)
7. High peak pulse power rating of 450W (8/20μs waveform)
8. Bidirectional design to suppress both positive and negative voltage transients
9. Ultra-fast response time within nanosecond range to instantly dissipate surge energy
10. Tiny lead-free SOD-323 plastic package saves PCB layout space significantly
11. Wide operating junction temperature range: -40℃ ~ +125℃
12. RoHS compliant lead-free molding compound for global green electronics standards

Our advantages

1. Ultra-small SOD-323 mini outline perfectly fits slim smartphones and miniature wireless modules
2. Extra-low capacitance characteristic maintains integrity of Gigabit Ethernet and high-speed differential signals
3. Industry-leading ±30kV ESD withstand level passes strict consumer and industrial EMC tests
4. Bidirectional single-device design replaces two unidirectional TVS diodes, simplifying BOM and PCB routing
5. Nanoampere leakage minimizes static power consumption, ideal for battery-powered portable devices
6. High surge current rating of 15A handles lightning transient interference of communication ports
7. Stable clamping voltage under different surge current ensures reliable chip protection
8. Lead-free, flame-retardant plastic package complies with international environmental regulations
9. Wide temperature adaptability guarantees stable performance in indoor and mild outdoor scenarios
10. Standard tape & reel packaging compatible with all automatic high-speed SMT assembly lines

Mechanical Data

1. Package Type: Lead-free SOD-323 molded plastic surface-mount package
2. Outline Size: Standard SOD-323 dimensions (unit: mm) as defined in datasheet
3. Soldering Limit: Maximum lead temperature 260℃ within 10 seconds
4. Operating Junction Temperature: -40℃ ~ +125℃
5. Storage Temperature Range: -55℃ ~ +150℃
6. Encapsulation Material: RoHS compliant flame retardant plastic compound
7. Reflow soldering parameters follow standard lead-free assembly curve

Applications

• All kinds of high-speed digital data transmission lines
• Smartphones and wearable portable electronics
• USB signal and power interface ports
• Wireless communication modules and RF circuits
• 10/100/1000 Base-T Gigabit Ethernet ports
• Bluetooth, Wi-Fi wireless equipment signal lines
• Handheld measuring instruments and low-voltage control boards
• Consumer electronic high-speed signal input terminals